00195982-03_SM_SWS_EN.pdf - 第244页

10 Option Die Attach Unit SWS 10.2 Dissambling Die-Attach-Unit SWS 244 Service Manual SIPLACE Wafer System (SWS) 11/2018 Fig.327: ► Remove the reject bin (1) of the Die Attach segment (see 10.1.3 "Installing the Op…

10 Option Die Attach Unit SWS

10.2 Dissambling Die-Attach-Unit SWS

Service Manual SIPLACE Wafer System (SWS) 11/2018 243

10.2 Dissambling Die-Attach-Unit SWS

Required tool

●

2.5mm Allen key

Procedure

► Shut down the SWS in the GUI.

► Switch the SWS off at the main switch.

Fig.326:

► Remove the cover of the Die Attach Unit.

10 Option Die Attach Unit SWS

10.2 Dissambling Die-Attach-Unit SWS

244 Service Manual SIPLACE Wafer System (SWS) 11/2018

Fig.327:

► Remove the reject bin (1) of the Die Attach segment (see 10.1.3 "Installing the Option Die At-

tach Unit in SWS" [}219]).

► Remove the cable ties (2) that binds together the cables for the Die Attach Segment and

transfer X motor (see 10.1.3 "Installing the Option Die Attach Unit in SWS" [}219]).

► Remove the grounding cable (3).

Fig.328:

► Remove the control/power (4) cable of Die Attach Unit.

10 Option Die Attach Unit SWS

10.2 Dissambling Die-Attach-Unit SWS

Service Manual SIPLACE Wafer System (SWS) 11/2018 245

Fig.329:

► Remove the screws of the encoder cables (5) for Die Attach segment motor and transfer X

motor and disconnect the connectors.

► Unplug the power connectors of the encoder cables (6) for the Die Attach segment motor and

the transfer X motor.

Fig.330:

► Disconnect the blue and the grey tube (7).

Blue tube: Connected to valve Y8, air pressure control for the Die Attach segment air kiss

Grey tube: 5bar for releasing the transfer X motor.