00195982-03_SM_SWS_EN.pdf - 第45页

2 Overview of the SIPLACE wafer system (SWS) 2.4 Description of SWS assemblies Service Manual SIPLACE Wafer System (SWS) 11/2018 45 Safety instructions Fig.26: Wafer support with SIPLACE SWS wafer stretcher CAUTION Risk…

2 Overview of the SIPLACE wafer system (SWS)

2.4 Description of SWS assemblies

44 Service Manual SIPLACE Wafer System (SWS) 11/2018

2.4.2.6 SIPLACE SWS wafer stretcher

The SWS can be configured with the SIPLACE SWS wafer stretcher option for two different wafer

supports (8" or 12").

The SIPLACE SWS wafer stretcher consists of the following main assemblies.

●

Stretcher

The stretcher stretches the wafer foil to increase the distances of the dies on it.

●

Heater

The heater consists of a heating element and a fan. The fan blows heated air on to the wafer

foil. This reduces the sag of the wafer foil (less than 9 mm), so that the wafer can be transpor-

ted back into the magazine.

Fig.25: Wafer support with SIPLACE SWS wafer stretcher

1. Stretcher frame with wafer support

2. Heater fan

2 Overview of the SIPLACE wafer system (SWS)

2.4 Description of SWS assemblies

Service Manual SIPLACE Wafer System (SWS) 11/2018 45

Safety instructions

Fig.26: Wafer support with SIPLACE SWS wafer stretcher

CAUTION

Risk of burns due to high temperatures!

The heating can reach temperatures of up to 60°C.

► Do not reach into the area around the fan with your hands.

► Be careful when touching the wafer support.

Technical data

SIPLACE SWS wafer stretcher Value

Wafer frame 8" or 12"

Wafer width for 8" wafer frame 10.5" and 10.8"

Weight of stretcher with wafer support 8" 14kg

Weight of stretcher with wafer support 12" 15kg

Wafer frame (metal and plastic) Up to 3.5 mm thick

Minimum operating pressure 4.0bar

Maximum operating pressure 5.5bar

Travel time for full stroke Approx. 2 seconds

Lowering time Approx. 2 seconds

Stretch factor (adjustable) *1) 2 mm, 4 mm, 6 mm, 8 mm

Clamping velocity for wafer centering 0.5 to 1.0 seconds

*1) The specified stretching heights relate to a wafer frame with a thickness of 1.5 mm. The fol-

lowing applies to other wafer frame thicknesses:

Stretching factor = set stretching height + frame thickness -1.5 mm

NOTICE

Definition

Extensive tests with various materials were conducted during the product development

phase.

However, due to the multitude of wafer foils available, the many die sizes and wafer frames,

we are unable to make a general function promise for all imaginable materials. New materi-

als should therefore be tested in advance, if there is any doubt.

Placement accuracy and performance values

See the specifications for the SIPLACE CA-Series, SC 708.0, edition 12/2014

2 Overview of the SIPLACE wafer system (SWS)

2.4 Description of SWS assemblies

46 Service Manual SIPLACE Wafer System (SWS) 11/2018

Description

While picking dies from a wafer, there is a danger that the die could begin to tilt. This can be

caused by an irregular adhesion of the die on the foil or an eccentric positioning of the needle. In

the case of dies which are positioned closely to one another, the neighboring die could be touched

and mutual damage can not be ruled out.

To prevent this, the wafer foil is stretched before the die is picked. This increases the distances

between the dies on the foil and makes it possible to pick dies without risks. The larger distances

between the dies also makes it easier for the Vision system to recognize them.

After the downholder plate has moved up and the clamp has been opened, the wafer foil sags. A

wafer with a sagging foil can not be moved back into the magazine.

Once the clamp and the downholder plate have been opened, the stretched wafer foil is warmed up

by the heater module. This shrinks the wafer foil (sag less than 9 mm) so that it can be moved back

into the magazine.

Fig.27: SIPLACE SWS wafer stretcher with stretched wafer foil

1. Stretched wafer foil in the SIPLACE SWS wafer stretcher