00195982-03_SM_SWS_EN.pdf - 第137页

7 Die ejector 7.3 Replacing spare parts Service Manual SIPLACE Wafer System (SWS) 11/2018 137 Fig.163: Fig.164: ► Fit the board cover.

7 Die ejector

7.3 Replacing spare parts

136 Service Manual SIPLACE Wafer System (SWS) 11/2018

Fig.162:

► Connect all cables (small screwdriver).

► Connect the encoder signal (ENC).

Wiring overview for motor connection

Cable, white (WH) U

Cable, black (BK) V

Cable, red (RD) W

Wiring overview of Hall sensor connection (detection of rotary position for direction

of movement)

Cable, blue (BU) +5 V

Cable, orange (OR) HA

Cable, brown (BN) HB

Cable, yellow (YE) HC

Cable, green (GN) GND

Wiring overview for encoder signal

Gray flat ribbon cable BU10-ST10 ENCO

7 Die ejector

7.3 Replacing spare parts

Service Manual SIPLACE Wafer System (SWS) 11/2018 137

Fig.163:

Fig.164:

► Fit the board cover.

7 Die ejector

7.3 Replacing spare parts

138 Service Manual SIPLACE Wafer System (SWS) 11/2018

Fig.165:

► All loss prevention locks [03075495-xx](6) must be in the Flachbohrungen.

In order to fix the loss prevention locks into place, you can apply a little Vaseline or similar

grease to the shallow holes(7).

► The thread of the loss prevention locks must be on the inside (towards the shallow hole)(8).

This is the only way to ensure that the screws have approx. 2mm secure hold.

Fig.166:

It is possible that the screws may still be in the loss prevention lock after dismantling.

► Tighten all screws so that they are level with the assembly surface (see diagram).