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SEMI E2.5-93 © SEMI 1993, 2003 2 NOTICE: T hese standards do not purport to address safety issues , if any, associated with their use. It is the responsibility of the user of these standards to establish appropriate safe…
SEMI E2.5-93 © SEMI 1993, 2003 1
SEMI E2.5-93 (Withdrawn 1103)
STANDARD FOR 150 mm QUARTZ AND HIGH TEMPERATURE
WAFER CARRIERS
This standard was technically reapproved by the Physical Interfaces & Carriers Committee and is the direct
responsibility of the North American Physical Interfaces & Carriers Committee. Current edition approved by
the North American Regional Standards Committee in October 1998. Initially available at www.semi.org
February 1999; to be published February 1999. Originally published in 1993; previous published revision in
1996.
NOTICE: This document was balloted and approved for withdrawal in 2003.
NOTE: Terms and Dimensions used in this specification are defined in SEMI E2.
Description Style 1 — Non-Contiguous (Figure 1) Style 2 — Contiguous (Figure 2)
Symbol
A Wafer Height 80.0 mm ± 0.5 mm (3.15 in. ± 0.02 in.) 80.0 mm ± 0.5 mm (3.15 in. ± 0.02 in.)
B Base Width 54.91 mm ± 0.25 mm (2.16 in. ± 0.01 in.) 54.91 mm ± 0.25 mm (2.16 in. ± 0.01 in.)
D Lift Access Height 17.8 mm (0.70 in.) min. 17.8 mm (0.70 in.) min.
E Lift Access Spacing 134.5 mm ± 50 mm (5.296 in ± 02 in.) 109.2 mm ± 0.5 mm (4.30 in. ± 0.02 in.)
F Lift Access Opening 8 mm I.D (0.315 in. I.D.) min. 8 mm I.D (0.315 in. I.D.) min.
J Pocket Size (DIA) 5.920 in. min. same
K Base Side to Wafer
Centerline
½ B ± 0.25 mm (.01 in.) same
L Carrier Region
150° max. 125° max.
P Separation — Wafer to
Wafer
≥ 10% H ≥ 10% H
25 Capacity
C Base Length 145.7 mm ± 0.076 mm
(5.736 in. ± 0.003 in.)
119.00 mm ± 0.076 mm
(4.688 in. ± 0.003 in.)
G Base End to 1st Slot 15.7 mm ± 0.076 mm
(0.618 in. ± 0.003 in.)
2.390 mm ± 0.076 mm
(0.094 in. ± 0.003 in.)
H (See
NOTE 1.)
Slot Spacing
(non-accumulative)
4.76 mm ± 0.051 mm
(0.1875 in. ± 0.002 in.)
4.76 mm ± 0.051 mm
(0.1875 in. ± 0.002 in.)
I End Slot to End Slot 114.3 mm ± 0.076 mm
(4.500 in. ± 0.003 in.)
114.3 mm ± 0.076 mm
(4.500 in. ± 0.003 in.)
50 Capacity
C Base Length 145.7 mm ± 0.076 mm
(5.736 in. ± 0.003 in.)
121.46 mm ± 0.76 mm
(4.782 in. ± 0.003 in.)
G Base End to 1st Slot 14.50 mm ± 0.076 mm
(0.571 in. ± 0.003 in.)
2.390 mm ± 0.076 mm
(0.094 in. ± 0.003 in.)
H (See
NOTE 2.)
Slot Spacing
(non-accumulative)
2.381 mm ± 0.051 mm
(0.09375 in. ± 0.002 in.)
2.381 mm ± 0.051 mm
(0.09375 in. ± 0.002 in.)
I End Slot to End Slot 116.69 mm ± 0.076 mm
(4.594 in. ± 0.003 in.)
116.69 mm ± 0.076 mm
(4.594 in. ± 0.003 in.)
NOTE 1: 25 capacity slot spacing is derived from SEMI E1.5.
