00195982-03_SM_SWS_EN.pdf - 第34页

2 Overview of the SIPLACE wafer system (SWS) 2.4 Description of SWS assemblies 34 Service Manual SIPLACE Wafer System (SWS) 11/2018 Fig.15: Die ejector basic unit 1. Z axis 2. Z axis movement (pneumatic)

2 Overview of the SIPLACE wafer system (SWS)

2.4 Description of SWS assemblies

Service Manual SIPLACE Wafer System (SWS) 11/2018 33

2.4.1.4 Die ejector

According to the location (2/4 or 1/3) there are two different variants that only differ in their mirrored

arrangement of the modules.

Fig.14: Main die ejector assemblies

1. Ejector tool

2. Z axis

2 Overview of the SIPLACE wafer system (SWS)

2.4 Description of SWS assemblies

34 Service Manual SIPLACE Wafer System (SWS) 11/2018

Fig.15: Die ejector basic unit

1. Z axis

2. Z axis movement (pneumatic)

2 Overview of the SIPLACE wafer system (SWS)

2.4 Description of SWS assemblies

Service Manual SIPLACE Wafer System (SWS) 11/2018 35

2.4.1.5 Die ejector

Fig.16: Ejector tool with magnetic table (new)

Fig.17: Ejector tool with bayonet lock (old)

1. Vacuum cap

2. Ejector needle

The die ejector is used to release the die from the wafer foil. It consists of a

basic unit and the ejector tool.