00195982-03_SM_SWS_EN.pdf - 第252页

10 Option Die Attach Unit SWS 10.2 Dissambling Die-Attach-Unit SWS 252 Service Manual SIPLACE Wafer System (SWS) 11/2018 Fig.344: NOTICE ► Cover the opening of the die ejector, e.g. with a cardboard (as a protection to…

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10 Option Die Attach Unit SWS
10.2 Dissambling Die-Attach-Unit SWS
Service Manual SIPLACE Wafer System (SWS) 11/2018 251
Fig.342:
► Insert the filling piece (see figure). However, do not fully tighten the safety screws yet.
Fig.343:
The filling piece must be adjusted with the adjustment gauge shown in the figure. It can be found in
the service box of the SWS.
CAUTION
If the filling piece is not adjusted with the gauge, there will be a step to the flip head race-
way. When the bearing of the segment moves over this step the picked die will be lost or
shifted!
► Insert the adjustment gauge into the loosely mounted filling piece. The edges of the
adjustment gauge must be inside the raceway (see following figure).
10 Option Die Attach Unit SWS
10.2 Dissambling Die-Attach-Unit SWS
252 Service Manual SIPLACE Wafer System (SWS) 11/2018
Fig.344:
NOTICE
► Cover the opening of the die ejector, e.g. with a cardboard (as a protection to prevent
damages should the gauge fall down). Do not forget to lift the cover off once you are
finished.
Fig.345:
► Gently tighten the two safety screws of the filling piece.
► Take the adjustment gauge out.
► Move the rotation axis of the flip head manually and make sure the bearing of the segment
moves smoothly over the filling piece.
► The cables and tubes for the Die Attach Unit must be bound together with cable ties (see fol-
lowing figures).
– If the cables stand up, there will be a crash with the placement head!
– If the cables sag, they will be damaged by the wafer table!
10 Option Die Attach Unit SWS
10.2 Dissambling Die-Attach-Unit SWS
Service Manual SIPLACE Wafer System (SWS) 11/2018 253
Fig.346: Storing the cables after disassembly on SWS at location 2 or 4
CAUTION
If the cables and tubes for the Die Attach Unit are not stored and bound together, there is a
danger of crash with the wafer table and the placement head!
Fig.347: