00195982-03_SM_SWS_EN.pdf - 第11页
11 Service Manual SIPLACE Wafer System (SWS) 11/2018 18.6 Wafer heating .. 502 18.6.1 Function description .. 502 18.6.2 Switching elements .. 502 18.6.3 Electrical connections and addressing .. 502 18.6.4 Temper…
10 Service Manual SIPLACE Wafer System (SWS) 11/2018
18 Appendix.. 477
18.1 Specification: emergency STOP.. 477
18.1.1 Switching elements.. 477
18.1.2 External connection to SIPLACE.. 477
18.1.3 Input/output checklist.. 477
18.1.4 Function description.. 478
18.1.4.1 Emergency STOP.. 478
18.1.5 Emergency STOP extension on the SIPLACE.. 480
18.2 Specification: power supply.. 480
18.2.1 Supply and switching elements.. 480
18.2.2 General structure of power supply.. 481
18.2.3 Transformer T1 with rectification and connections.. 481
18.3 Specification: motor control.. 482
18.3.1 Motor control concept.. 482
18.3.1.1 Motor control placement variants.. 482
18.3.2 Motor controller DMC-18x6.. 483
18.3.3 Servo amplifier AMP-19540(20).. 483
18.3.4 Signal tracking motor 1-10.. 484
18.3.5 Motor/encoder specifications:.. 484
18.3.5.1 Motor-1(A) = wafer table X.. 484
18.3.5.2 Motor-2(B) = wafer table Y.. 485
18.3.5.3 Motor-3(C) = die ejector tool changer.. 485
18.3.5.4 Motor-4(D) = die ejector needle.. 485
18.3.5.5 Motor-5(E) = flip-rotate.. 486
18.3.5.6 Motor-6(F) = flip Z (pickup) motor-8(H) = flip X (handover).. 486
18.3.5.7 Motor-7(G) = rotate die attach.. 486
18.3.5.8 Motor-9(A) = wafer magazine lift.. 487
18.3.5.9 Motor-10(B) = wafer handler.. 487
18.3.6 Limit/home sensors with initialization.. 487
18.3.6.1 Initialization sequence for wafer table - X/Y MOT1(A) MOT2(B).. 487
18.3.6.2 Initialization sequence die ejector needle MOT4(D).. 488
18.3.6.3 Initialization run for flip rotor MOT5 (E).. 488
18.3.6.4 Initialization run for flip Z (pickup) MOT6 (F).. 488
18.3.6.5 Initialization run for flip X (handover) MOT8 (H).. 489
18.3.6.6 Initialization sequence for die attach unit MOT7(G).. 489
18.3.6.7 Initialization run for wafer magazine lift MOT9 (A).. 489
18.3.6.8 Initialization run for wafer handler MOT10 (B).. 489
18.4 Control system IN/OUT.. 490
18.4.1 Control boards input/output.. 490
18.4.2 Structure of DMC-18x6 I/O system.. 491
18.4.2.1 Signal tracking DMC-18x6.. 492
18.4.3 Control board USB-IO Rev.1(2) (150 x 65mm), installation location: flip unit.. 494
18.4.4 USB-IO general description.. 495
18.4.5 Select list DMC-IN/OUT.. 495
18.4.6 Select list USB-IO.. 497
18.5 Touch-down sensor rev. 1.. 498
18.5.1 Function description.. 498
18.5.2 Electrical connections.. 498
18.5.3 Function.. 499
18.5.3.1 Height measurement of nozzle 1 or 2 in Z lift... 499
18.5.3.2 Distance measurement - nozzle 1 in X lift:.. 499
18.5.3.3 Height measurement needle - die ejector:.. 500
18.5.4 Function procedure - USB-IO program.. 500
18.5.5 Test program motor control.. 501
12 Service Manual SIPLACE Wafer System (SWS) 11/2018