00195982-03_SM_SWS_EN.pdf - 第230页

10 Option Die Attach Unit SWS 10.1 Installing the Option Die Attach Unit SWS 230 Service Manual SIPLACE Wafer System (SWS) 11/2018 Fig.304: Cable routing in the SWS at locations 2 and 4. ► Tighten the safety screws of t…

10 Option Die Attach Unit SWS

10.1 Installing the Option Die Attach Unit SWS

Service Manual SIPLACE Wafer System (SWS) 11/2018 229

Fig.302:

► Connect the cables of the Die Attach Unit according to the figures.

1. Power and encoder cable for the transfer X motor

2. Power and encoder cable for the Die Attach segment rotation axis!

NOTICE

In the latest SWS version, the housing of the encoder cable is rotated by 180° to ensure a

correct connection. If there are problems with the entry of the cable, simply open the hous-

ing and rotate it by 180°. The orientation of the RS232-connector itself remains in the ori-

ginal position.

Fig.303:

1. Power cable for transfer X motor (MOT-2)

2. Encoder cable for transfer X motor (ENCH2)

3. Encoder cable for Die Attach segment (ENCH1)

4. Power cable for Die Attach segment (MOT-1)

10 Option Die Attach Unit SWS

10.1 Installing the Option Die Attach Unit SWS

230 Service Manual SIPLACE Wafer System (SWS) 11/2018

Fig.304: Cable routing in the SWS at locations 2 and 4.

► Tighten the safety screws of the encoder cables (ENC-DA).

► Align the cables according to the figure and secure these with cable ties.

10 Option Die Attach Unit SWS

10.1 Installing the Option Die Attach Unit SWS

Service Manual SIPLACE Wafer System (SWS) 11/2018 231

10.1.4 Mechanical alignment of the Die Attach segment – flip head segment 1

► At the Die Attach segment and the flip head segment 1, insert nozzles with a sharp tip (e.g.

nozzle 906).

► To align the Die Attach and flip head segment, in the GUI, select the Process view.

► Load a wafer on the table.

Fig.305:

► Choose the Die handling parameters menu.

Fig.306:

► Move segment 1 close to the transfer position with the arrow buttons and the appropriate step

increment.