00195982-03_SM_SWS_EN.pdf - 第272页
12 Wafer stretcher 12.2 Detailed description of "wafer stretching" procedure 272 Service Manual SIPLACE Wafer System (SWS) 11/2018 Fig.371: ● The Z axis for the flip unit now moves downwards. ● The camera (C) …
12 Wafer stretcher
12.2 Detailed description of "wafer stretching" procedure
Service Manual SIPLACE Wafer System (SWS) 11/2018 271
Fig.369:
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The clamping ring (R) is now moved upwards.
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This "stretches" the wafer foil (stretch).
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This stretching forces an expansion of the space between the dies (X).
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The camera (C) can now clearly recognize the die (GOOD).
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This space (X) guarantees a reliable ejection and pickup process as the dies no longer touch
and the die edges no longer rub against one another ("chipping").
Fig.370:
●
The die ejector moves upwards until the surface of the cap touches the wafer foil.
12 Wafer stretcher
12.2 Detailed description of "wafer stretching" procedure
272 Service Manual SIPLACE Wafer System (SWS) 11/2018
Fig.371:
●
The Z axis for the flip unit now moves downwards.
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The camera (C) can still recognize the die clearly.
Fig.372:
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The flip unit now moves downwards with the nozzle, until the nozzle touches the die surface.
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The cap on the die ejector unit then also has contact with the underside of the wafer foil and
therefore to the underside of the die.
12 Wafer stretcher
12.2 Detailed description of "wafer stretching" procedure
Service Manual SIPLACE Wafer System (SWS) 11/2018 273
Fig.373:
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Once the nozzle touches the die, the vacuum present causes the die to adhere to the nozzle.
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The die ejector needle now moves upwards and lifts the die off the foil.
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The flip unit Z axis now synchronously moves the die ejector needle upwards for the ejection
process.
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The die is held on the nozzle by the vacuum.
Fig.374:
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The die is fully released from the wafer foil.
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The Z axis of the flip unit moves right up and the component picked up can be processed by
the CA machine.