00195982-03_SM_SWS_EN.pdf - 第6页
6 Service Manual SIPLACE Wafer System (SWS) 11/2018 8.4.4.1 Correction in X direction (segment 1) .. 186 8.4.4.2 Correction in Y direction (segment 1) .. 187 8.4.4.3 Correction in X direction (segment 2) .. 188 8.4…
5Service Manual SIPLACE Wafer System (SWS) 11/2018
6.3 Settings.. 116
6.3.1 Setting the compressed air monitor.. 116
6.3.2 Creating connection voltages at the mains transformer.. 116
7 Die ejector.. 119
7.1 Overview of main assemblies.. 119
7.2 Overview of spare parts.. 120
7.3 Replacing spare parts.. 121
7.3.1 Preparatory tasks.. 121
7.3.2 Removing the complete die ejector unit from the SWS.. 122
7.3.3 Removing the Z axis from the die ejector.. 129
7.3.4 Fitting the Z axis on the die ejector.. 135
7.3.5 Fitting the complete die ejector unit into the SWS.. 142
7.4 Mechanical adjustment of the needle position in the X/Y position.. 147
7.4.1 Goal for mechanical adjustment of needle position in X/Y direction.. 147
7.4.1.1 Explanation of the coordinate system.. 148
7.4.1.2 Preparatory tasks.. 149
7.4.2 Adjusting the needle in the X/Y position.. 152
7.5 Mechanical adjustment of the die ejector unit in the Z direction (focus).. 155
7.5.1 Replacing the needle ejection system needles.. 155
7.5.1.1 Preparatory tasks.. 156
7.5.1.2 Setting the needles with the calibration standard [03098221-xx] (for die ejector, magnetic).. 158
7.5.1.3 Setting the needles with the calibration standard [03080191-xx].. 159
7.5.1.4 Checking the needle ejection unit for air-tightness.. 160
7.5.1.5 Replacing the sealing unit and the O-ring on the die ejector centering unit.. 162
7.5.2 Replacing the vacuum on the die ejector.. 165
7.5.3 Solenoid valve for moving the Z axis up and down.. 165
7.5.3.1 Replacing the proximity switch.. 166
7.5.4 Replacing the fork light barrier on the ejection system.. 167
7.6 Converting the bayonet needle ejector unit (old version) to the magnetic needle
ejector unit (current version)..
168
7.6.1 Preparatory measures.. 168
7.6.2 Removing the bayonet needle ejector unit... 168
7.6.3 Fitting the needle ejector unit magnetic table.. 171
8 Flip unit.. 173
8.1 Overview of main assemblies.. 173
8.2 Overview of spare parts.. 174
8.3 Replacing spare parts.. 178
8.3.1 Replacing the flip unit.. 178
8.3.1.1 Calibrating the home position for segment 1.. 178
8.3.1.2 Calibrating the hollow shaft motor.. 178
8.3.2 Replacing the suction plate.. 178
8.3.3 Replacing the pneumatic return unit.. 179
8.3.4 Removing the wafer camera on the flip unit.. 180
8.3.4.1 Replacing the bright field illumination board.. 181
8.3.4.2 Replacing the dark field illumination board.. 182
8.4 Calibration – flip unit.. 183
8.4.1 Tools and equipment required.. 183
8.4.2 Preparation.. 183
8.4.3 Setting the segment offsets.. 184
8.4.4 Correcting the segment offsets.. 185
6 Service Manual SIPLACE Wafer System (SWS) 11/2018
8.4.4.1 Correction in X direction (segment 1).. 186
8.4.4.2 Correction in Y direction (segment 1).. 187
8.4.4.3 Correction in X direction (segment 2).. 188
8.4.4.4 Correction in Y direction (segment 1).. 189
8.4.5 Overview of offset correction in X and Y direction.. 190
9 Wafer change system.. 191
9.1 Magazine lift.. 192
9.1.1 Replacing spare parts.. 192
9.1.1.1 Preparations.. 192
9.1.1.2 Replacing the motor.. 193
9.1.1.3 Replacing the proximity switch.. 194
9.1.1.4 Crash sensor and slot query.. 195
9.1.1.5 Switch for checking whether a cassette is present.. 196
9.1.1.6 Cover switch.. 197
9.1.1.7 Door switch.. 198
9.1.1.8 Wafer lift - replacing the recirculating ball screw.. 199
9.1.2 Electrical system.. 200
9.2 Gripper.. 201
9.2.1 Overview of main assemblies.. 201
9.2.2 Overview of spare parts.. 202
9.2.3 Replacing spare parts.. 204
9.2.3.1 Requirements/preparations.. 204
9.2.3.2 Tools.. 204
9.2.4 Replacing the proximity switch on the toothed belt axis.. 204
