00195982-03_SM_SWS_EN.pdf - 第383页
15 Calibration 15.3 Calibration die handling - flip unit Service Manual SIPLACE Wafer System (SWS) 11/2018 383 Fig.554: ► Choose Stamp mark for segment 1 (1) . ► Segment 1 moves down and leaves a visible imprint on the …
15 Calibration
15.3 Calibration die handling - flip unit
382 Service Manual SIPLACE Wafer System (SWS) 11/2018
Fig.552:
► For this, choose Service in the bottom menu bar and then Die handling calibration.
► Choose Segments offset calibration.
► Here, the offset values entered in the machine data are displayed (0µm in the example).
Fig.553:
► Activate the vacuum at the ejector to keep the Teflon tape in position.
15 Calibration
15.3 Calibration die handling - flip unit
Service Manual SIPLACE Wafer System (SWS) 11/2018 383
Fig.554:
► Choose Stamp mark for segment 1 (1).
► Segment 1 moves down and leaves a visible imprint on the Teflon tape.
In the example, it is exactly over the red cross (center) of the camera, therefore the nozzle
center is exactly over the die ejector needle.
► In this case, there is an offset between the stamp mark and the red cross.
You have to shift in X direction (2).
► Insert an offset (3).
(1 cm on the screen = 500µm offset)
At the end of this chapter, you find a table with offset directions.
It is not possible to adjust an offset in Y direction (4) using the software (see the information at
the beginning of this section).
Fig.555:
► Move the Teflon tape by some millimeters.
→ The vacuum is still activated!
15 Calibration
15.3 Calibration die handling - flip unit
384 Service Manual SIPLACE Wafer System (SWS) 11/2018
Fig.556:
► You can see the stamp mark for segment1(1), after moving the Teflon tape by hand.
► Choose Stamp mark for segment 2.
► Segment 2 moves down and leaves a visible imprint on the Teflon tape.
In the example, it is exactly over the red cross (center) of the camera, therefore the nozzle
center is exactly over the die ejector needle.
► In this case, there is an offset between the stamp mark and the red cross, you have to shift in
X direction (3).
► Insert an offset (4).
(1 cm on the screen = 500µm offset)
At the end of this chapter, you find a table with offset directions.
It is not possible to adjust an offset in Y direction (5) using the software (see the information at
the beginning of this section).
► Deactivate (switch off) the vacuum at the die ejector unit.
► Take off the Teflon tape from die ejector.
► Move the die ejector down using the software!
Software correction of the X offset by entry in GUI
Segment Shifting the nozzle imprint Correction value in the software
1 Shifting to the right (x) Entering a negative value
Shifting to the left (x) Entering a positive value
2 Shifting to the right (x) Entering a negative value
Shifting to the left (x) Entering a positive value