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1 SEMI D9-0303 © SEMI 1994, 2003 SEMI D9-0303 TERMINOLOGY FOR FPD SUBSTRATES This terminology was technically approved by t he FPD Materials and Components Committee and is the direct responsibility of the Japanese FPD M…
SEMI D7-94 © SEMI 1994, 2003 2
6.1.3 Surface Roughness Parameter — Maximum
height of the profile Ry5(ISO4287/1-1984)(=Rz
(DIN4768-1990)) or 10 point height of irregularities
which is close to Ry5, Rz (JIS B0601-1982).
7 Test Specimen
7.1 A clean FPD glass substrate. No stains or oils
should be seen by the naked eye.
8 Measurement Procedure
8.1 Contact the specimen on the stage of the instrument
and leave for five minutes to condition the specimen to
room temperature.
8.2 Put the stylus on the specimen, measure roughness
by tracing the surface, and calculate the defined
roughness parameter.
8.3 Change the measurement location to the location
near the previous location and measure again.
8.4 Change the measurement location to the location
defined in Section 9 and repeat the above measurement.
9 Measurement Location
9.1 Describe the measurement location on the report,
for example, measure the following two locations:
a. The center of the specimen.
b. The point which is 20 mm inside from both edges of
the orientation corner.
10 Calculations or Interpretation of Results
10.1 Show the measurement results in nm
(nanometers) and round fractions of 0.5 and over to the
next highest whole numbers.
Table 1 Example: Measurement Results
Maximum Height: Ry5 n1 n2
The Center **nm **nm
The Corner **nm **nm
Measurement Conditions
Surface — The pattern surface
Instrument — (type of instrument and name of maker)
Stylus tip radius — 2 µm
Tracing speed — ** µm/sec
Measuring force — 0.* mN
Cutoff λc — 0.08 mm
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determination of the suitability of the standard is solely
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respecting any materials mentioned herein. These
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1 SEMI D9-0303 © SEMI 1994, 2003
SEMI D9-0303
TERMINOLOGY FOR FPD SUBSTRATES
This terminology was technically approved by the FPD Materials and Components Committee and is the
direct responsibility of the Japanese FPD Materials and Components Committee. Current edition approved by
the Japanese Regional Standards Committee on January 10, 2003. Initially available at www.semi.org
January 2003; to be published March 2003. This document was originally published in 1994; previously
published November 2001.
1 Purpose
1.1 This document provides terms and definitions of
materials and defects within and on the surface of flat
panel display (FPD) substrates and of dimensional,
thermal, chemical, optical and mechanical properties of
FPD substrates.
2 Scope
2.1 These terms and definitions are applicable to both
front and back substrates used in FPD fabrication.
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior
to use.
3 Referenced Standards
3.1 SEMI Standards
SEMI D3 Quality Area Specification for Flat Panel
Display Substrates
SEMI D5 Standard Size for Flat Panel Display
Substrates
SEMI D7 FPD Glass Substrate Surface Roughness
Measurement Method
SEMI D11 Specification for Flat Panel Display
Glass Substrate Cassettes
SEMI D12 Specification for Edge Conditions of Flat
Panel Display (FPD) Substrates
SEMI D15 FPD Glass Substrate Surface Waviness
Measurement Method
SEMI D24 Specification for Glass Substrates Used
to Manufacture Flat Panel Displays
3.2 ASTM Standards
1
ASTM C336 — Standard Test Method for Annealing
Point and Strain Point of Glass by Fiber Elongation
Test Method (Elongation of Glass Fibers)
ASTM C338 — Standard Test Method for Softening
Point of Glass
ASTM C598 — Standards Test method for Annealing
Point and Strain Point by Beam Bending
NOTICE: Unless otherwise indicated, all documents
cited shall be the latest published versions.
4 Terminology
NOTE 1: SEAJ Liquid Crystal Display Manufacturing
Equipment Dictionay is referred as to every term in Section 4.
4.1 Internal Defects
4.1.1 bubble a gaseous inclusion.
4.1.2 open bubble a gaseous inclusion which is so
close to the surface that it is obviously open and/or one
so close to the surface that it may be broken open with
the point of a soft lead pencil.