9.2.4.1 Setting the position of the proximity switch.. 206
9.2.5 Replacing the motor with coupling for wafer handling.. 207
9.2.6 Replacing the solenoid valves.. 208
9.2.6.1 Setting gentle clamping and moving of the gripper (for location 2/4).. 209
9.2.6.2 Setting gentle clamping and moving of the gripper (for location 1/3).. 209
9.2.7 Dismantling the gripper for location 1/3.. 210
9.2.8 Dismantling the gripper for location 2/4.. 211
9.2.9 Replacing the toothed belt axis.. 212
9.2.9.1 Aligning the height of the toothed belt axis on the lift.. 213
9.2.9.2 Aligning the height of the toothed belt axis at the changer.. 213
9.2.10 Replace the wafer changer completely.. 214
10 Option Die Attach Unit SWS.. 215
10.1 Installing the Option Die Attach Unit SWS.. 215
10.1.1 Description of the Die Attach Unit SWS.. 215
10.1.2 Initial situation.. 216
10.1.3 Installing the Option Die Attach Unit in SWS.. 219
10.1.4 Mechanical alignment of the Die Attach segment – flip head segment 1.. 231
10.1.4.1 Alignment in y direction.. 232
10.1.4.2 Alignment in Z direction.. 233
10.1.4.3 Mechanical adjustment of the Transfer-x axis holding cylinder.. 234
10.1.4.4 Storing the cables.. 236
10.1.5 Calibration of the Die Attach Module.. 238
10.1.5.1 Calibration of the Die Attach Rotation Axis.. 238
10.1.5.2 Calibration of the Die Attach Transfer X Axis.. 242
10.2 Dissambling Die-Attach-Unit SWS.. 243
7Service Manual SIPLACE Wafer System (SWS) 11/2018
11 Extension groups.. 255
11.1 Wafer supports.. 255
11.1.1 Overview.. 255
11.1.2 Overview of spare parts.. 256
11.1.3 Replacing spare parts.. 257
11.1.3.1 Replacing the complete wafer support.. 257
11.1.3.2 Turning the wafer locking strip by 180 degrees (option for 8" wafer support).. 258
11.1.3.3 Setting the wafer support width.. 259
11.1.3.4 Replacing the driver on the clamp.. 259
11.1.3.5 Replacing the solenoid valve for the clamp.. 260
11.1.3.6 Replacing the clamp assemblies.. 261
11.1.3.7 Replacing the diffuse mode sensor.. 262
11.1.3.8 Calibrating the wafer support.. 262
11.1.3.9 Replacing the screw-in cylinder for the downholder.. 263
11.2 Linear dipping unit (LDU).. 264
12 Wafer stretcher.. 265
12.1 Explanation of the wafer stretcher.. 265
12.1.1 SIPLACE SWS wafer stretcher.. 265
12.1.2 Safety instructions.. 266
12.1.3 Technical data.. 266
12.1.4 Placement accuracy and performance values.. 267
12.1.5 Description.. 267
12.2 Detailed description of "wafer stretching" procedure.. 270
12.3 Preparatory measures for working on the wafer stretcher.. 278
12.4 Removing the wafer stretcher.. 279
12.4.1 Preparing removal of the wafer stretcher.. 279
12.4.2 Dismantling the cover plate and the downholder plates.. 279
12.4.3 Removal on the clamping and lifting cylinder side.. 284
12.4.4 Removal at the wafer changer side.. 288
12.5 Overview of wafer stretcher parts.. 293
12.6 Fitting the wafer stretcher.. 293
12.6.1 Preparations for fitting the wafer stretcher.. 293
12.6.2 Fitting the wafer stretcher to the guide trolley.. 294
12.6.3 Fitting the connections.. 299
12.6.4 Fitting the cover plate and the downholder plates.. 302
12.7 Wafer stretcher - configuration changes.. 305
12.7.1 Mechanically setting the stretch factor.. 305
12.7.1.1 Preparations.. 305
12.7.1.2 Settings.. 306
12.7.2 Setting the frame width for 8" wafer supports.. 307
12.7.2.1 Preparations.. 307
12.7.2.2 Settings.. 308
12.7.3 Converting wafer supports from 8" wafer stretchers to 12" wafer stretchers.. 309
12.7.3.1 Retrofit kit parts: 12" wafer expander.. 309
12.7.3.2 Preparations.. 310
12.7.3.3 Removing the 8" wafer support.. 311
12.7.3.4 Difference when converting the 12" to the 8".. 319
12.8 Setting the sag sensor IN 19.. 320
12.8.1 General information about the sag sensor.. 320
12.8.1.1 Sag sensor assembly structure.. 320
12.8.1.2 Sag sensor assembly function.. 321
12.8.1.3 Explanation of light intensity in connection with foil sag.. 322