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Part 2 D etaile d Descript ion of E ach Functi on Chapter 12 Handling th e Optional Device s 12 - 69 12.11.8 Production 12.11.8.1 Processing an error at start of PWB p roduction When you tr y to use a mounter without thi…

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Part 2 Detailed Description of Each Function Chapter 12 Handling the Optional Devices
12-68
12.11.7.5 Flow for entering data
When you press the ENTER key, you can update the corresponding value(s) and skip to the next
setting screen.
PREVIOUS
Cancel
Setting of a binary threshold value
Outer ring light adjustment
ENTER
OK
Setting of the solder shape
Solder detection threshold value setting
Automatic adjustment of
parameters
End of teaching
Setting a component placement
point to be corrected
Manual adjustment
A value is to be updated.
A value is not to be updated.
ENTER
OK
Part 2 Detailed Description of Each Function Chapter 12 Handling the Optional Devices
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12.11.8 Production
12.11.8.1 Processing an error at start of PWB production
When you try to use a mounter without this option and start PWB production with using the
screen-printed solder recognition function, the system displays the corresponding warning message
as a result of the check to be performed before PWB production starts.
When you try to start PWB production forcibly with pressing the START button, the dialog box
appears on the screen to state that the system cannot recognize any screen-printed solder.
Therefore, select whether to perform PWB production with ignoring recognition of the screen-printed
solder or cancel PWB production.
12.11.8.2 Error process during PWB production
You cannot select the menu item [Retry at taught position.], one of the production restart modes to
be displayed when a recognition error occurs. When you want to recognize solder without
changing the current position, select the menu item [Retry at same position.] and press the START
button. To perform teaching, select [OK] after teaching the middle point of a pair of solders, select
[Use taught position as center], and then press the [Production start] button.
To resume PWB production after releasing the clamp in the middle of PWB production, the system
cannot recognize solder at a position on which a component is already placed. Perform teaching
operation to set a solder screen-printing position again.
If a component is already placed on the solder mark position during continuous PWB production,
select the menu item [Use taught position as center.].
12.11.9 Operations with the Download production
To perform production online with enabling the “Offset Placement After Solder Screen-Printing”
check box, follow the instruction below.
• Specify a station in the Placement data so that a component placemen point used as a solder
mark can be on the last station in the line that can recognize solder. However, when you are
to optimize a production program with specifying the menu item [Fix all feeder positions within a
cluster] or the menu item [Alternate bank sides by program] of the “Multi-Optimize” option of the
Production Planning utility, a station you specified is ignored. Therefore, these Multi-Optimize
options cannot be used.
• When you use the Optimization function with the system software, you have to teach the solder
mark data with the main unit again.
• When a line is composed of two or more devices, a downstream device cannot register a solder
recognition mark at a position on which a component is already placed with an upper stream
device. If the Offset Placement After Solder Screen-Printing option is used in a line, it is
recommended that you set a different solder recognition mark with each device and that you
register a solder recognition mark at a position on which a component is placed with the last
downstream device.
Part 2 Detailed Description of Each Function Chapter 12 Handling the Optional Devices
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12.12 Component Verification (CVS)
12.12.1 Overview
It checks the resistance values, capacitances and the polarities of the components fed at the start
of production and the restart of production after a shortage of component.
This is a function to check a wrong selection of reel. Up to 8 components can be checked
sequentially.
Note If a component pick-up position or supply direction is incorrect, this function may not
check a component correctly.
12.12.1.1 Applicable Components
This function checks the following components:
Applicable component type
Inspection conditions
- Square chip
- Laminated ceramic capacitor
- Tantalum chip capacitor
- Aluminum electrolytic capacitor
- Chip film capacitor
- 2-pin diode
- A component on whose bottom and opposite side two
electrodes are located
- A component whose interelectrode distance is 10 mm or less
- A component whose size is □ 10.00 mm or less
- Small component 0201 or larger
* Diodes are limited to general commutating diodes (other than light-emitting diodes and zener
diodes).
12.12.1.2 Items to Be Checked
This function checks the following items:
(1) Resistance
Measurable range: 10 Ω to 1 M Ω Measurement precision: ± 5% See Note 1
(2) Capacitance
Measurable range: 100 pF to 100 μF Measurement precision: ± 20 % See Note 1
(3) Diode polarity
Forward voltage: 1.8 V or less Open voltage range: 0 V to 4.3 V
Note 1: Measurement precision refers to a measurement error for a tolerance of a
component, and you have to specify the upper limit and the lower limit in the
Component data of a production program considering this precision.
Example:
For a square chip whose resistance error is ± 5 %, specify “10” as the upper limit,
and “- 10” as the lower limit.
12.12.1.3 Verification checking function
Two modes: “Continuous check mode” and “Single check mode” are provided, and functions
available in each mode are described below.