00195982-03_SM_SWS_EN.pdf - 第386页
15 Calibration 15.3 Calibration die handling - flip unit 386 Service Manual SIPLACE Wafer System (SWS) 11/2018 Fig.558: ► Choose Die handling calibration . Fig.559: ► Choose Service Calibration Needle (1) . ► Choose Di…
15 Calibration
15.3 Calibration die handling - flip unit
Service Manual SIPLACE Wafer System (SWS) 11/2018 385
15.3.2.5 Calibration – die ejector needle
HIGH RISK OF SERIOUS INJURIES
► Setup mode must be activated!
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The die ejector needle lifts the die component off from the wafer!
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The needle is moved up and down by a threating spindle.
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The die ejector needle must be adjusted exactly to the surface of the die ejector!
●
This is the zero point correction for the die ejector needle, which is called the needle down
position.
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Each different die type requires a different needle height to be ejected!
●
This height is calculated from the zero point correction (needle down position).
Needle down position
→ TOO LOW
Needle down position
→ TOO HIGH
Needle down position
→ The needle must be flush
with the die ejector
→ OK.
Finding the needle down position
Fig.557:
► Move the die ejector in the upper position.
15 Calibration
15.3 Calibration die handling - flip unit
386 Service Manual SIPLACE Wafer System (SWS) 11/2018
Fig.558:
► Choose Die handling calibration.
Fig.559:
► Choose Service Calibration Needle (1).
► Choose Die View (2).
ð Needle down position (µm) shows the current value! (3).
→ 1000µm in the example.
15 Calibration
15.3 Calibration die handling - flip unit
Service Manual SIPLACE Wafer System (SWS) 11/2018 387
Fig.560:
► Choose Move to needle down position.
Fig.561:
► Move a finger over the die ejector.
► If the needle down position is correct, you should feel a slight sharp scratching on your finger.
► Based on SWS experience, the protrusion of the needle can be up to 40µm!
Less is better which can, however, only be "measured" with a finger.
► In our example, the scratching at the fingertip is too strong.
We need to adjust the needle down position lower.