00195982-03_SM_SWS_EN.pdf - 第30页
2 Overview of the SIPLACE wafer system (SWS) 2.4 Description of SWS assemblies 30 Service Manual SIPLACE Wafer System (SWS) 11/2018 2.4.1.2 Wafer camera system The wafer camera is aligned to the wafer surface. The camera…
2 Overview of the SIPLACE wafer system (SWS)
2.4 Description of SWS assemblies
Service Manual SIPLACE Wafer System (SWS) 11/2018 29
Fig.10: Flip head - view from the front
1. Nozzle support, segment 1
2. Nozzle support, segment 2
3. Motor for linear motion
4. Motor for 180° rotation
The flip unit takes the ejected die from the wafer foil. In flip chip mode, it rotates the die by 180°into
the pickup position for the placement head. In die attach mode, the flip unit rotates the die by ap-
prox. 130° into the transfer position for the die attach unit.
The flip unit has two nozzles arranged at 180° to one another. This enables the system in flip chip
mode to pick up a new die from the wafer at the same time as the placement head performs
pickup.
The flip unit can use both the standard SIPLACE nozzles (9xx) and the special adapters for the die
bonding tool. As in the case of other SIPLACE placement machines, the dies are attached to the
nozzles by a vacuum.
The flip unit has a rotation axis and a Z axis, driven by a linear motor. In the optional die attach
mode, a further linear motor is included to transfer the dies to the die attach head. The rotary axis
is responsible for the rotation into the 180° position (flip chip mode) or 130° position (die attach
mode). The Z-axis moves the segment during the pick process. The optional linear motor in the die
attach mode moves the segment for transfer of the die to the die attach head.
2 Overview of the SIPLACE wafer system (SWS)
2.4 Description of SWS assemblies
30 Service Manual SIPLACE Wafer System (SWS) 11/2018
2.4.1.2 Wafer camera system
The wafer camera is aligned to the wafer surface. The camera image is used by the Vision system
to recognize the defined pattern for the die to be placed (also known as reference die), for ink spot
recognition (for operation without wafer map), for calculation of the die position and for wafer edge
recognition. After positioning the wafer on the next die to be ejected, the Vision model is checked
and the die position determined. If the deviation from the target value is too great (tolerance can be
defined) the wafer table will be repositioned to optimize the ejection position.
Wafer edge recognition is needed to compensate any deviation of the wafer position relative to the
wafer frame, between different wafers of the same type.
Specification for standard camera system
The standard camera system is used for dies of size 1 to 12 mm. The camera's field of vision is
around 10.5 x 6.7 mm.
Specification for high-resolution camera system
The high-resolution camera system is part of the small die kit and is used for die sizes below 1mm.
The camera's field of vision is around 16.0 x 12.8 mm.
2.4.1.3 Wafer table
The wafer table consists of an X/Y unit (movement system with two linear axes) and the wafer sup-
port. The wafer table moves the wafer support with the wafer to the required positions in the pro-
cessing area.
Fig.11: Wafer table
1 Clamping unit 2 Wafer camera
3 Flip unit 4 Wafer support
5 Guidance
2 Overview of the SIPLACE wafer system (SWS)
2.4 Description of SWS assemblies
Service Manual SIPLACE Wafer System (SWS) 11/2018 31
Wafer support
The wafer support is fitted to the X/Y unit and is therefore part of the wafer table. The wafers are
fixed to this for the ejection procedure.
Fig.12: Wafer support without wafer inserted (example for 12")
1. Pin for locking and position detection of 12" wafers
2. Wafer locking strip
NOTICE
► To process 8" wafers, you need to change the wafer support. Frames for 6" wafers
can be processed with the relevant adapters.