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Part 2 D etaile d Descript ion of E ach Functi on Chapter 12 Handling th e Optional Device s 12 - 67 ④ D etail ed setting Detailed set ting for sol der recognition can be m ade with the [S older Reco gni t ion Paramet er…

Part 2 Detailed Description of Each Function Chapter 12 Handling the Optional Devices

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③ Manual adjustment

From the [Solder Recognition Parameter Setting] screen select [Manual Adjustment] to

manually adjust settings for solder, pads, resist and so on as well as adjustments to contrast

recognition and parameters.

- These images are stored in the same manner as the recognized images.

Teach each position: solder, PWB (especially wiring section) and pad in the “Measurement

Position” column. Align the cursor with the edit box corresponding to the position to be

taught, and use the HOD to teach it. When the system finishes teaching the position, *

(asterisk mark) appears in the corresponding edit box.

You may not be able to set the pad position. If so, proceed to the next step (using the

<Contrast Check> button and the <Adjust Parameters> button).

Contrast Check

The system measures the brightness of each area according to the parameters

currently set, and displays whether the obtained contrast is enough or not on the

screen.

Adjust Parameters

The system measures the brightness of each area while changing the recognition

parameters such as the light parameter to adjust the parameters so that enough

contrast can be obtained. The adjustment result is displayed on the

“Auto-adjusted Results” screen. If the system cannot obtain enough contrast

and cannot adjust the parameters, set the positions to be recognized again.

Part 2 Detailed Description of Each Function Chapter 12 Handling the Optional Devices

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④ Detailed setting

Detailed setting for solder recognition can be made with the [Solder Recognition Parameter

Setting] screen.

When you check the “Auto-recognize with all parameters” check box, the system changes all

of the parameters; lights, thresholds, and contrast pattern during automatic adjustment to

recognize solder with combinations of all patterns in order to adjust all parameters

automatically. Check this check box if the system cannot recognize solder stably even after

you select the <Auto Adjust> button on the “Set Solder Recognition Parameter” screen.

12.11.7.4 Setting the component placement position to be corrected

Select [Edit] or [Browse] in the menu displayed when you adjust the cursor to the [Mark] at the

placement point that requires solder print mis-alignment correction.

Select the [Edit] command or the [Browse] command on the displayed menu. Since the current

screen is switched to the area fiducial screen, align the cursor with the line of the solder mark that

has been taught and select it, and select the [Set] button. The mark ID to be used for correction

is displayed at the mark position of a component placement point whose misalignment correction

has been finished.

* When you want to set two or more component placement points to correct them at the same

time, align the cursor with the “Mark” column displayed on the “Placement” data screen and

drag all component placement points together to select them.

Part 2 Detailed Description of Each Function Chapter 12 Handling the Optional Devices

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12.11.7.5 Flow for entering data

When you press the ENTER key, you can update the corresponding value(s) and skip to the next

setting screen.

Cancel

Setting of a binary threshold value

Outer ring light adjustment

ENTER

Setting of the solder shape

Solder detection threshold value setting

Automatic adjustment of

parameters

End of teaching

Setting a component placement

point to be corrected

Manual adjustment

A value is to be updated.

A value is not to be updated.

ENTER