00195982-03_SM_SWS_EN.pdf - 第496页
18 Appendix 18.4 Control system IN/OUT 496 Service Manual SIPLACE Wafer System (SWS) 11/2018 IN1 6 = em erg enc y S TOP si gna l i n g ene ral (s ign al = 1 em erg enc y S TOP no t p res sed , s ign al = 0 eme rge ncy ST…
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18.4 Control system IN/OUT
Service Manual SIPLACE Wafer System (SWS) 11/2018 495
18.4.4 USB-IO general description
The communication for the board is via the USB 2.0, directly with the control computer.
The existing interfaces "CAN" and "RS232" are intended for service applications. The supply
voltage 24VDC is fed via the connector X13 and secured with the fuse F1/3.15AT .
The control system with the ADUC841PQFP processor are supplied via a DC-DC converter 24V to 5V.
The program can be reset with the "RESET" button (DO NOT USE!). The "PENA" button is only
used for programming the system.
The inputs/outputs control the whole pneumatic control system for the flip and die attach unit.
The three integrated vacuum sensors "40PC015V2A" with analog output 0 to 4.8V check the query
for chip present/chip not present.
The height check for the two flip tools is performed via the Hall sensors "HAL815K" with analog
output 0.5 to 4.75V via the inputs AI4 and AI5.
The eight analog inputs AI1, AI2…..AI8 are checked against GND using measuring points.
The illumination control (LED) for the wafer camera is via two flat ribbon connectors "STA1" and "STA2".
The LED addressing of the two "dark field" and "bright field" boards is with current control via the
four analog "ILEDx" outputs.
When fitting a dip unit (= option) the communication is with two IN/OUT via hand check.
The supply and control of the optional component sensor fitted (= optical component recognition in
the tool movement pick Z) is via the "ST-DS" connector.
The sensor is supplied with 5 VDC.
The check is performed with the "Teach" and "Sens" signals (= 5V/NPN signals).
The "Sens" signal is passed on to the "latch input" motor control and the "chip present check" is
evaluated in connection with the encoder value.
The additional terminals X2 to X15 are direct connections to the connector X13 for IO handling of
the Galil control.
18.4.5 Select list DMC-IN/OUT
DMC1886(66)
IN1 = emergency STOP from SWS (signal = 1 emergency STOP not pressed, signal = 0 emer-
gency STOP pressed)
IN2 = control sensor main compressed air (signal = 1, compressed air present, greater than
3.5bar)
IN3 = reserve X16 (rev.0 = main vacuum check)
IN4 = latch input height control (output signal from the USB IO board)
IN5 = cylinder query die ejector Z stroke in bottom position (signal = 1)
IN6 = cylinder query die ejector Z stroke in top position (signal = 1)
IN7 = (only for SWS8") cylinder query die ejector driver pin has been moved in (signal =1)
IN8 = (only for SWS8") cylinder query die ejector driver pin has been moved out (signal =1)
IN9 = control sensor for wafer outside the centered table position (signal = 1)
IN10 = latch input optical component sensor (1 = light barrier free, 0 = light barrier interrupted) and
latch input height control (output signal from the USB IO board)
IN11 = sensor for recognition of wafer support 12" signal = 1, wafer support 8", signal = 0
IN12 = cylinder query wafer clamp is open (signal = 1)
IN13 = cylinder query wafer clamp is closed (signal = 1)
IN14 = control sensor for wafer in correct (centered) table position (signal = 1)
IN15 = Main contactors K1/K2 are switched on and 48VDC for motors is present (signal =1)
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18.4 Control system IN/OUT
496 Service Manual SIPLACE Wafer System (SWS) 11/2018
IN16 = emergency STOP signal in general (signal = 1 emergency STOP not pressed, signal = 0
emergency STOP pressed)
*** recognition of emergency STOP signal from the SIPLACE (signal IN16 = 0 and signal IN1 = 1) **
IN17 = pneumatic wafer expander is open (signal = 1) *** expander = optional ***
IN18 = Pneumatic wafer expander is closed (signal = 1) (identify expander = IN17 or IN18=1)
IN19 = (only SWS8") control sensor for die ejector in advance feed working position (signal = 1)
IN20 = reserve X16
IN21 = reserve X16
IN22 = reserve X16
IN24 = key switch (signal = 1, key switch is enabled for service function
OUT1 = relay K4 100ms switch on/off (emergency STOP will be reset)
OUT2 = valve main compressed air (output = 1, compressed air is switched on)
OUT3 = vacuum pump (output =1, vacuum is switched via the power relay OK7)
OUT4 = open valve for cylinder wafer expander *** expander = optional***
OUT5 = close valve for cylinder wafer expander
OUT6 = reserve X11, X16
OUT7 = valve for cylinder die ejector Z stroke (output = 1, Z stroke upwards)
