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SEMI E135-0704 © SEMI 2004 7 Tim e D el ay NOTE: These data are for conditions where the r equested power went from 0% to 100% of the full power of the RF Generator being tested. Figure 5 Example of Digital Oscillosco pe…

SEMI E135-0704 © SEMI 2004 6

NOTE: These data are for conditions where the requested power went from 33% to 3% of the full power of the RF Generator

being tested.

Figure 3

Example of Digital Oscilloscope Data that Shows the Transient Response of the RF Output Power (Lower

Trace) Due to a Change in Set Point Signal (Upper Trace)

RF Signal Sample

irectional or

ondirectional

RF Powe

Mete

High-Power

RF Dummy

Load

Generator

(

DUT

)

RF Rectifier

Diode Detecto

Digital Scope

RF Enable

Signal Generato

RF Set-Point

Signal Generato

NOTE: If cable assemblies are used between the output of the RF Generator (DUT) and the High-Power Dummy Load, they shall

have the same nominal impedance as the DUT and shall have a power handling capability that is consistent with the maximum

output power of the RF Generator (DUT).

Figure 4

Schematic of the Test Setup for the Measuring the Transient Response of the RF Generator (DUT) as a

Function of a Change in the RF Enable Signal

SEMI E135-0704 © SEMI 2004 7

Time Delay

NOTE: These data are for conditions where the requested power went from 0% to 100% of the full power of the RF Generator

being tested.

Figure 5

Example of Digital Oscilloscope Data that Shows the Transient Response and Time Delay of the RF Output

Power (Upper Trace) Due to a Change in the RF Enable Signal (Lower Trace)

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SEMI E136-1104 © SEMI 2004 1

SEMI E136-1104

TEST METHOD FOR DETERMINING THE OUTPUT POWER OF RF

GENERATORS USED IN SEMICONDUCTOR PROCESSING

EQUIPMENT RF POWER DELIVERY SYSTEMS

This test method was technically approved by the Global Metrics Committee and is the direct responsibility

of the North American Metrics Committee. Current edition approved by the North American Regional

Standards Committee on July 11, 2004. Initially available at www.semi.org September 2004; to be published

November 2004.

1 Purpose

1.1 The purpose of this test method is to provide an

accurate method for measuring the output power of RF

generators used in RF power delivery systems for

semiconductor processing equipment to support SEMI

E113.

2 Scope

2.1 This test method specifies the testing procedures

and test equipment required for determining the true

output power (i.e., heating power) output of RF

generators. This test method uses a calorimetric power

meter, which was calibrated previously using precise

DC substitution techniques as a reference standard.

2.2 The primary focus for this test method is

semiconductor processing equipment including, but not

limited to, the following equipment types:

 Dry etch equipment, and

 Film deposition equipment (CVD and PVD).

NOTICE: This standard does not purport to address

safety issues, if any, associated with its use. It is the

responsibility of the users of this standard to establish

appropriate safety and health practices and determine

the applicability of regulatory or other limitations prior

to use.

3 Limitations

3.1 This test method is meant to provide a general

means of measuring the true output power of RF

generators operating over a wide range of frequency

and power. Limitations in the frequency and power

coverage of this method are determined by the

individual system components chosen.

3.2 This test method assumes that the transmission

system characteristic impedance is 50 .

3.3 International, national, and local codes, regulations

and laws should be consulted to ensure that the

equipment and procedures meet regulatory

requirements in each location.

3.4 Certain safety issues associated with the test

procedures themselves are mentioned as a reminder that

safety procedures are necessary for safe conduct of the

test.

3.5 This standard does not address any safety or

performance issues related to RF emissions or electrical

codes (e.g., Underwriter’s Laboratory, Inc. (UL), the

National Electrical Code (NEC



), Federal

Communications Commission (FCC)). It is the

responsibility of the users of this standard to conform to

the appropriate local codes and regulations as applied to

this type of equipment, some of which are covered by

referenced documents.

4 Referenced Standards

4.1 SEMI Standards

SEMI E113 — Specification for Semiconductor

Processing Equipment RF Power Delivery Systems

SEMI E114 — Test Method for RF Cable Assemblies

Used in Semiconductor Processing Equipment RF

Power Delivery Systems

NOTICE: Unless otherwise indicated, all documents

cited shall be the latest published versions.

5 Terminology

5.1 Abbreviations and Acronyms

5.1.1 AC — Alternating Current

5.1.2 CVD — Chemical Vapor Deposition

5.1.3 DC — Direct Current

5.1.4 NIST — National Institute for Standards and

Technology

5.1.5 PVD — Physical Vapor Deposition

5.1.6 RF — Radio Frequency

5.1.7 VSWR — Voltage Standing Wave Ratio

5.2 Definitions

5.2.1 cable assembly — the section of cable

(transmission line), including the connectors, used to