00195982-03_SM_SWS_EN.pdf - 第381页

15 Calibration 15.3 Calibration die handling - flip unit Service Manual SIPLACE Wafer System (SWS) 11/2018 381 Fig.549: ► Take out the die ejector unit. Fig.550: ► Put a strip of Teflon tape over the center of the die …

15 Calibration

15.3 Calibration die handling - flip unit

380 Service Manual SIPLACE Wafer System (SWS) 11/2018

Fig.547:

► Choose Manual Operation (1).

► Choose Manualop Subsystems (2).

► Choose Die handling (3).

Fig.548:

► Choose Manualop Dietransfer (4).

► Choose Ejection unit (5).

► Check if any objects are lying on the die ejector.

If yes, remove these.

► Carefully move the wafer table manually.

► Move up the die ejector (6).

15 Calibration

15.3 Calibration die handling - flip unit

Service Manual SIPLACE Wafer System (SWS) 11/2018 381

Fig.549:

► Take out the die ejector unit.

Fig.550:

► Put a strip of Teflon tape over the center of the die ejector.

Fig.551:

► Re-insert the die ejector into the SWS.

► Switch back to the service menu Die handling calibration.

15 Calibration

15.3 Calibration die handling - flip unit

382 Service Manual SIPLACE Wafer System (SWS) 11/2018

Fig.552:

► For this, choose Service in the bottom menu bar and then Die handling calibration.

► Choose Segments offset calibration.

► Here, the offset values entered in the machine data are displayed (0µm in the example).

Fig.553:

► Activate the vacuum at the ejector to keep the Teflon tape in position.