00195982-03_SM_SWS_EN.pdf - 第56页
3 SIPLACE wafer system (SWS) function 3.3 Pick and transfer process in detail 56 Service Manual SIPLACE Wafer System (SWS) 11/2018 3.3.4 Flip chip encoded positions (after calibration) Fig.36: Flip chip encoded position…
3 SIPLACE wafer system (SWS) function
3.3 Pick and transfer process in detail
Service Manual SIPLACE Wafer System (SWS) 11/2018 55
3.3.3 Die attach – transfer position
Fig.35: Die attach – transfer position
●
The die attach rotates to the transfer position.
●
The placement head picks the chip up from the die attach segment and rotates to the next
star position.
●
At the same time the X axis pulls segment no. 1 back into the home position.
●
The flip chip unit - segment no. 1 rotates to the pickup position and picks up the next chip.
NOTICE
While using the die attach unit, only the segment no.1 of the flip chip unit is active.
3 SIPLACE wafer system (SWS) function
3.3 Pick and transfer process in detail
56 Service Manual SIPLACE Wafer System (SWS) 11/2018
3.3.4 Flip chip encoded positions (after calibration)
Fig.36: Flip chip encoded positions (after calibration)
0° Home sensor position"
180° Pickup position, segment 1
125° Camera "free position"
96° Discharge position, segment 1
90° Home offset position
83° Discharge position, segment 2
58° Camera "free position"
3 SIPLACE wafer system (SWS) function
3.3 Pick and transfer process in detail
Service Manual SIPLACE Wafer System (SWS) 11/2018 57
1. Mechanical stopper
2. Home sensor
Reject bin segment
no. 2
Reject bin segment
no. 1
Fig.37: Initialization of flip rotation axis
1. Mechanical stop
2. Home sensor
The home sensor is used to initialize the flip rotation axis. During the initialization, the rotation axis
travels slowly until the home sensor triggers. Afterwards the first zero pulse is searched for in an
area of 0-30° of the rotation axis. This enables the zero position of the flip rotation axis to be
defined.