00195982-03_SM_SWS_EN.pdf - 第160页

7 Die ejector 7.5 Mechanical adjustment of the die ejector unit in the Z direction (focus) 160 Service Manual SIPLACE Wafer System (SWS) 11/2018 7.5.1.4 Checking the needle ejection unit for air-tightness ► In the toolba…

7 Die ejector

7.5 Mechanical adjustment of the die ejector unit in the Z direction (focus)

Service Manual SIPLACE Wafer System (SWS) 11/2018 159

7.5.1.3 Setting the needles with the calibration standard [03080191-xx]

Tools

●

Needles as wear part

●

Calibration standard for die ejector with bayonet fastening [03080191-xx]

The needles are all set at a defined height and common level with the help of the calibration

standard for the die ejector.

Fig.203: Calibration standard for die ejector with bayonet fastening [03080191-xx]

Procedure

► Remove the black cap on the needle unit.

► Carefully insert all needles into the segments and align the needles roughly in one line.

► Loosely tighten the grub screws. You must still be able to move the needles.

Fig.204: Calibration standard for die ejector

► Place the needle unit into the calibration standard for the die ejector (1).

► Place the ejection part into the device. The central bolt of this device must be against the ejec-

tion plunger and the bronze part must be flexibly against the radius nib.

► Turn the ejection part (bronze) into the required position.

► Press the bronze part slightly down into the prisms of the device.

► Push the ejection needles into the required holes (the threaded pin must be released).

► Move the spring-back adjusting slide in the direction of the stop bolt and hold it in place.

► Push the ejection needles in the direction of the setting surface (use tweezers) and pull the

ejection needle tightly into place with the threaded pins (torque 10Nm).

7 Die ejector

7.5 Mechanical adjustment of the die ejector unit in the Z direction (focus)

160 Service Manual SIPLACE Wafer System (SWS) 11/2018

7.5.1.4 Checking the needle ejection unit for air-tightness

► In the toolbar, select the button Service Settings => Main vacuum control system (see

14.1 "SWS GUI - service settings" [}357]).

► The Main vacuum should be between 740 and 840 mbar.

► Place a piece of foil onto the ejection system, so that all openings are closed.

► Now switch on the vacuum at the die ejector.

► Enable Vacuum valve ejection unit opened.

ð Suction will be applied to the foil by the ejection system.

ð The Main vacuum should reach the value previously shown, if possible (i.e. no losses).

Troubleshooting in the event of leakages

► Switch the vacuum on at the die ejector (software) and check the suction force at the sealing

lip with your finger(2).

► Check whether the vacuum inlet cable is free of bends/folds.

Fig.205:

► Perform a sight check of the sealing lip (2) for possible damage and replace, if necessary (see

7.5.1.5 "Replacing the sealing unit and the O-ring on the die ejector centering unit" [}162]).

► Check the magnets (3) for foreign bodies.

7 Die ejector

7.5 Mechanical adjustment of the die ejector unit in the Z direction (focus)

Service Manual SIPLACE Wafer System (SWS) 11/2018 161

Fig.206:

► Check the black cap. This must be seated fully on the base unit of the ejection system.

(4) Gap → vacuum leakage → bad

(5) No gap → good

Fig.207:

► Check the polished sealing surface and the ejection system vacuum hole(1) for damage or

dirt.