RS-1_instruction manual.pdf - 第46页
Part 1 B asic O peration Chapter 1 Overv iew of the Machine 1- 28 Note 1: The des cribed angle of a 0402 co mponen t shall be a pplied only if t he XY position ing accur acy is ±0.040 m m and an IC is pla ced in the two …
Part 1 Basic Operation Chapter 1 Overview of the Machine
1-27
Component placement accuracy
θ (when a component is recognized with a VCS)
Unit: °
Component size
* This size indicates the distance
between two terminals.
VCS recognition
Aluminum electrolytic capacitor
－
±0.6
SOP, TSOP
50 mm or less
±0.12
40 mm or less
±0.15
30 mm or less
±0.21
20 mm or less
±0.31
10 mm or less
±0.65
PLCC
－
±0.3
SOJ
－
±0.5
QFP
(Pitch: 0.65 or more)
50 mm or less
±0.05
40 mm or less
±0.07
30 mm or less
±0.1
20 mm or less
±0.2
10 mm or less
±0.3
QFP
(Pitch: 0.5, 0.4 and 0.3)
50 mm or less
±0.05
40 mm or less
±0.07
30 mm or less
±0.1
20 mm or less
±0.2
10 mm or less
±0.3
Bidirectional lead connector
(Pitch: 0.5)
50 mm or less
±0.05
40 mm or less
±0.07
30 mm or less
±0.1
20 mm or less
±0.2
10 mm or less
±0.3
Unidirectional lead connector
(Pitch: 0.5)
50 mm or less
±0.12
40 mm or less
±0.15
30 mm or less
±0.21
20 mm or less
±0.31
10 mm or less
±0.65
Component whose image is
divided to be recognized.
150 mm or less
±0.065
100 mm or less
±0.09
75 mm or less
±0.1
50 mm or less
±0.2
30 mm or less
±0.3
BGA
(Distance between the opposite
sides of the ball outer
circumference)
50 mm or less
±0.1
40 mm or less
±0.12
30 mm or less
±0.18
20 mm or less
±0.3
FBGA
(Distance between the opposite
sides of the ball outer
circumference)
50 mm or less
±0.1
40 mm or less
±0.12
30 mm or less
±0.18
20 mm or less
±0.3
Outline-recognized component
50 mm or less
±0.4
40 mm or less
±0.45
30 mm or less
±0.55
20 mm or less
±0.85
0201 square chip
－
±8
03015 square chip
－
±6
0402 square chip
－
±5
0603 square chip
－
±3
1005 square chip
－
±2.5
1608 or larger square chip
－
±2
Part 1 Basic Operation Chapter 1 Overview of the Machine
1-28
Note 1: The described angle of a 0402 component shall be applied only if the XY positioning accuracy is
±0.040 mm and an IC is placed in the two-thirds or larger area of the pad whose width is 0.2 mm.
Note 2: Notes on recognition with laser are the same as those on the machine position (XY).
Note 3: The general-purpose vision component placement accuracy widely varies depending on the
component characteristics and/or lighting conditions.
Example: The placement accuracy of a 1005 resistor chip becomes ±3°(3σ) if it is recognized as a
general-purpose vision component. You have to pay attention to the following points:
- Turn off the coaxial light, and set the brightness of the red side light and bottom light to a
higher value to adjust the lights so that any nozzle cannot be shot with the VCS.
- The dedicated nozzle may be required depending on the light reflection characteristics of a
component.
Note 4: The component placement accuracy to be applied when a component is recognized with laser,
and then its position is corrected shall be an absolute value from a component reference mark or
board reference mark too.
Note 5: When a component consists of two or more parts such as a BGA socket, the parts shall not rattle.
If any of them rattles, the component placement accuracy cannot be guaranteed.
Part 1 Basic Operation Chapter 1 Overview of the Machine
1-29
Others
(1) Automatic tool changer (ATC)
The ATC can accommodate up to 45 nozzles.
When a large-sized nozzle is supported, the ATC can accommodate up to 38 nozzles.
(2) Transport rail height
900 mm ± 20 mm (For Japan, China and southeastern Asian countries models)
950 mm ± 20 mm (For the U.S.A. and Europe models)
(3) Air requirements
Air pressure: 0.5 ± 0.05 Mpa
Maximum air consumption: Vacuum pump 50 L/minute (standard condition), Ejector 200
L/min (standard condition)
Dry air: Dew point under pressure 10 °C or less (Oil and dust shall be
removed appropriately.)
* The following organic solvents and chemicals will deteriorate the polycarbonate resin of the
air combination case unit. Do not use them.
Type
Chemical name
Acid:
Hydrochloric acid, phosphoric acid sulfate, chromic acid
Alkali:
Caustic soda, caustic potash, slaked lime, ammonia water, sodium carbonate
Inorganic salt:
Soda sulfide, potassium nitrate, soda nitrate
Chlorine solvent:
Carbon tetrachloride, chloroform, ethylene chloride, methylene chloride
Aromatic type:
Benzene, cyclohexane, thinner
Ketone type:
Acetone, methyl ethyl ketone, cyclohexane
Alcohol type:
Ethyl alcohol, IPA, methyl alcohol
Oil type:
Gasoline, kerosene, water-soluble cutting oil (alkaline)
Ester type:
Dimethyl phthalate, diethyl phthalate
Ether type:
Methyl ether, ethyl ether
Amine:
Methyl amine
Others:
Screw lock liquid, salt water, leak taster
(4) Noise level: 73 dB (A) or less
(5) Country of manufacturing: Manufactured in Japan
(6) Environmental conditions
Environment requirements
During operation
Temperature 10℃ to 35℃
Accuracy guaranty
temperature
22℃ to 25℃
Humidity
50％RH or less (35℃)
Altitude 1000m or less
Transportation or
storage
Temperature -15℃ to 70℃
Humidity 20 to 95％RH (No condensation)
(7) Installation conditions
Overvoltage Category: Category III (IEC60664-1)
Pollution Degree: Degree 3 (IEC60664-1)