RS-1_instruction manual.pdf - 第1048页

Gl oss ary A − 2  AT C An ab br evi ati on f or Auto T ool C hang er In RS-1 /1R uni t, nozzl es t hat are s ui ted t o th e com ponent si ze ar e m ounted on t he h ead in order to c onduc t com ponent p ic ki ng and p…

Glossary

A−1

Glossary

− List of contained terms

ATC

Bad mark

BGA, FBGA

BOC alignment

BOC mark

Centering

Component data

Component shape (“Comp

Shape”)

Coordinate

Current memory

Data compatibility

Directory

EPU

Extension

Feed

Feeder (and similar units)

Feeder bank

Head (unit)

HMS

I/O safety direction setting

IC mark

IFS-NX

JaNets

Land

Lead

Machine coordinate origin

Mounter

MTC

MTS

Nozzle

OCC

Off-line

On-line

Origin return

Pick data

Picking

Pitch

Placement

Placement data

Placement station

PLCC

Program (production

program)

PWB data

PWB origin (coordinates of

the origin)

QFP

SOJ

SOP

Square chip

Support table

S-VCS

Teaching

Tray holder

VCS (unit)

Verify

Vision data

Glossary

A−2

 ATC

An abbreviation for Auto Tool Changer

In RS-1/1R unit, nozzles that are suited to the component size are mounted on the head in

order to conduct component picking and placement. This is the storage place for these

nozzles.

 Bad mark

A bad mark is as follows: On a gang processing PWB, a mark (bad mark) is affixed to a specific

part of the circuit that the user does not want to execute placement, the coordinates of the bad

mark are entered into Bad mark position of PWB data, and during production, the bad mark

reader moves to the coordinate position entered by the PWB data, and the OCC checks the

presence of bad mark, and as a result, the component will not be placed for a circuit that has a

bad mark

PWBs available for this system are gang processing PWBs. PWBs of single PWB processing

are not applicable. Use a bad mark with the diameter of 2.5 mm φ or larger, and the color

must be distinct in its light and shade.

Use of a white bad mark is preferable for a PWB of which color is relatively strong, such as

Glass Epoxy PWB while use of a blackish bad mark for a PWB of which color is light such as

ceramic PWB.

 BGA, and FBGA

An abbreviation for Ball Grid Array, and Fine pitch BGA.

Solder bumps (balls) are arrayed in a grid pattern on the component placement surface. This

arrangement has a feature of having resistance against deformation and easiness of handling.

Since they were recently employed in Intel's peripheral circuits for personal computer, they are

adopted in the field of personal computer in a significant upsurge.

 BOC alignment

This function recognizes the BOC mark and

calculates the correction rate by means of BOC

mark.

When to use BOC mark for placement, BOC

Alignment must be acquired. Otherwise,

placement position will be slipped when teaching of

placement position is conducted.

 BOC mark

An abbreviation for Board Offset Correction mark.

A mark or marks provided on PWB to correct slippage between the periphery used in PWB

positioning or machine processing part such as positioning pin hole and the pad (land).

In RS-1/1R unit, two or three points of marks may be specified. Use of two points can correct

rotation and expansion/contraction. If three points are used, X and Y distortion can be

corrected in addition to the above.

Glossary

A−3

 Centering

Centering is a system that detects the position, angle, and picking position of the component

before placing the picked up component on the PWB, and corrects the position slippage, and

angle slippage of the component that are obtained from the above actions in order to place the

component on the PWB.

Centering is divided into two types. The first type is called “LNC120.” This type uses a

dedicated recognition unit and rotates a component by applying light to the component, so that

a pick offset or angle offset can be found out for the center position of the component and then

this offset can be corrected. Since no contact with the component is made except picking, this

centering type is called “touchless centering.”

The other type is “image centering” and is called “Vision centering” or “VCS centering.”

Components with a lead pitch of less than 0.65 mm, for which LNC120 cannot perform

centering, can be placed through inspection by using a dedicated camera. The camera to be

used for this purpose is called VCS camera. This camera is mainly used for centering of QFP,

PLCC, connector, BGA, etc. It permits inspecting pitch, lead bend, lad length, and poll

deformation that cannot be inspected by LNC120. Furthermore, if an optional VCS camera

(0.3 mm VCS) is used, components with a finer lead pitch of 0.3 to 0.4 mm can be placed by

centering. This option corrects an offset for the center position and angle of the component

(However, this is a factory-delivery option) in the same way as centering by LCN120.

 Component data

Based on the Component name entered by the previous placement data, entry of information of

that component is made on the component data. In addition to the above, setting of

packaging style of the component, the speed of X, Y, Z, and θ when placing the component,

various checks, and inspection functions are made here.

 Component shape (“Comp Shape”)

The “Comp Shape” sets a shape of a component for the system to recognize it roughly when it

centers the component with LNC120.

Five shapes of components are to be measured with this LNC120: they are indicated with

“Config1,” “Config2,” “Config3,” “Config5” and “Config0” respectively.

0.25mm or more