00195982-03_SM_SWS_EN.pdf - 第495页

18 Appendix 18.4 Control system IN/OUT Service Manual SIPLACE Wafer System (SWS) 11/2018 495 18.4.4 USB-IO general description The communication for the board is via the USB 2.0, directly with the control computer. The e…

100%1 / 506
18 Appendix
18.4 Control system IN/OUT
494 Service Manual SIPLACE Wafer System (SWS) 11/2018
Input/output DMC-1826 = input/output for wafer handler
PCI - DMC1826 Amplifier 3 AMP19520 Adapter board DMC-INT1
"AXIS 9/10" Cable 100 pin "J1 Axis9/10" "J33 AUX-IO" Cable 44 pin "X1"
Connector 100
pin.
Connector 100
pin.
Connector 44
pin.
Connector 44
pin.
Terminal
Pin69 = LSCOM Pin69 Pin44 Pin44 -- J1 INC-X1--- INC-
X1
Pin70 = IN1 Pin70 Pin24 Pin24 IN1.1
Pin71 = IN2 Pin71 Pin38 Pin38 IN1.2
Pin72 = IN3 Pin72 Pin 8 Pin 8 N1.3
Pin73 = IN4 Pin73 Pin25 Pin25 IN1.4
Pin74 = IN5 Pin74 Pin39 Pin39 IN1.5
Pin75 = IN6 Pin75 Pin9 Pin9 N1.6
Pin76 = IN7 Pin76 Pin26 Pin26 IN1.7
Pin77 = IN8 Pin77 Pin40 Pin40 IN1.8
Pin79 = OUT1 Pin79 Pin20 Pin20 OUT1.1
Pin80 = OUT2 Pin80 Pin 5 Pin 5 OUT1.2
Pin81 = OUT3 Pin81 Pin21 Pin21 OUT1.3
Pin82 = OUT4 Pin82 Pin19 Pin19 OUT1.4
Pin83 = OUT5 Pin83 Pin #4 Pin #4 OUT1.1
Pin84 = OUT6 Pin84 Pin 2 Pin 2 OUT1.2
Pin85 = OUT7 Pin85 Pin18 Pin18 OUT1.3
Pin86 = OUT8 Pin86 Pin 3 Pin 3 OUT1.4
18.4.3 Control board USB-IO Rev.1(2) (150 x 65mm), installation location: flip unit
This serves the inputs/outputs for the flip and die attach unit.
Connections for:
●
Interface for USB, CAN (connector pin strip 10 pin), RS232 (connector pin strip 10 pin)
●
8x digital input PNP/24V, connector STI1, STI2 (2x connector pin strip 12 pin)
●
8x digital output PNP/24V, /max2A / p-switching / connector STO1(connector pins trip 16 pin)
●
8x analog output, AO1-4 = STA1 (4x LED light), AO5-8 = STA2 (4x LED light)
●
8x analog input, AI1-3 = vacuum sensor, AI4/AI5 = terminal for tool height control AI6/AI7/AI8
AO4/AO8 = STA3 (connector pin strip 12 pin)
●
1x connector ST-DS (connector pin strip 6 pin) = digital input 5V/NPN, digital output 5V/NPN
●
13x terminals (gray) X2…X15 for external signal lines, coming via ST13
●
6x terminals (gray) GND, 6x terminals (orange) 24V, secured via F1/3.0AT.
18 Appendix
18.4 Control system IN/OUT
Service Manual SIPLACE Wafer System (SWS) 11/2018 495
18.4.4 USB-IO general description
The communication for the board is via the USB 2.0, directly with the control computer.
The existing interfaces "CAN" and "RS232" are intended for service applications. The supply
voltage 24VDC is fed via the connector X13 and secured with the fuse F1/3.15AT .
The control system with the ADUC841PQFP processor are supplied via a DC-DC converter 24V to 5V.
The program can be reset with the "RESET" button (DO NOT USE!). The "PENA" button is only
used for programming the system.
The inputs/outputs control the whole pneumatic control system for the flip and die attach unit.
The three integrated vacuum sensors "40PC015V2A" with analog output 0 to 4.8V check the query
for chip present/chip not present.
The height check for the two flip tools is performed via the Hall sensors "HAL815K" with analog
output 0.5 to 4.75V via the inputs AI4 and AI5.
The eight analog inputs AI1, AI2…..AI8 are checked against GND using measuring points.
The illumination control (LED) for the wafer camera is via two flat ribbon connectors "STA1" and "STA2".
The LED addressing of the two "dark field" and "bright field" boards is with current control via the
four analog "ILEDx" outputs.
When fitting a dip unit (= option) the communication is with two IN/OUT via hand check.
The supply and control of the optional component sensor fitted (= optical component recognition in
the tool movement pick Z) is via the "ST-DS" connector.
The sensor is supplied with 5 VDC.
The check is performed with the "Teach" and "Sens" signals (= 5V/NPN signals).