NOTE 2: 50 capacity slot spacing is SEMI E1.5 divided by 2; to insure compatibility for wafer transfer between Plastic & High Temperature
Carriers, the U.S. customary dimension is carried out to 5 decimals to eliminate accumulation in rounding error when multiplying by 49 spaces to
achieve I.
SEMI E2.5-93 © SEMI 1993, 2003 2
NOTICE: These standards do not purport to address safety issues, if any, associated with their use. It is the
responsibility of the user of these standards to establish appropriate safety and health practices and determine the
applicability of regulatory limitations prior to use. SEMI makes no warranties or representations as to the suitability
of the standards set forth herein for any particular application. The determination of the suitability of the standard is
solely the responsibility of the user. Users are cautioned to refer to manufacturer's instructions, product labels,
product data sheets, and other relevant literature respecting any materials mentioned herein. These standards are
subject to change without notice.
The user's attention is called to the possibility that compliance with this standard may require use of copyrighted
material or of an invention covered by patent rights. By publication of this standard, SEMI takes no position
respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in this
standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and
the risk of infringement of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI E6-0303 © SEMI 1982, 2003 1
SEMI E6-0303
GUIDE FOR SEMICONDUCTOR EQUIPMENT INSTALLATION
DOCUMENTATION
This guide was technically approved by the Global Facilites Committee and is the direct responsibility of the
North American Facilities Committee. Current edition approved by the North American Regional Standards
Committee on November 22, 2002. Initially available at www.semi.org January 2003; to be published March
2003. Originally published in 1982; previously published December 1996.
NOTICE: This document was balloted as a complete
rewrite of SEMI E6 in 2002.
1 Purpose
1.1 Within the semiconductor industry, the diversity
and complexity of equipment creates difficult
challenges for facilities design and equipment
installation. This guide should benefit equipment
suppliers and semiconductor manufacturers by
communicating, in a standardized way, the information
necessary to prepare the facility and to efficiently install
semiconductor equipment.
2 Scope
2.1 This standard applies to the facilities interface of
all semiconductor production equipment and supplier-
provided support equipment.
2.2 The recommended equipment installation
documentation should cover all installation
requirements from receiving until hookup is complete.
2.3 The series of data sheets included should address
all site facilities necessary to support semiconductor
equipment processing.
2.4 The data sheets provide a consistent format for
both the equipment supplier and equipment purchaser
to use in compiling and interpreting equipment
installation data.
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior
to use.
3 Limitations
3.1 SEMI E6 applies to the facility interface of
semiconductor equipment only. Other equipment
interfaces, such as the physical interfaces for material
handling (see SEMI E106 and related standards) and
software interfaces (see SEMI Information and Control
Standards) are defined by other SEMI Standards.
3.2 This guide is not intended to address the internal
connections of the equipment that are typically
completed by the equipment supplier. This document
includes only information related to the utility
connections on the equipment or support equipment
that are the responsibility of the semiconductor
manufacturer’s equipment installation team.
3.3 This guide is not intended to address the
documentation provided for equipment start-up,
qualification, or commissioning.
4 Referenced Standards
4.1 SEMI Standards
SEMI E30 — Generic Model for Communications and
Control of Manufacturing Equipment (GEM)
SEMI E52 — Practice for Referencing Gases Used in
Digital Mass Flow Controllers
SEMI E63 — Mechanical Specification for 300 mm
Box Opener/Loader to Tool Standard (BOLTS-M)
Interface
SEMI E70 — Guide for Tool Accommodation Process
SEMI E72 — Specification and Guide for 300 mm
Equipment Footprint, Height, and Weight
SEMI E73 — Specification for Vacuum Pump
Interfaces - Dry Pumps
SEMI E74 — Specification for Vacuum Pump
Interfaces - Turbomolecular Pumps
SEMI E76 — Guide for 300 mm Process Equipment
Points of Connection to Facility Services
SEMI E106 — Provisional Overview Guide to SEMI
Standards for Physical Interfaces and Carriers for 300
mm Wafers
NOTICE: Unless otherwise indicated, all documents
cited shall be the latest published versions.