4.1.3 inclusion opaque or partially melted particle
of refractory or batch material embedded in glass. Its
size is usually determined by the size of the distorted
area.
4.1.4 devitrification a crystalline area within the
glass.
4.1.5 knot an embedded glassy, transparent, lump
having an irregular or tangled appearance. Its size is
usually determined by the size of the distorted area.
4.2 Material on the Surface
4.2.1 cullet small transparent glass particles that are
adhered or fused to the glass substrate surface.
4.2.2 particle a micron-size piece of foreign
material on the glass surface.
1 American Society for Testing and Materials, 100 Barr Harbor Drive
West Conshochocken, Pennsylvania, USA 19428-2959. Tel: 610-
832-9585, Fax: 610-832-9555, http://www.astm.org
SEMI D9-0303 © SEMI 1994, 2003 2
4.2.3 stain organic or inorganic material on the
surface.
4.2.4 blur — any erosion of the surface; generally
cloudy in appearance, it sometimes exhibits an apparent
color.
4.3 Surface Defects
4.3.1 scratch
a surface fissure generally caused
during handling.
4.3.2 sleek — a very shallow type of scratch on the
polished surface that is sometimes invisible when the
viewing angle is changed.
4.3.3 latent scratch — a scratch which is usually
invisible but when subjected to an etching action by
dipping into a detergent or a corrosive solution, such as
an acid, the previously invisible scratch becomes visible
due to the minor removal of surface glass.
4.3.4 chip — a region of material missing from the
edge of the glass substrate, which is sometimes caused
by processing or handling.
4.3.5 pit/dig — small indentation on the glass substrate
surface.
4.3.6 bump a small protuberance on the glass
substrate.
4.3.7 crack — a fissure located at the sheet edge area
or central area.
4.3.8 streak — a defect with a very small undulation
on the glass substrate surface.
4.4 Dimensional Properties
4.4.1 outsize dimension vertical and horizontal
dimensions of the glass substrate.
4.4.2 thickness
the distance between the front
surface and the back surface of a glass substrate at same
single point.
4.4.3 thickness variation — any differences between
maximum and minimum values within the thickness of
a glass substrate.
4.4.4 warp defined as the maximum distance from a
reference plane to the guaranteed surface; this includes
twists, partial rises or declines in the glass compared
with the reference plane. Warp expression a condition
of the whole glass (substrate).
4.4.5 waviness the residual unevenness after the
long wavelength component (warp) and the short
wavelength component (surface roughness) have been
eliminated. This is also called “FPD Waviness” when
referring specifically to FPD substrates, as in SEMI
D15.
4.4.6 surface roughness — the criterion for the
smoothness of the sheet surface. Usually the randomly
selected areas on the sheet surface are measured by a
surface analyzer. Details are defined in SEMI D7.
4.4.7 beveling grinding out or shaping substrate
edges by lapping or grinding.
X
Y
chamfered edge
radiused edge
R
W
Figure 1
Beveling
4.4.7.1 chamfered edge a beveled angle of
approximately 45° in respect to the surface and cut edge
surface. One characteristic is that part of the cut edge
surface remains. For this reason, R-beveled edges have
come to be used in conjunction with chamfered edges
in liquid crystal applications. Chamfered edges with
particularly small widths are also referred to as “string
bevels”. (See Figure 1.)
4.4.7.2 R beveled edge — a beveled shape of an arc in
respect to the surface and cut edge surface. One
characteristic is that the complete cut edge surface is
ground with a wheel and processed into a frosted glass
state. Generally, in TFT liquid crystals, R-beveled
edges are used more often. (See Figure 1.)
4.4.8 orientation corner — the corner of a substrate
which identifies the pattern surface and the rotational
orientation. It is defined by the X and Y dimensions in
the following figure. It is also commonly known as
“orientation flat” or “orifra”.
4.4.9 corner cut — removal of the corners of the
substrate by either lapping or grinding. As with the
orientation corner, this is defined by the X and Y
dimensions, but generally, most corner cuts have a X
and Y of the same length.