The "Sens" signal is passed on to the "latch input" motor control and the "chip present check" is
evaluated in connection with the encoder value.
The additional terminals X2 to X15 are direct connections to the connector X13 for IO handling of
the Galil control.
18.4.5 Select list DMC-IN/OUT
DMC1886(66)
IN1 = emergency STOP from SWS (signal = 1 emergency STOP not pressed, signal = 0 emer-
gency STOP pressed)
IN2 = control sensor main compressed air (signal = 1, compressed air present, greater than
3.5bar)
IN3 = reserve X16 (rev.0 = main vacuum check)
IN4 = latch input height control (output signal from the USB IO board)
IN5 = cylinder query die ejector Z stroke in bottom position (signal = 1)
IN6 = cylinder query die ejector Z stroke in top position (signal = 1)
IN7 = (only for SWS8") cylinder query die ejector driver pin has been moved in (signal =1)
IN8 = (only for SWS8") cylinder query die ejector driver pin has been moved out (signal =1)
IN9 = control sensor for wafer outside the centered table position (signal = 1)
IN10 = latch input optical component sensor (1 = light barrier free, 0 = light barrier interrupted) and
latch input height control (output signal from the USB IO board)
IN11 = sensor for recognition of wafer support 12" signal = 1, wafer support 8", signal = 0
IN12 = cylinder query wafer clamp is open (signal = 1)
IN13 = cylinder query wafer clamp is closed (signal = 1)
IN14 = control sensor for wafer in correct (centered) table position (signal = 1)
IN15 = Main contactors K1/K2 are switched on and 48VDC for motors is present (signal =1)
18 Appendix
18.4 Control system IN/OUT
496 Service Manual SIPLACE Wafer System (SWS) 11/2018
IN16 = emergency STOP signal in general (signal = 1 emergency STOP not pressed, signal = 0
emergency STOP pressed)
*** recognition of emergency STOP signal from the SIPLACE (signal IN16 = 0 and signal IN1 = 1) **
IN17 = pneumatic wafer expander is open (signal = 1) *** expander = optional ***
IN18 = Pneumatic wafer expander is closed (signal = 1) (identify expander = IN17 or IN18=1)
IN19 = (only SWS8") control sensor for die ejector in advance feed working position (signal = 1)
IN20 = reserve X16
IN21 = reserve X16
IN22 = reserve X16
IN24 = key switch (signal = 1, key switch is enabled for service function
OUT1 = relay K4 100ms switch on/off (emergency STOP will be reset)
OUT2 = valve main compressed air (output = 1, compressed air is switched on)
OUT3 = vacuum pump (output =1, vacuum is switched via the power relay OK7)
OUT4 = open valve for cylinder wafer expander *** expander = optional***
OUT5 = close valve for cylinder wafer expander
OUT6 = reserve X11, X16
OUT7 = valve for cylinder die ejector Z stroke (output = 1, Z stroke upwards)
OUT8 = valve for cylinder die ejector driver pin (output = 1, driver pin has been moved out)
OUT9 = valve for cylinder wafer clamp (output = 1, clamp is closed)
OUT10 = vacuum valve for die ejector (suction of wafer foil) (output = 1, vacuum = on)
OUT11 = reserve X13, X16
OUT12 = enable - optical component sensor (1= enable laser) *** optional for small chip ***
OUT13 = valve for Rückhaltezylinder flip tool Z (output via K1 = 1, cylinder is down)
OUT14 = Valve for clamping cylinder flip tool X (output via K2 = 1, clamping is open)
OUT15 = reserve X16
OUT16 = relay K4, presence signal for SIPLACE (output = 1, CSM is present)
DMC1826
IN1.1 = control sensor for wafer query in the cassette (signal = 1, wafer is present)
IN1.2 = check wafer heating (signal = 1)
IN1.3 = door switch wafer lift (signal = 1, door is closed)
IN1.4 = 2x switch (8", 12") for wafer cassette (signal = 1, cassette present in wafer lift)
IN1.5 = sensor for wafer gripper in top position (signal = 1)
IN1.6 = sensor for wafer gripper in bottom position (signal = 1)
IN1.7 = sensor for wafer gripper opened (signal = 1)
IN1.8 = sensor for wafer gripper is closed, wafer is in gripper (signal = 1)
*** IN1.7 and IN1.8 both signals are 0, wafer gripper is closed without wafer ***
OUT1.1 = reserve
OUT1.2 = valve wafer gripper for top/bottom position (output = 1, = bottom position)
OUT1.3 = valve wafer gripper for open/closed (output = 1, = gripper closed)
OUT1.4 = reserve
OUT1.5 = wafer heating safety time relay (on/off 300ms) ** wafer heating = optional **
OUT1.6 = Wafer heating 1 (heater coil 1000W)
OUT1.7 = Wafer heating 2 (heater coil 1000W)
OUT1.8 = crossflow fan for wafer heater