00195982-03_SM_SWS_EN.pdf - 第153页

7 Die ejector 7.4 Mechanical adjustment of the needle position in the X/Y position Service Manual SIPLACE Wafer System (SWS) 11/2018 153 Fig.193: NOTICE ► If the needle tip is not visible, switch to the menu Illuminatio…

7 Die ejector

7.4 Mechanical adjustment of the needle position in the X/Y position

152 Service Manual SIPLACE Wafer System (SWS) 11/2018

7.4.2 Adjusting the needle in the X/Y position

Fig.191:

► Remove the four screws (1 and 2) fastening the base plate and press the base plate in the

direction of the eccentric shaft.

Fig.192:

► Switch to the live image from the wafer camera (3 and 4).

7 Die ejector

7.4 Mechanical adjustment of the needle position in the X/Y position

Service Manual SIPLACE Wafer System (SWS) 11/2018 153

Fig.193:

NOTICE

► If the needle tip is not visible, switch to the menu Illumination and set the lighting so

that you can see the dot showing the needle tip/needle cone.

Fig.194:

► Turn the eccentric shaft (5), until the wafer camera live image shows the needle tip dot under

the red line. → Adjustment in X position

7 Die ejector

7.4 Mechanical adjustment of the needle position in the X/Y position

154 Service Manual SIPLACE Wafer System (SWS) 11/2018

Fig.195:

► Remove the two locking screws (6) from the eccentric shaft, so that the base plate can be

moved in the Y direction. The rear locking screw(6) can only be reached if the wafer table has

already been moved manually in the direction of the wafer lift.

► The eccentric screw(7) is used to set the base plate in the Y direction (Allen key 4mm).

Fig.196:

► Turn the eccentric screw (7), until the wafer camera live image shows the needle tip dot ex-

actly in the crosshairs of the red lines. → Adjustment in Y position