00195982-03_SM_SWS_EN.pdf - 第140页

7 Die ejector 7.3 Replacing spare parts 140 Service Manual SIPLACE Wafer System (SWS) 11/2018 Fig.169: ► To make sure that the dual light barrier is fitted in the correct position on the assembly bracket, loosen the two…

7 Die ejector

7.3 Replacing spare parts

Service Manual SIPLACE Wafer System (SWS) 11/2018 139

Fig.167:

► Position the Z axis die ejector on the support plate, with its two pins in the corresponding

holes of the support plate(9).

Fig.168:

► Press the Z axis die ejector against the carrier and tighten the four fastening screws(10) an.

► If not already done, now remove the fork light barrier from the Z axis die ejector.

7 Die ejector

7.3 Replacing spare parts

140 Service Manual SIPLACE Wafer System (SWS) 11/2018

Fig.169:

► To make sure that the dual light barrier is fitted in the correct position on the assembly

bracket, loosen the two fastening screws.

► Press the board against the edges (red in the diagram) and tighten the screws.

Fig.170:

► Connect the cable to the board (observe the connector orientation).

7 Die ejector

7.3 Replacing spare parts

Service Manual SIPLACE Wafer System (SWS) 11/2018 141

Fig.171:

► Press the fork light barrier "into the corner" (downwards and forwards) and screw into

place(12).

NOTICE

► Make sure that the switch flag of the Z axis die ejector(13) is between the fork light

barriers(14).

Fig.172:

► Connect the vacuum hose(15).