OUT8 = valve for cylinder die ejector driver pin (output = 1, driver pin has been moved out)
OUT9 = valve for cylinder wafer clamp (output = 1, clamp is closed)
OUT10 = vacuum valve for die ejector (suction of wafer foil) (output = 1, vacuum = on)
OUT11 = reserve X13, X16
OUT12 = enable - optical component sensor (1= enable laser) *** optional for small chip ***
OUT13 = valve for Rückhaltezylinder flip tool Z (output via K1 = 1, cylinder is down)
OUT14 = Valve for clamping cylinder flip tool X (output via K2 = 1, clamping is open)
OUT15 = reserve X16
OUT16 = relay K4, presence signal for SIPLACE (output = 1, CSM is present)
DMC1826
IN1.1 = control sensor for wafer query in the cassette (signal = 1, wafer is present)
IN1.2 = check wafer heating (signal = 1)
IN1.3 = door switch wafer lift (signal = 1, door is closed)
IN1.4 = 2x switch (8", 12") for wafer cassette (signal = 1, cassette present in wafer lift)
IN1.5 = sensor for wafer gripper in top position (signal = 1)
IN1.6 = sensor for wafer gripper in bottom position (signal = 1)
IN1.7 = sensor for wafer gripper opened (signal = 1)
IN1.8 = sensor for wafer gripper is closed, wafer is in gripper (signal = 1)
*** IN1.7 and IN1.8 both signals are 0, wafer gripper is closed without wafer ***
OUT1.1 = reserve
OUT1.2 = valve wafer gripper for top/bottom position (output = 1, = bottom position)
OUT1.3 = valve wafer gripper for open/closed (output = 1, = gripper closed)
OUT1.4 = reserve
OUT1.5 = wafer heating safety time relay (on/off 300ms) ** wafer heating = optional **
OUT1.6 = Wafer heating 1 (heater coil 1000W)
OUT1.7 = Wafer heating 2 (heater coil 1000W)
OUT1.8 = crossflow fan for wafer heater
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Service Manual SIPLACE Wafer System (SWS) 11/2018 497
18.4.6 Select list USB-IO
DI1 = camera flash output (signal = 1, flash for LED lighting wafer)
DI2 = reserve
DI3 = recognition for dip module (signal = 1, dip module is connected and OK)
DI4 = dip module ready (signal = 0, dip module in progress, signal = 1, dip module ready)
DI5 = control sensor right bad die box (signal = 1, right bad die box is present)
DI6 = control sensor left bad die box (signal = 1, left bad die box is present)
DI7 = recognition of die attach unit = option (signal = 1, die attach unit is connected)
DI8 = error query for the encoder flip-rotate (signal = 1, encoder = OK)
DO1 = compressed air valve for flip tool 1 (output = 1, compressed air is switched through)
DO2 = vacuum valve for flip tool 1 (output = 1, vacuum switched through)
DO3 = compressed air valve for flip tool 2 (output = 1, compressed air is switched through)
DO4 = vacuum valve for flip tool 2 (output = 1, vacuum switched through)
DO5 = compressed air valve for die attach tool 2 (output = 1, compressed air is switched through)
DO6 = vacuum valve for die attach tool (output = 1, vacuum switched through)
DO7 = initialization signal for dip unit (output = 1, start of initialization)
DO8 = start signal for dip unit (output = 1, start release for one sequence)
AI1 = vacuum sensor for flip tool 1
AI2 = vacuum sensor for flip tool 2
AI3 = vacuum sensor for main vacuum
AI6 = vacuum sensor (external) for die attach unit
The analog output signal depends on the vacuum strength and the tool hole.
The lower the vacuum value and the larger the tool hole, the lower the output voltage of the
vacuum sensor will be.
If there is a chip held on the tool (suction), the output voltage will change by approx. 50 to 200mV
(for small tool holes) and by approx. 200‑1000mV (for large tool holes).
AI4 = height check for flip tool 1 (analog signal 3.5 to 4V = output signal)
AI5 = height check for flip tool 2 (analog signal 3.5 to 4V = output signal)
A change in decreasing voltage by <100mV → recognition that the tool has made contact with the
wafer.
AI7 = reserve STA3
AI8 = reserve STA3
ILED1 = LED illumination "bright field" 4x corners illuminated
ILED2 = LED illumination "bright field" 4x lines illuminated (outer)
ILED3 = LED illumination "bright field" center illuminated
ILED4 = reserve
ILED5 = LED illumination in circle "dark field" 2x corners illuminated (rear)
ILED6 = LED illumination in circle "dark field" 2x corners illuminated (front)
ILED7 = LED illumination in circle "dark field" 2x lines illuminated (right, left)
ILED8 = LED illumination in circle "dark field" 2x lines illuminated (front, back)
The illumination is addressed via the power control (current output signal ILED1, ILED2…ILED8).
The maximum permanently present current per hardware is 60mA, which is limited to 30 mA per
software.
The maximum current for the flash function is 120 mA. The time is limited per software.