00195982-03_SM_SWS_EN.pdf - 第149页

7 Die ejector 7.4 Mechanical adjustment of the needle position in the X/Y position Service Manual SIPLACE Wafer System (SWS) 11/2018 149 7.4.1.2 Preparatory tasks ► Switch the SWS on and initialize the system. ► Log your…

7 Die ejector

7.4 Mechanical adjustment of the needle position in the X/Y position

148 Service Manual SIPLACE Wafer System (SWS) 11/2018

7.4.1.1 Explanation of the coordinate system

Fig.183:

(1) Camera center point (red cross)

(2) Center point of central needle in the ejection system (small, bright dot in the central drilled hole)

Fig.184:

(3) Y direction → movement of base plate in the direction of the wafer lift

(4) X direction → movement of base plate in the direction of the SWS sides

(5) Adjusting screw for moving the base plate in the Y direction (Allen key 4mm)

(6) Adjusting square shaft for moving the base plate in the X direction (fork wrench SW5)

7 Die ejector

7.4 Mechanical adjustment of the needle position in the X/Y position

Service Manual SIPLACE Wafer System (SWS) 11/2018 149

7.4.1.2 Preparatory tasks

► Switch the SWS on and initialize the system.

► Log yourself in as SIPLACE Service.

Fig.185:

► Switch menu to Wafer Handling (1 to 3).

Fig.186:

► Move the wafer table to the change position (4).

► Leave this menu in the main view.

7 Die ejector

7.4 Mechanical adjustment of the needle position in the X/Y position

150 Service Manual SIPLACE Wafer System (SWS) 11/2018

Fig.187:

► Change the menu with steps (5) to (7) until you get to the Die Handlingmenu.

Fig.188:

► Change to the Ejection unit (8).