RS-1_instruction manual.pdf - 第395页
Part 1 B asic O peration Chapter 4 Cr eating a Produc tion Progra m 4- 60 ③ Laser height Set the meas urement height att ained when the sy stem centers a compo nent with laser . Enter the dist ance fr om the nozzle t ip …
Part 1 Basic Operation Chapter 4 Creating a Production Program
4-59
(3) Centering
1) Laser centering
Set the menu items “Nozzle No.,” “Vacuum level,” “Laser height,” “Comp Shape” and
“Gripper nozzle data.”
① Nozzle No.
Select the number of the nozzle that can pick up a component stably from the pull-down list.
The standard nozzle numbers (7500 to 7509) and other nozzle numbers assigned by setup
are displayed.
② Vacuum level
During PWB production, whether a component was picked up normally is determined
according to the vacuum level to be applied when there is no component (set with the
“Machine setup” application) and this “Vacuum level” after pick-up operation. Enter the
vacuum pressure applied when a component is picked up with the nozzle whose number is
specified with the “Nozzle No.” Touch the displayed vacuum level, and enter the value.
Vacuum
pressure
Nozzle
No.
Applicable component type
-82.436 7500
1005, 1608, SOT (mold part 1.6 x 0.8),
2012, SOT (mold part 2.0 x 1.25)
-82.436 7501 0603
-82.436 7502 1005
-82.436 7503
1608, SOT (mold part 1.6 x 0.8),
2012, SOT (mold part 2.0 x 1.25)
-82.436 7504 2012, 3216, SOT (mold part 2.0 x 1.25), SOT23
-82.436 7505 Aluminum electrolytic capacitor (small), tantalum capacitor, trimmer
-82.436 7506
Aluminum electrolytic capacitor (medium),SOP (narrow width), HSOP
(narrow width), SOJ, connector
-82.436 7507
Aluminum electrolytic capacitor (large),SOP (wide width), HSOP (wide
width), TSOP, QFP, PLCC, SOJ, connector
-82.436 7508 QFP, PLCC
-82.436 7509 0402
The vacuum level displayed at first is a value for your reference. Since the finish of the surface of
a component varies depending on its manufacturer, operate the machine to measure the
component to use it.
Part 1 Basic Operation Chapter 4 Creating a Production Program
4-60
③ Laser height
Set the measurement height attained when the system centers a component with laser.
Enter the distance from the nozzle tip to the measurement position to which the laser beam
is irradiated.
The initial value is automatically determined by the component height and the component
type. However, some components may require alteration of the initial value. If such portions
that do not intercept laser rays completely as the end of lead and the top surface/bottom
surface of component are at the laser plane (laser height), a laser recognition error may
occur. Select a height that assures stable recognition (for example, if the position measured
with laser is cylindrical-shaped or transparent-colored).
♦ Default Laser height
Default laser heights are set for some component types and heights.
Table shows the relation between component heights and default laser heights.
Component type Measurement position Laser height (mm)
Square chip
t
- -
2
Square chip
(LED)
- (t –0.15)
MELF
t
- -
2
Aluminum
electrolytic
capacitor
- (t –β)
β= 0.35
GaAsFET
-0.5
2
t
-
部品高さ t
レーザ測定位置
部品高さ t
レーザ測定位置
- (t - 0.15)
2
t
-
部品高さ t
レーザ測定位置
部品高さ t
レーザ測定位置
- ( t -β)
β
Component height
Measurement position
with laser
Component height
Measurement
position with laser
Measurement
position with laser
Component height
Component height
Measurement
position with laser
Measurement position
with laser
Component height
-Z
0
Nozzle tip
Laser height
Part 1 Basic Operation Chapter 4 Creating a Production Program
4-61
Component type Measurement position Laser height (mm)
SOT
-γ
γ= 0.25
SOP
HSOP
-0.7×t
SOJ
-0.65×t
QFP
-0.7×t
QFN
t
-0.5×t
QFJ(PLCC)
レーザ測定位置
モールド部
部品高さ
t
-0.65t
-0.65 × t
PQFP (BQFP)
-0.45×t
TSOP
-0.7×t
TSOP 2
-0.7×t
BGA
FBGA
-0.86×t
レーザ測定位置
モールド部
部品高さ
t
-0.5t
Component height
Measurement position
with laser
Molding
Component height
Measurement position
with laser
Molding
Component height
Molding
Measurement position
with laser
Component height
Measurement position
with laser
Molding
Measurement
position with laser
Component height
Measurement position
with laser
Molding
Component height
Component height
Molding
Measurement position
with laser
Measurement
position with laser
Molding
Component height
Molding
Component
height
Measurement
position with laser
Molding
Component height
Measurement
position with laser
-0.45t