00195982-03_SM_SWS_EN.pdf - 第172页
7 Die ejector 7.6 Converting the bayonet needle ejector unit (old version) to the magnetic needle ejector unit (current 172 Service Manual SIPLACE Wafer System (SWS) 11/2018 Fig.223: The cable for the fork light barrier…
7 Die ejector
7.6 Converting the bayonet needle ejector unit (old version) to the magnetic needle ejector unit (current
Service Manual SIPLACE Wafer System (SWS) 11/2018 171
7.6.3 Fitting the needle ejector unit magnetic table
Fig.222:
► Observe the alignment of the switch flag (1) and the centering unit (3) to the Z axis of the die
ejector (direction (5))!
Make sure that the switch flag (1) is flush with the groove (2) in the housing of the Z axis for
the die ejector.
► Lift the centering unit (3) over the die ejector Z axis.
Make sure that the switch flag (1) points in the direction (5) of the groove (2).
► When positioning the centering unit (3), the switch flag (1) should fit into the groove (4) of the
centering unit and also into the groove(2) of the die ejector Z axis.
7 Die ejector
7.6 Converting the bayonet needle ejector unit (old version) to the magnetic needle ejector unit (current
172 Service Manual SIPLACE Wafer System (SWS) 11/2018
Fig.223:
The cable for the fork light barrier board does not need to be unplugged for removal (the diagram
without cable is just an example).
► Fasten the centering unit into place with the three Allen screws (6). Use the screws from the
unit you dismantled before.
► Fit the fork light barrier board (7) into place with the two Allen screws(8). Press the board into
the bottom left corner and tighten the two Allen screws.
► Connect the vacuum hose to the centering unit.
Calibrating
The following calibrations must be performed after the conversion.
●
Position "calibration of ejection needle"
This calibrates the height of the needle so that it is flush with the upper edge of the black ejec-
tion cap (see 15.3.2.5 "Calibration – die ejector needle" [}385]).
●
Check the needle position in the X and Y directions.
The needle tip must correspond with the camera center point (red cross in Vision view) (see
15.3.2.4 "Calibration – segment offset calibration in X direction" [}379]).
8 Flip unit
8.1 Overview of main assemblies
Service Manual SIPLACE Wafer System (SWS) 11/2018 173
8 Flip unit
According to the location there are two different variants that only differ in their mirrored arrange-
ment of the modules.
●
Flip unit SWS12 (1/3) [00386916-xx]
●
Flip unit SWS12 (2/4) [00385832-xx]
The flip unit is located on the basic SWS unit.
8.1 Overview of main assemblies
Fig.224: Main flip unit assemblies
1. Flip head
2. Return unit
3. Flip unit base plate
4. Nozzle support