00195982-03_SM_SWS_EN.pdf - 第126页
7 Die ejector 7.3 Replacing spare parts 126 Service Manual SIPLACE Wafer System (SWS) 11/2018 Fig.142: ► Disconnect the cable X11.2 from connector X11 (11) for the IO board! Fig.143: The diagram shows the die ejector b…
7 Die ejector
7.3 Replacing spare parts
Service Manual SIPLACE Wafer System (SWS) 11/2018 125
Fig.140:
► Pull the vacuum hose (7) off the vacuum valve of the die ejector.
Fig.141:
► Unplug the following cables:
– (8) Power supply die ejector X4
– (9) Encoder signals die ejector ENC4
– (10) Remove the cable ties
7 Die ejector
7.3 Replacing spare parts
126 Service Manual SIPLACE Wafer System (SWS) 11/2018
Fig.142:
► Disconnect the cable X11.2 from connector X11 (11) for the IO board!
Fig.143:
The diagram shows the die ejector base plate for an SWS 2/4 from the direction of the dismantled
nozzle changer. In this case, the eccentric shaft(1) is to the left of the base plate.
► Grasp the base plate (2) at the cut-out recesses and lift the base plate(3).
You need to turn the base plate to remove it. The direction of rotation depends on the location
used.
7 Die ejector
7.3 Replacing spare parts
Service Manual SIPLACE Wafer System (SWS) 11/2018 127
Rotary direction for base plate SWS 2/4
Fig.144:
► Carefully turn the base plate to the right (clockwise), until the plate is parallel to the recess.