RS-1_instruction manual.pdf - 第396页

Part 1 B asic O peration Chapter 4 Cr eating a Produc tion Progra m 4- 61 Component type Measur ement posit ion Laser heigh t (mm) SOT - γ γ = 0.25 SOP HSOP - 0.7 × t SOJ - 0.65 × t QFP - 0.7 × t QFN t - 0.5 × t QFJ(PLCC…

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Part 1 Basic Operation Chapter 4 Creating a Production Program
4-60
③ Laser height
Set the measurement height attained when the system centers a component with laser.
Enter the distance from the nozzle tip to the measurement position to which the laser beam
is irradiated.
The initial value is automatically determined by the component height and the component
type. However, some components may require alteration of the initial value. If such portions
that do not intercept laser rays completely as the end of lead and the top surface/bottom
surface of component are at the laser plane (laser height), a laser recognition error may
occur. Select a height that assures stable recognition (for example, if the position measured
with laser is cylindrical-shaped or transparent-colored).
♦ Default Laser height
Default laser heights are set for some component types and heights.
Table shows the relation between component heights and default laser heights.
Component type Measurement position Laser height (mm)
Square chip
t
- -
2
Square chip
(LED)
- (t –0.15)
MELF
t
- -
2
Aluminum
electrolytic
capacitor
- (t –β)
β= 0.35
GaAsFET
-0.5
2
t
-
部品高さ t
レーザ測定位置
部品高さ t
レーザ測定位置
- (t - 0.15)
2
t
-
部品高さ t
レーザ測定位置
部品高さ t
レーザ測定位置
- ( t -β)
β
Component height
Measurement position
with laser
Component height
Measurement
position with laser
Measurement
position with laser
Component height
Component height
Measurement
position with laser
Measurement position
with laser
Component height
-Z
0
Nozzle tip
Laser height
Part 1 Basic Operation Chapter 4 Creating a Production Program
4-61
Component type Measurement position Laser height (mm)
SOT
-γ
γ= 0.25
SOP
HSOP
-0.7×t
SOJ
-0.65×t
QFP
-0.7×t
QFN
t
-0.5×t
QFJ(PLCC)
レーザ測定位置
モールド部
部品高さ
t
-0.65t
-0.65 × t
PQFP (BQFP)
-0.45×t
TSOP
-0.7×t
TSOP 2
-0.7×t
BGA
FBGA
-0.86×t
レーザ測定位置
モールド部
部品高さ
t
-0.5t
Component height
Measurement position
with laser
Molding
Component height
Measurement position
with laser
Molding
Component height
Molding
Measurement position
with laser
Component height
Measurement position
with laser
Molding
Measurement
position with laser
Component height
Measurement position
with laser
Molding
Component height
Component height
Molding
Measurement position
with laser
Measurement
position with laser
Molding
Component height
Molding
Component
height
Measurement
position with laser
Molding
Component height
Measurement
position with laser
-0.45t
Part 1 Basic Operation Chapter 4 Creating a Production Program
4-62
Component type Measurement position Laser height (mm)
Network resistor
Same as that of the
square chip
Trimmer - (t – 0.7)
Unidirectional lead
connector
Bidirectional lead
connector
Z-lead connector
-0.5×t
J-lead socket 0
Gull-wing socket
0
Socket with
bumper
0
Other components
-0.5×t
Note 1: If an angle error occurs when a square chip component such as a 0603 resistor is placed on a
board, change the value specified in the “Laser height” menu item on the “Expansion” tab of the
“Component” data screen to almost “-t/3 (default: -t/2), that is, toward the top side of the
component. It may improve the current condition.
Molding
Component height
Measurement position
with laser
Measurement
position with laser
Component height
Component height
Measurement
position with
laser
-0.5
Measurement
position with laser
Component height
Component height
Measurement
position with
laser
Component height
Measurement
position with laser
Molding
Component height
Measurement
position with
laser