RS-1_instruction manual.pdf - 第43页
Part 1 B asic O peration Chapter 1 Overv iew of the Machine 1- 25 Note 3: Righ t angles to a lead and the d irection p aralle l to a lea d describ ed for the accuracy of an SO P , unidirect ional lea d connect or , and b…
Part 1 Basic Operation Chapter 1 Overview of the Machine
1-24
Component placement accuracy XY (when a component is recognized with a VCS)
Unit: μm
Component type
Recognition with a VCS
Remarks
Aluminum electrolytic capacitor
±150
S OP,
TSOP
Right angles to a lead
±80
Direction parallel to a lead
±120
See Note 3
PLCC, SOJ
±80
QFP(Pitch: 0.65 or more)
±40
Component whose
image is to be divided
for recognition
Right angles to a
lead
±60
Direction parallel
to a lead
±120
See Note 3
BGA
±80
See Note 4
Outline-recognized component ±120
This accuracy is realized only when the
following JUKI accuracy-evaluating jig is
used to detect four sides, four corners and
the center of gravity of a component.
Square chip 0201, 03015, 0402 ±35
When the speed for moving down to place a
component on a board is set to “Slow 2”
Be sure to use a CVS nozzle to prevent a
component from being recognized by
mistake.
Square chip 0603 or more ±50
When the speed for moving down to place a
component on a board is set to “Slow 2”
Be sure to use a CVS nozzle to prevent a
component from being recognized by
mistake.
When a component positioning mark is used:
PLCC, SOJ
±80
QFP(Pitch: 0.65 or more)
±40
QFP(Pitch: 0.5,0.4,0.3) ±30
This accuracy shall be a repeat accuracy at
the same component placement position.
Unidirectional lead
connector,
bidirectional lead
connector (Pitch 0.5)
Right angles to a
lead
±40
Direction parallel
to a lead
±120
See Note 3
Component whose
image is to be divided
for recognition
Right angles to a
lead
±60
Direction parallel
to a lead
±120
See Note 3
BGA
±80
FBGA
±60
See Note 4
Note 1: The ambient temperature for guaranteeing the accuracy is from 20
℃
to 25
℃
.
Note 2: The allowable distance “d” between the center of the lead rising section or of the body (Sc shown
in the figure) and the center of leads (Lc shown in the figure) of a component such as a QFP, SOP
and SOT is shown in the table below. If a component does not satisfy this allowable distance
requirement, the machine cannot attain the component placement accuracy described above.
Center of the body and that of the leads
Sc
Lc
d
Sc
Lc
d
Lead pitch
Allowable value “d”
□ 24.5 or less More than □ 25.4 to
□ 33.5 or less
0.8 or more
73μm 52μm
0.65
15μm 15μm
Allowable value “d”
Part 1 Basic Operation Chapter 1 Overview of the Machine
1-25
Note 3: Right angles to a lead and the direction parallel to a lead described for the accuracy of an SOP,
unidirectional lead connector, and bidirectional lead connector and a component whose image is
divided to be recognized are shown in the figure below.
Note 4: Since a BGA component position cannot be corrected with recognition of its image under the
following conditions, the component placement accuracy cannot be guaranteed.
①
Contrast between a solder ball and the surface of a board to which the solder ball is applied is
not clear enough. (Excluding a BGA whose body is ceramic)
②
A pattern whose thickness is the same as the diameter of a solder ball is connected to the ball,
and the ball cannot be recognized separately.
③
There is a through-hole or similar hole whose diameter is the same as that of a solder ball on
the board to which the ball is applied.
Right angles to a lead
Direction parallel to a lead
Right angles to a lead
Right angles to a lead
Direction parallel
to a lead
Direction parallel
to a lead
Part 1 Basic Operation Chapter 1 Overview of the Machine
1-26
(2) Placement accuracy (θ)
Component placement accuracy
θ (when a component is recognized with laser)
Unit: °
Component size
* This size indicates the
distance between two
terminals.
LNC120-8 Remarks
03015 square chip - ±6
Note: If a 03015 component
cannot be recognized with laser
stably due to its shape (for example,
if a string art image is not displayed
normally), use a VCS (10-mm field
of view camera) (optional).
0402 square chip
-
±5
0603 square chip
-
±3
1005 square chip
-
±2.5
1608 or larger square chip
-
±2
MELF
-
±3
SOT
-
±3
Aluminum electrolytic capacitor
-
±10
SOP, TSOP
50 mm or less
±0.30
20 mm or less
±0.33
10 mm or less
±0.67
PLCC
－
±0.52
SOJ
－
±0.52
QFP (Pitch: 0.8 or more)
50 mm or less
±0.33
30 mm or less
±0.37
20 mm or less
±0.44
QFP (Pitch: 0.65)
50 mm or less
±0.30
10 mm or less
±0.33
BGA
(Distance between the opposite
sides of the ball outer
circumference)
50 mm or less
±1.23
20 mm or less ±1.28