00195982-03_SM_SWS_EN.pdf - 第4页
4 Service Manual SIPLACE Wafer System (SWS) 11/2018 3.2.3 Die recognition and die positioning .. 50 3.2.4 Ejection procedure .. 51 3.2.5 Pickup process .. 51 3.2.6 Embedded wafer level ballgrid array (eWLB/WLFO) pr…
3Service Manual SIPLACE Wafer System (SWS) 11/2018
1 Introduction.. 13
1.1 Safety instructions.. 13
1.1.1 Conventions for the use of safety instructions and symbols.. 13
1.1.2 Safety instructions for the power supply.. 14
1.1.3 Safety instructions for the compressed air supply.. 14
1.1.4 Safety instructions on hazardous materials.. 14
1.2 Preparatory work..... 15
1.3 Other instructions.. 16
1.3.1 Environmentally-friendly disposal of materials and components.. 16
1.3.2 Use of original accessories and spare parts.. 16
1.3.3 Information about this service manual.. 16
1.3.4 ESD guidelines.. 17
1.3.4.1 What does ESD mean?.. 17
1.3.4.2 Important measures to protect against static charging.. 17
1.3.4.3 Handling ESD modules.. 17
1.3.4.4 Measurements and modifications to ESD modules.. 17
1.3.4.5 Dispatching ESD modules.. 18
1.3.5 Validity of document.. 18
1.3.6 Release history.. 18
1.3.7 SIPLACE on the World Wide Web (WWW).. 18
1.4 Staff qualifications and training.. 19
1.5 Abbreviations.. 19
2 Overview of the SIPLACE wafer system (SWS).. 21
2.1 Technical data.. 21
2.2 Overview of main assemblies.. 22
2.3 Detailed overview of main assemblies.. 25
2.3.1 Overview of assemblies in wafer table area.. 26
2.4 Description of SWS assemblies.. 27
2.4.1 Supply unit.. 27
2.4.1.1 Flip unit.. 28
2.4.1.2 Wafer camera system.. 30
2.4.1.3 Wafer table.. 30
2.4.1.4 Die ejector.. 33
2.4.1.5 Die ejector.. 35
2.4.1.6 Wafer changer system.. 37
2.4.2 Optional features.. 41
2.4.2.1 Linear dipping unit (LDU).. 41
2.4.2.2 Die attach unit.. 42
2.4.2.3 Small die kit.. 42
2.4.2.4 Wafer map system.. 43
2.4.2.5 Barcode scanner.. 43
2.4.2.6 SIPLACE SWS wafer stretcher.. 44
3 SIPLACE wafer system (SWS) function.. 47
3.1 SWS basic functions.. 47
3.2 Basic die presentation process.. 48
3.2.1 Flip chip process.. 49
3.2.2 Die attach process.. 50
4 Service Manual SIPLACE Wafer System (SWS) 11/2018
3.2.3 Die recognition and die positioning.. 50
3.2.4 Ejection procedure.. 51
3.2.5 Pickup process.. 51
3.2.6 Embedded wafer level ballgrid array (eWLB/WLFO) process.. 52
3.3 Pick and transfer process in detail.. 53
3.3.1 Flip chip segment 1 (nozzle).. 53
3.3.2 Flip chip segment 1 (Z direction).. 54
3.3.3 Die attach – transfer position.. 55
3.3.4 Flip chip encoded positions (after calibration).. 56
4 SWS installation and removal for SIPLACE CA machines.. 59
4.1 Removing the SWS.. 59
4.2 Installing the SWS.. 62
4.3 Swinging up the magazine lift.. 65
5 Basic frame – X/Y unit.. 67
5.1 Function description.. 67
5.2 Complete overview.. 67
5.2.1 Basic frame – design and spare parts [00386774-xx] (example SWS 1/3).. 68
5.2.2 X/Y unit – design and spare parts [00386776-xx] (example SWS 1/3).. 69
5.2.3 Overview of sensors.. 70
5.3 Replacing parts.. 72
5.3.1 Replacing the Y motor with coupling.. 73
5.3.1.1 Removing the Y motor with coupling.. 73
5.3.1.2 Removing the Y motor (alternative, without coupling).. 79
5.3.1.3 Fitting the Y motor and coupling.. 80
5.3.1.4 Required calibration after Y motor replacement.. 84
5.3.2 Replacing the X motor.. 85
5.3.2.1 Removing the X motor and coupling.. 85
5.3.2.2 Fitting the new X motor and coupling.. 91
5.3.3 Replacing the Y axis sensors.. 100
