RS-1_instruction manual.pdf - 第1055页

Gl oss ary A − 9  S- VC S An ab br evi ati on f or Sc anning Vi sion C enter ing Syste m . This s ystem c enters a com p onent wi th a VC S w hi le m o v ing a head that has pi ck ed up a c omp onent ab ov e the VC S in…

100%1 / 1058
Glossary
A−8
Placement station
A PWB positioning section. This is a unit that fixes a printed wiring board to the given position.
PLCC
An abbreviation for Plastic Leaded Chip Carrier. Also expressed as QFJ.
A component with J-shaped leads each on four sides. Components of this type are suitable
for automatic placement owing to its high lead position accuracy and resistance to deformation.
Program (production program)
This is an aggregation of commands and mounting position data to mount electronic
components on a printed wiring board.
PWB data
In the PWB data, enter the recognition method when BOC marks are used, and PWB
information such as PWB home position. When BOC marks are used, the mark information is
transmitted to the machine by “Recognition teaching” by using [Teaching] in the operation area.
PWB origin (the coordinate origin)
PWB origin is the origin to develop a BOC mark, a placement center position and so on.
Although we do not have any specified position for the PWB origin, it should be basically placed
on the PWB. If CAD data is present, the CAD origin will be the PWB origin on the program.
The coordinate system basically takes the left-hand direction as −X, the right-hand direction as
+X, the upward direction as +Y, and the downward direction as −Y viewed from the origin.
QFP
QFP (Quad Flat Package) means a component of gull-wing shape with leads in four directions.
The lead pitch is more shortened as the number of pins increases. It is featured by that it is a
small package suitable for products with a number of required leads and that appearance
inspection of solder connections is easy.
SOJ
SOJ (Small Outline J-bend Package) means a component of J-bend shape with leads in two
directions. It is featured by high resistance of leads against deformation, easy handling, and
low thermal resistance.
SOP
SOP (Small Outline Package) means a component of gull-wing shape with leads in two
directions. The features are: small size, small mounting area on PWB, easy visual inspection
of soldered connections and also easy correction with soldering iron.
Square chip
A square chip means a square component or similar one such as 1005 (width of 1.0 mm ×
height of 0.5 mm) and 1608 (width of 1.6 mm × height of 0.8 mm). Square chips include
different types such as resistance and capacitor.
Support table
A unit to support the printed wiring board.
Glossary
A−9
S-VCS
An abbreviation for Scanning Vision Centering System. This system centers a component
with a VCS while moving a head that has picked up a component above the VCS in the X
direction to control recognition of a component with its image.
This can recognize a component faster than the conventional image recognition devices.
Teaching
Teaching is to acquire coordinates using an HOD, also using OCC, head etc., and basically, it
is broadly divided into two types of teaching.
One is Teaching of coordinates, which means to acquire the location of specific unit's position
(placement position etc.) using an OCC etc. and make the machine learn the data.
The other is Teaching of recognition, which mainly performs BOC mark and IC mark's shape,
size, and contrast adjustment and setting of detection area and others using an OCC etc. in the
same manner in order to teach the machine.
For both of the above, the information of the coordinates and marks acquired by teaching will
be reflected in the production program.
Tray holder
A tray holder is equipment to supply tray components, and this item is supplied at customer's
option. A holder is used in production by attaching the holder to the feeder bank on the rear,
and putting tray components together with the tray on the holder. The program allows
maximum 20 types of trays to be attached to the holder.
VCS (unit)
This unit recognizes the shape of an electronic component (with leads or balls) and measures
the retaining posture.
The other system is Image centering, which is also called vision centering or VCS centering.
This centering system allows the mounter to inspect and place on a board a component whose
lead pitch is less than 0.65 mm (such a component cannot be centered with laser) by using the
dedicated camera.
The camera used in this operation is called a VCS camera. It is used mainly in centering of
QFP, PLCC, connector, BGA etc. and pitch, lead bend, lead length, ball deformation inspection
etc., for which laser is not effective, can be seen.
Further, use of the optional VCS camera (0.3 mm VCS) can perform centering placement of
those components with smaller lead pitch (lead pitch of 0.3 to 0.4 mm), where this is an option
to be set at the factory. This centering is similar to laser centering in the light of placement
through correction of slippage from the center position, angle of the component.
Verify (CVS
：
Component Verification System)
The verification function is an option to be installed at the factory and it measures a capacitor
capacity, a resistance value and polarity of a component.
When a production program is created or during PWB production, this function measures only
the first component to check to see if a feeder is not mounted erroneously. It also checks the
first component after components run out or the first component every time the specified
number of PWBs are produced during production.
Vision data
Vision data is created for only a component whose “Centering method” is set to “Vision” on the
“Component data” screen. Enter mainly the information necessary for vision recognition such
as lead (ball) pitch, lead length, and the number of QFP, BGA into this vision data.
JUKI Corporation
2-11-1, Tsurumaki, Tama-shi, Tokyo 206-8551, Japan
Phone +81-42-357-2289 Facsimile +81-42-357-2285
EU DECLARATION OF CONFORMITY
We hereby declare that the following our product conforms with the essential health and
safety requirements of EU Directive. This declaration of conformity is issued under the
sole responsibility of the manufacturer.
Product
:
High-Speed Flexible Modular Mounter
Model
:
RS-1/RS-1XL /RS-1R
Serial No.
:
Manufacturer
:
JUKI Corporation
2-11-1, Tsurumaki, Tama-shi, Tokyo 206-8551, Japan
Authorized person to
compile the technical file
:
Hiroaki Yamazaki
JUKI Automation Systems GmbH,
Neuburger Strasse 41, DE-90451 Nuremberg, Germany
Directive
:
Machinery Directive 2006/42/EC
EMC Directive 2014/30/EU
RoHS Directive 2011/65/EU
The above product has been evaluated for conformity with above directive using the
following European standards. The technical construction file (TCF) for this product is
retained at the above manufacturer’s location.
Machinery Directive:
EN IS012100: 2010, EN 60204-1: 2006+A1:2009, EN ISO13849-1: 2015
EMC Directive:
EN 61000-6-4: 2007/A1:2011, EN 61000-6-2: 2005,
EN 61000-4-2: 2009, EN 61000-4-3: 2006/A1：2008/A2:2010,
EN 61000-4-4: 2012, EN 61000-4-5: 2006, EN 61000-4-6: 2014,
EN 61000-4-8: 2010, EN 61000-4-11: 2004
RoHS Directive
EN 50581:2012
Place and date of issue :
Tokyo, Japan, May 7, 2019
Name/Title : Toshimasa Miura
Director/Managing Officer/Quality Assurance Dept.
Being the responsible person appointed and employed by the manufacturer.