00195982-03_SM_SWS_EN.pdf - 第129页

7 Die ejector 7.3 Replacing spare parts Service Manual SIPLACE Wafer System (SWS) 11/2018 129 Fig.147: ► Place the die ejector unit down on the base plate. 7.3.3 Removing the Z axis from the die ejector Fig.148: ► Plac…

7 Die ejector

7.3 Replacing spare parts

128 Service Manual SIPLACE Wafer System (SWS) 11/2018

Rotary direction for base plate SWS 1/3

When using a die ejector base plate for an SWS 1/3, the eccentric shaft is to the right of the base

plate when viewed from the direction of the dismantled nozzle changer.

Fig.145:

► Carefully turn the base plate to the left (anticlockwise), until the plate is parallel to the recess.

Fig.146:

► Grasp the base plate by its edge.

Carefully turn the base plate out. Pay attention to the interfering edges (red).

► Carefully pull the base plate out of the SWS.

7 Die ejector

7.3 Replacing spare parts

Service Manual SIPLACE Wafer System (SWS) 11/2018 129

Fig.147:

► Place the die ejector unit down on the base plate.

7.3.3 Removing the Z axis from the die ejector

Fig.148:

► Place the die ejector unit down on its side, as shown in the diagram.

7 Die ejector

7.3 Replacing spare parts

130 Service Manual SIPLACE Wafer System (SWS) 11/2018

Fig.149:

► Pull the vacuum hose off.

You now need to dismantle the fork light barrier board. To do so, proceed as follows:

Fig.150:

► Remove the two screws(2) (Allen key 2.5) and then take off the fork light barrier (1).