RS-1_instruction manual.pdf - 第42页

Part 1 B asic O peration Chapter 1 Overv iew of the Machine 1- 24 Comp onent pl acem ent a ccuracy XY (when a co mponent i s recogni zed with a V CS) Unit: μ m Component ty pe Recognition w ith a VCS Remarks Aluminum el …

Part 1 Basic Operation Chapter 1 Overview of the Machine

1-23

Placement accuracy

(1) Placement accuracy (X, Y)

The following table lists the placement accuracy data for different types of components.

A poorer accuracy than the value described below results depending on the components that

may have an edge or plastic mold burrs at the area detected with the laser align function, and

that may have a moving part to be detected with respect to the pick port.

Component placement accuracy XY

(when a component is recognized with laser or board reference mark)

Unit: μm

Component type LNC120-8 Remarks

Square chip 03015, 0402

± 35

When the speed for moving down to place a component on a

board is set to “Slow 2”

Note: If a 03015 component cannot be recognized with laser

stably due to its shape (for example, if a string art image is not

displayed normally), use a VCS (10-mm field of view camera)

(optional).

Square chip 0603, 1005, 1608 or

± 50

Square chip (LED)

± 50

The placement accuracy of a square chip LED component shall

be attained when it can be recognized

MELF

± 100

SOT

± 150

See Note 2

Aluminum electrolytic capacitor

± 300

SOP, TSOP

Burr on one side

150 μm or less

± 150

See Note 3

In the direction

parallel to a lead

± 200

This accuracy shall be measured at the cross-section

measured with laser.

PLCC, DOJ

± 200

QFP,(Pitch: 0.8 or more)

± 100

See Note 3

QFP,(Pitch: 0.65)

± 50

See Note 3

BGA

± 100

Other large components

± 300

The accuracy obtained when the component placement

position is corrected according to the recognized component

image shall be an absolute value from a component reference

mark or a board reference mark.

Part 1 Basic Operation Chapter 1 Overview of the Machine

1-24

Component placement accuracy XY (when a component is recognized with a VCS)

Unit: μm

Component type

Recognition with a VCS

Remarks

Aluminum electrolytic capacitor

±150

S OP,

TSOP

Right angles to a lead

±80

Direction parallel to a lead

±120

See Note 3

PLCC, SOJ

±80

QFP(Pitch: 0.65 or more)

±40

Component whose

image is to be divided

for recognition

Right angles to a

lead

±60

Direction parallel

to a lead

±120

See Note 3

BGA

±80

See Note 4

Outline-recognized component ±120

This accuracy is realized only when the

following JUKI accuracy-evaluating jig is

used to detect four sides, four corners and

the center of gravity of a component.

Square chip 0201, 03015, 0402 ±35

When the speed for moving down to place a

component on a board is set to “Slow 2”

Be sure to use a CVS nozzle to prevent a

component from being recognized by

mistake.

Square chip 0603 or more ±50

When the speed for moving down to place a

component on a board is set to “Slow 2”

Be sure to use a CVS nozzle to prevent a

component from being recognized by

mistake.

When a component positioning mark is used:

PLCC, SOJ

±80

QFP(Pitch: 0.65 or more)

±40

QFP(Pitch: 0.5,0.4,0.3) ±30

This accuracy shall be a repeat accuracy at

the same component placement position.

Unidirectional lead

connector,

bidirectional lead

connector (Pitch 0.5)

Right angles to a

lead

±40

Direction parallel

to a lead

±120

See Note 3

Component whose

image is to be divided

for recognition

Right angles to a

lead

±60

Direction parallel

to a lead

±120

See Note 3

BGA

±80

FBGA

±60

See Note 4

Note 1: The ambient temperature for guaranteeing the accuracy is from 20

℃

to 25

℃

Note 2: The allowable distance “d” between the center of the lead rising section or of the body (Sc shown

in the figure) and the center of leads (Lc shown in the figure) of a component such as a QFP, SOP

and SOT is shown in the table below. If a component does not satisfy this allowable distance

requirement, the machine cannot attain the component placement accuracy described above.

Center of the body and that of the leads

Lead pitch

Allowable value “d”

□ 24.5 or less More than □ 25.4 to

□ 33.5 or less

0.8 or more

73μm 52μm

0.65

15μm 15μm

Allowable value “d”

Part 1 Basic Operation Chapter 1 Overview of the Machine

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Note 3: Right angles to a lead and the direction parallel to a lead described for the accuracy of an SOP,

unidirectional lead connector, and bidirectional lead connector and a component whose image is

divided to be recognized are shown in the figure below.

Note 4: Since a BGA component position cannot be corrected with recognition of its image under the

following conditions, the component placement accuracy cannot be guaranteed.

①

Contrast between a solder ball and the surface of a board to which the solder ball is applied is

not clear enough. (Excluding a BGA whose body is ceramic)

②

A pattern whose thickness is the same as the diameter of a solder ball is connected to the ball,

and the ball cannot be recognized separately.

③

There is a through-hole or similar hole whose diameter is the same as that of a solder ball on

the board to which the ball is applied.

Right angles to a lead

Direction parallel to a lead

Right angles to a lead

Direction parallel

to a lead

Direction parallel

to a lead