00195982-03_SM_SWS_EN.pdf - 第472页
17 Tips and tricks 17.1 Moving the Z axis for die ejector downwards in the switched off and removed SWS 472 Service Manual SIPLACE Wafer System (SWS) 11/2018 Procedure for lowering Fig.739: ► Search the die ejector pneu…
17 Tips and tricks
17.1 Moving the Z axis for die ejector downwards in the switched off and removed SWS
Service Manual SIPLACE Wafer System (SWS) 11/2018 471
17 Tips and tricks
17.1 Moving the Z axis for die ejector downwards in the
switched off and removed SWS
If the Z axis of the die ejector is still in the top position after the SWS has been switched off and re-
moved, you can move this axis to the down position as follows:
Fig.738:
1. Die ejector in top position
2. Base plate
3. Pneumatic connection for die ejector
17 Tips and tricks
17.1 Moving the Z axis for die ejector downwards in the switched off and removed SWS
472 Service Manual SIPLACE Wafer System (SWS) 11/2018
Procedure for lowering
Fig.739:
► Search the die ejector pneumatic unit (3) for the "lifting cylinder infeed" (4)hose.
17 Tips and tricks
17.1 Moving the Z axis for die ejector downwards in the switched off and removed SWS
Service Manual SIPLACE Wafer System (SWS) 11/2018 473
Fig.740:
► After disconnecting the "lifting cylinder infeed" hose (5), you can slowly lower the Z axis.
Either it will move smoothly down to the bottom position by itself or you will need to press it
gently down yourself (as far as the stopper).
► If this is not the case, the hoses may have been mixed up. In this case, try the other hose on
the pneumatic connection (6).