RS-1_instruction manual.pdf - 第45页

Part 1 B asic O peration Chapter 1 Overv iew of the Machine 1- 27 Compon ent placeme nt accuracy θ (whe n a compo nent is reco gnized wit h a VCS) Unit: ° Component siz e * This size indicat es the distanc e between tw o…

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Part 1 Basic Operation Chapter 1 Overview of the Machine
1-26
(2) Placement accuracy (θ)
Component placement accuracy
θ (when a component is recognized with laser)
Unit: °
Component size
* This size indicates the
distance between two
terminals.
LNC120-8 Remarks
03015 square chip - ±6
Note: If a 03015 component
cannot be recognized with laser
stably due to its shape (for example,
if a string art image is not displayed
normally), use a VCS (10-mm field
of view camera) (optional).
0402 square chip
-
±5
0603 square chip
-
±3
1005 square chip
-
±2.5
1608 or larger square chip
-
±2
MELF
-
±3
SOT
-
±3
Aluminum electrolytic capacitor
-
±10
SOP, TSOP
50 mm or less
±0.30
20 mm or less
±0.33
10 mm or less
±0.67
PLCC
－
±0.52
SOJ
－
±0.52
QFP (Pitch: 0.8 or more)
50 mm or less
±0.33
30 mm or less
±0.37
20 mm or less
±0.44
QFP (Pitch: 0.65)
50 mm or less
±0.30
10 mm or less
±0.33
BGA
(Distance between the opposite
sides of the ball outer
circumference)
50 mm or less
±1.23
20 mm or less ±1.28
Part 1 Basic Operation Chapter 1 Overview of the Machine
1-27
Component placement accuracy
θ (when a component is recognized with a VCS)
Unit: °
Component size
* This size indicates the distance
between two terminals.
VCS recognition
Aluminum electrolytic capacitor
－
±0.6
SOP, TSOP
50 mm or less
±0.12
40 mm or less
±0.15
30 mm or less
±0.21
20 mm or less
±0.31
10 mm or less
±0.65
PLCC
－
±0.3
SOJ
－
±0.5
QFP
(Pitch: 0.65 or more)
50 mm or less
±0.05
40 mm or less
±0.07
30 mm or less
±0.1
20 mm or less
±0.2
10 mm or less
±0.3
QFP
(Pitch: 0.5, 0.4 and 0.3)
50 mm or less
±0.05
40 mm or less
±0.07
30 mm or less
±0.1
20 mm or less
±0.2
10 mm or less
±0.3
Bidirectional lead connector
(Pitch: 0.5)
50 mm or less
±0.05
40 mm or less
±0.07
30 mm or less
±0.1
20 mm or less
±0.2
10 mm or less
±0.3
Unidirectional lead connector
(Pitch: 0.5)
50 mm or less
±0.12
40 mm or less
±0.15
30 mm or less
±0.21
20 mm or less
±0.31
10 mm or less
±0.65
Component whose image is
divided to be recognized.
150 mm or less
±0.065
100 mm or less
±0.09
75 mm or less
±0.1
50 mm or less
±0.2
30 mm or less
±0.3
BGA
(Distance between the opposite
sides of the ball outer
circumference)
50 mm or less
±0.1
40 mm or less
±0.12
30 mm or less
±0.18
20 mm or less
±0.3
FBGA
(Distance between the opposite
sides of the ball outer
circumference)
50 mm or less
±0.1
40 mm or less
±0.12
30 mm or less
±0.18
20 mm or less
±0.3
Outline-recognized component
50 mm or less
±0.4
40 mm or less
±0.45
30 mm or less
±0.55
20 mm or less
±0.85
0201 square chip
－
±8
03015 square chip
－
±6
0402 square chip
－
±5
0603 square chip
－
±3
1005 square chip
－
±2.5
1608 or larger square chip
－
±2
Part 1 Basic Operation Chapter 1 Overview of the Machine
1-28
Note 1: The described angle of a 0402 component shall be applied only if the XY positioning accuracy is
±0.040 mm and an IC is placed in the two-thirds or larger area of the pad whose width is 0.2 mm.
Note 2: Notes on recognition with laser are the same as those on the machine position (XY).
Note 3: The general-purpose vision component placement accuracy widely varies depending on the
component characteristics and/or lighting conditions.
Example: The placement accuracy of a 1005 resistor chip becomes ±3°(3σ) if it is recognized as a
general-purpose vision component. You have to pay attention to the following points:
- Turn off the coaxial light, and set the brightness of the red side light and bottom light to a
higher value to adjust the lights so that any nozzle cannot be shot with the VCS.
- The dedicated nozzle may be required depending on the light reflection characteristics of a
component.
Note 4: The component placement accuracy to be applied when a component is recognized with laser,
and then its position is corrected shall be an absolute value from a component reference mark or
board reference mark too.
Note 5: When a component consists of two or more parts such as a BGA socket, the parts shall not rattle.
If any of them rattles, the component placement accuracy cannot be guaranteed.