00195982-03_SM_SWS_EN.pdf - 第150页

7 Die ejector 7.4 Mechanical adjustment of the needle position in the X/Y position 150 Service Manual SIPLACE Wafer System (SWS) 11/2018 Fig.187: ► Change the menu with steps (5) to (7) until you get to the Die Handling…

7 Die ejector

7.4 Mechanical adjustment of the needle position in the X/Y position

Service Manual SIPLACE Wafer System (SWS) 11/2018 149

7.4.1.2 Preparatory tasks

► Switch the SWS on and initialize the system.

► Log yourself in as SIPLACE Service.

Fig.185:

► Switch menu to Wafer Handling (1 to 3).

Fig.186:

► Move the wafer table to the change position (4).

► Leave this menu in the main view.

7 Die ejector

7.4 Mechanical adjustment of the needle position in the X/Y position

150 Service Manual SIPLACE Wafer System (SWS) 11/2018

Fig.187:

► Change the menu with steps (5) to (7) until you get to the Die Handlingmenu.

Fig.188:

► Change to the Ejection unit (8).

7 Die ejector

7.4 Mechanical adjustment of the needle position in the X/Y position

Service Manual SIPLACE Wafer System (SWS) 11/2018 151

Fig.189:

► Move the die ejector unit upwards (9).

► Press the emergency STOP switch on the SWS.

The emergency STOP button releases all axes so that they can be moved manually.

The die ejector unit remains in the top position which it was moved to.

Fig.190:

► Move the wafer table in the direction of the wafer lift(2), in order to access all screws(1)

fastening the die ejector base plate.