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Part 2 D etaile d Descript ion of E ach Functi on Chapter 12 Handling th e Optional Device s 12 - 68 12.11.7.5 Flow for entering data When you pres s the ENTER key , you can update t he corresp onding value(s) and skip t…

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Part 2 Detailed Description of Each Function Chapter 12 Handling the Optional Devices
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Detailed setting
Detailed setting for solder recognition can be made with the [Solder Recognition Parameter
Setting] screen.
When you check the Auto-recognize with all parameterscheck box, the system changes all
of the parameters; lights, thresholds, and contrast pattern during automatic adjustment to
recognize solder with combinations of all patterns in order to adjust all parameters
automatically. Check this check box if the system cannot recognize solder stably even after
you select the <Auto Adjust> button on the Set Solder Recognition Parameterscreen.
12.11.7.4 Setting the component placement position to be corrected
Select [Edit] or [Browse] in the menu displayed when you adjust the cursor to the [Mark] at the
placement point that requires solder print mis-alignment correction.
Select the [Edit] command or the [Browse] command on the displayed menu. Since the current
screen is switched to the area fiducial screen, align the cursor with the line of the solder mark that
has been taught and select it, and select the [Set] button. The mark ID to be used for correction
is displayed at the mark position of a component placement point whose misalignment correction
has been finished.
* When you want to set two or more component placement points to correct them at the same
time, align the cursor with the Markcolumn displayed on the Placementdata screen and
drag all component placement points together to select them.
Part 2 Detailed Description of Each Function Chapter 12 Handling the Optional Devices
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12.11.7.5 Flow for entering data
When you press the ENTER key, you can update the corresponding value(s) and skip to the next
setting screen.
PREVIOUS
Cancel
Setting of a binary threshold value
Outer ring light adjustment
ENTER
OK
Setting of the solder shape
Solder detection threshold value setting
Automatic adjustment of
parameters
End of teaching
Setting a component placement
point to be corrected
Manual adjustment
A value is to be updated.
A value is not to be updated.
ENTER
OK
Part 2 Detailed Description of Each Function Chapter 12 Handling the Optional Devices
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12.11.8 Production
12.11.8.1 Processing an error at start of PWB production
When you try to use a mounter without this option and start PWB production with using the
screen-printed solder recognition function, the system displays the corresponding warning message
as a result of the check to be performed before PWB production starts.
When you try to start PWB production forcibly with pressing the START button, the dialog box
appears on the screen to state that the system cannot recognize any screen-printed solder.
Therefore, select whether to perform PWB production with ignoring recognition of the screen-printed
solder or cancel PWB production.
12.11.8.2 Error process during PWB production
You cannot select the menu item [Retry at taught position.], one of the production restart modes to
be displayed when a recognition error occurs. When you want to recognize solder without
changing the current position, select the menu item [Retry at same position.] and press the START
button. To perform teaching, select [OK] after teaching the middle point of a pair of solders, select
[Use taught position as center], and then press the [Production start] button.
To resume PWB production after releasing the clamp in the middle of PWB production, the system
cannot recognize solder at a position on which a component is already placed. Perform teaching
operation to set a solder screen-printing position again.
If a component is already placed on the solder mark position during continuous PWB production,
select the menu item [Use taught position as center.].
12.11.9 Operations with the Download production
To perform production online with enabling the “Offset Placement After Solder Screen-Printing”
check box, follow the instruction below.
Specify a station in the Placement data so that a component placemen point used as a solder
mark can be on the last station in the line that can recognize solder. However, when you are
to optimize a production program with specifying the menu item [Fix all feeder positions within a
cluster] or the menu item [Alternate bank sides by program] of the Multi-Optimizeoption of the
Production Planning utility, a station you specified is ignored. Therefore, these Multi-Optimize
options cannot be used.
When you use the Optimization function with the system software, you have to teach the solder
mark data with the main unit again.
When a line is composed of two or more devices, a downstream device cannot register a solder
recognition mark at a position on which a component is already placed with an upper stream
device. If the Offset Placement After Solder Screen-Printing option is used in a line, it is
recommended that you set a different solder recognition mark with each device and that you
register a solder recognition mark at a position on which a component is placed with the last
downstream device.