5.3.3.1 Checking the proximity switch.. 101
5.3.4 Replacing the X axis sensors.. 102
5.3.4.1 Checking the proximity switch.. 103
5.3.5 Replacing the fork light barriers home position HO1 and HO2.. 103
5.3.6 Replacing the Y axis motor board.. 105
5.3.7 Replacing the X axis motor board.. 106
5.3.8 Microfuse F1 on adapter board for wafer table AD-WT Rev.0 [00379046-xx].. 106
6 Supply unit.. 107
6.1 Overview of spare parts.. 107
6.2 Replacing spare parts.. 111
6.2.1 Preparatory tasks.. 111
6.2.1.1 Swinging up the magazine lift.. 111
6.2.1.2 Closing the magazine lift.. 112
6.2.1.3 Pulling out the supply unit.. 112
6.2.1.4 Inserting the supply unit.. 112
6.2.2 Replacing the BoxPC.. 113
6.2.3 Replacing the vacuum pump.. 113
6.2.4 Replacing the Galil motor card AMP-19540 or AMP-19520.. 114
6.2.5 Replacing the mains transformer.. 115
5Service Manual SIPLACE Wafer System (SWS) 11/2018
6.3 Settings.. 116
6.3.1 Setting the compressed air monitor.. 116
6.3.2 Creating connection voltages at the mains transformer.. 116
7 Die ejector.. 119
7.1 Overview of main assemblies.. 119
7.2 Overview of spare parts.. 120
7.3 Replacing spare parts.. 121
7.3.1 Preparatory tasks.. 121
7.3.2 Removing the complete die ejector unit from the SWS.. 122
7.3.3 Removing the Z axis from the die ejector.. 129
7.3.4 Fitting the Z axis on the die ejector.. 135
7.3.5 Fitting the complete die ejector unit into the SWS.. 142
7.4 Mechanical adjustment of the needle position in the X/Y position.. 147
7.4.1 Goal for mechanical adjustment of needle position in X/Y direction.. 147
7.4.1.1 Explanation of the coordinate system.. 148
7.4.1.2 Preparatory tasks.. 149
7.4.2 Adjusting the needle in the X/Y position.. 152
7.5 Mechanical adjustment of the die ejector unit in the Z direction (focus).. 155
7.5.1 Replacing the needle ejection system needles.. 155
7.5.1.1 Preparatory tasks.. 156
7.5.1.2 Setting the needles with the calibration standard [03098221-xx] (for die ejector, magnetic).. 158
7.5.1.3 Setting the needles with the calibration standard [03080191-xx].. 159
7.5.1.4 Checking the needle ejection unit for air-tightness.. 160
7.5.1.5 Replacing the sealing unit and the O-ring on the die ejector centering unit.. 162
7.5.2 Replacing the vacuum on the die ejector.. 165
7.5.3 Solenoid valve for moving the Z axis up and down.. 165
7.5.3.1 Replacing the proximity switch.. 166
7.5.4 Replacing the fork light barrier on the ejection system.. 167
7.6 Converting the bayonet needle ejector unit (old version) to the magnetic needle
ejector unit (current version)..
168
7.6.1 Preparatory measures.. 168
7.6.2 Removing the bayonet needle ejector unit... 168
7.6.3 Fitting the needle ejector unit magnetic table.. 171
8 Flip unit.. 173
8.1 Overview of main assemblies.. 173
8.2 Overview of spare parts.. 174
8.3 Replacing spare parts.. 178
8.3.1 Replacing the flip unit.. 178
8.3.1.1 Calibrating the home position for segment 1.. 178
8.3.1.2 Calibrating the hollow shaft motor.. 178
8.3.2 Replacing the suction plate.. 178
8.3.3 Replacing the pneumatic return unit.. 179
8.3.4 Removing the wafer camera on the flip unit.. 180
8.3.4.1 Replacing the bright field illumination board.. 181
8.3.4.2 Replacing the dark field illumination board.. 182
8.4 Calibration – flip unit.. 183
8.4.1 Tools and equipment required.. 183
8.4.2 Preparation.. 183
8.4.3 Setting the segment offsets.. 184
8.4.4 Correcting the segment offsets.. 185