00195982-03_SM_SWS_EN.pdf - 第28页
2 Overview of the SIPLACE wafer system (SWS) 2.4 Description of SWS assemblies 28 Service Manual SIPLACE Wafer System (SWS) 11/2018 2.4.1.1 Flip unit Fig.9: Flip unit 1. Flip head 2. Nozzle/tool support
2 Overview of the SIPLACE wafer system (SWS)
2.4 Description of SWS assemblies
Service Manual SIPLACE Wafer System (SWS) 11/2018 27
2.4 Description of SWS assemblies
2.4.1 Supply unit
Fig.8: Supply unit
1. Manometer for compressed air supply
2. Power supply
3. Communication with the placement machine
4. CAN bus
5. Compressed air connection (modified adapter dummy plug [03011592‑xx]
6. LAN1
7. LAN2
2 Overview of the SIPLACE wafer system (SWS)
2.4 Description of SWS assemblies
28 Service Manual SIPLACE Wafer System (SWS) 11/2018
2.4.1.1 Flip unit
Fig.9: Flip unit
1. Flip head
2. Nozzle/tool support
2 Overview of the SIPLACE wafer system (SWS)
2.4 Description of SWS assemblies
Service Manual SIPLACE Wafer System (SWS) 11/2018 29
Fig.10: Flip head - view from the front
1. Nozzle support, segment 1
2. Nozzle support, segment 2
3. Motor for linear motion
4. Motor for 180° rotation
The flip unit takes the ejected die from the wafer foil. In flip chip mode, it rotates the die by 180°into
the pickup position for the placement head. In die attach mode, the flip unit rotates the die by ap-
prox. 130° into the transfer position for the die attach unit.
The flip unit has two nozzles arranged at 180° to one another. This enables the system in flip chip
mode to pick up a new die from the wafer at the same time as the placement head performs
pickup.
The flip unit can use both the standard SIPLACE nozzles (9xx) and the special adapters for the die
bonding tool. As in the case of other SIPLACE placement machines, the dies are attached to the
nozzles by a vacuum.
The flip unit has a rotation axis and a Z axis, driven by a linear motor. In the optional die attach
mode, a further linear motor is included to transfer the dies to the die attach head. The rotary axis
is responsible for the rotation into the 180° position (flip chip mode) or 130° position (die attach
mode). The Z-axis moves the segment during the pick process. The optional linear motor in the die
attach mode moves the segment for transfer of the die to the die attach head.