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SEMI E78-1102 © SEMI 1998, 2002 24 NOTE 3: Grounding methods to preven t the generation and accumulation of static charge are not nec essarily sufficient for conduction at high frequencies, or to provide electrical safet…
SEMI E78-1102 © SEMI 1998,2002 23
RELATED INFORMATION 3
EXAMPLE FOR ADDING ELECTROSTATIC COMPATABILITY
REQUIREMENTS TO PURCHASING DOCUMENTS FOR
SEMICONDUCTOR MANUFACTURING EQUIPMENT
NOTE: This related information is not an official part of SEMI E78 and is not intended to modify or
supercede the official standard. Determination of the suitability of the material is solely the responsibility of
the user.
R3-1 Purpose
Purchasing semiconductor manufacturing equipment
that meets SEMI E78 Electrostatic Compatibility
requirements can reduce the cost of ownership of the
equipment by reducing operating problems and product
defects, by eliminating costly equipment modifications
after delivery, and by making the equipment available
for use more quickly after delivery.
The purpose of this Related Information 3 is only to
describe an example of specifications for electrostatic
compatibility that are meant to form part of a general
purchasing document for production equipment or
minienvironments.
R3-1.1 Limitations — Related Information 3 is only
one possible example of defining E78 compliance
requirements for equipment. Users may include all, or
any part of it, modifying it as necessary in their
purchase documents. Users are responsible for
determining the appropriate level of static control
protection depending on their specific circumstances.
R3-2 Terminology (Reference: ESD
Association Glossary ADV1.0)
R3-2.1 conductive material — electrostatic conductive
materials have a surface resistance of < 1 × 10
4
Ω or a
surface resistivity of < 1 × 10
5
Ω/square when tested
according to ESD Association ESD STM11.11, or a
volume resistance of < 1 × 10
4
Ω or a volume resistivity
of < 1 × 10
4
Ω-cm when tested according to ESD
Association ANSI/ESD STM11.12. (Other national or
international (IEC) standards may be substituted).
R3-2.2 static dissipative material — electrostatic
dissipative materials have a surface resistance between
1 × 10
4
Ω and < 1 × 10
11
Ω or a surface resistivity of
between 1 × 10
5
Ω/square and < 1 × 10
12
Ω/square
when tested using ESD Association ESD STM11.11, or
a volume resistance of between 1 × 10
4
Ω and < 1 ×
10
11
Ω or volume resistivity between 1 × 10
4
Ω-cm and
< 1 × 10
11
Ω-cm when tested using ESD Association
ESD STM 11.12. (Other national or international (IEC)
standards may be substituted)
R3-3 General Static Control System
Description
R3-3.1 The static control system shall provide
electrostatic charge and ESD control to meet the
recommendations for Level 2 (or 1, 3, or 4 as agreed
upon) contained in SEMI standard E78 Electrostatic
Compatibility: Guide to Assess and Control
Electrostatic Discharge (ESD) and Electrostatic
Attraction (ESA) for Equipment. These
recommendations are defined in Section 12.5 Table 1.
R3-3.2 The static control system shall consist of the
following items, applied as needed to assure
compliance.
R3-3.2.1 Grounding of conductive equipment parts
when feasible.
R3-3.2.2 Static dissipative materials to replace
insulators when feasible.
R3-3.2.3 Ionization sources to control static charge on
process essential insulators or isolated conductors,
particularly when they are part of the product (e.g.,
oxide-coated silicon, epoxy-packaged devices, reticles).
R3-4 General Static Control System Design
Requirements
R3-4.1 Grounding
R3-4.1.1 Conductive equipment parts shall maintain a
resistance to chassis ground or to electrical ground of
less than 1 ohm. (Reference – ESD Association
standards ANSI EOS/ESD S6.1 Grounding --
Recommended Practice and ESD SP10.1 Automated
Handling Equipment. Other national or international
(IEC) standards may be substituted)
R3-4.1.2 In critical applications, as determined by the
user, constant monitoring of equipment grounding shall
be required. In some cases, local electrical safety
regulations may prohibit the use of this method. A
suitable test method to capture short interruptions of
ground connections may need to be used.
R3-4.1.3 Resistance measurements for moving
equipment parts shall be made with the equipment in
operation.
SEMI E78-1102 © SEMI 1998, 2002 24
NOTE 3: Grounding methods to prevent the generation and
accumulation of static charge are not necessarily sufficient for
conduction at high frequencies, or to provide electrical safety.
R3-4.2 Static Dissipative Materials
R3-4.2.1 Insulators shall be replaced with grounded
static dissipative materials when feasible.
R3-4.3 Ionizers
R3-4.3.1 Charge on insulators or isolated conductors in
the product handling path, product, or reticles (if used
by the equipment to produce product) shall be
controlled with ionizers.
R3-4.3.2 Ionizer performance shall be measured using
ESD Association standard ANSI ESD STM3.1
Ionization. (Other national or international [IEC]
standards may be used.)
R3-4.4 Cleanroom Compatibility
If equipment or materials are to be installed in a
cleanroom, all static control system components shall
demonstrate compatibility with cleanroom class
requirements.
NOTE 4: The user may need to define cleanroom
compatibility requirements for static control materials here
(such as, particle shedding, outgassing, and chemical
compatibility) if such requirements are not defined elsewhere
in the purchasing document. (Reference ESD TR11-01 −
Electrostatic Guidelines and Considerations for Cleanrooms
and Clean Manufacturing)
R3-5 Compliance Testing
R3-5.1 Compliance testing shall be done by:
a) a capable independent third party, or
b) the equipment manufacturer, or
c) the end user
to demonstrate that the equipment meets the
recommendations for Level 2 (or 1, 3, or 4 as agreed
upon) contained in SEMI standard E78.
R3-5.2 Acceptance testing of the static control system
performance shall be performed at the actual
equipment use location.
R3-6 Referenced Standards
(The following ESD Association Standards and
Advisories
4
are referenced above. The may be other
equivalent national or international standards covering
these areas.)
ESD ADV1.0 — Glossary of Terms
4 ESD Association, 7900 Turin Road, Rome, NY 13440 USA.
ANSI ESD STM3.1 — Ionization
ANSI/ESD S6.1 — Grounding – Recommended
Practice
ESD SP10.1 — Automated Handling Equipment
ESD STM11.11 — Surface Resistance Measurement of
Static Dissipative Planar Materials
ANSI/ESD STM11.12 — Volume Resistance
Measurement of Static Dissipative Planar Materials
ESD TR11-01 — Electrostatic Guidelines and
Considerations for Cleanrooms and Clean
Manufacturing
NOTICE: SEMI makes no warranties or
representations as to the suitability of the standards set
forth herein for any particular application. The
determination of the suitability of the standard is solely
the responsibility of the user. Users are cautioned to
refer to manufacturer’s instructions, product labels,
product data sheets, and other relevant literature
respecting any materials mentioned herein. These
standards are subject to change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI E79-0304 © SEMI 1999, 2004 1
SEMI E79-0304
SPECIFICATION FOR DEFINITION AND MEASUREMENT OF
EQUIPMENT PRODUCTIVITY
This specification was technically approved by the Global Metrics Committee and is the direct responsibility
of the North American Metrics Committee. Current edition approved by the North American Regional
Standards Committee on October 15, 2003 and December 4, 2003. Initially available at www.semi.org
February 2004; to be published March 2004. Originally published February 1999; last published February
2000.
1 Purpose
1.1 The document provides metrics for measuring
equipment productivity.
2 Scope
2.1 The document defines metrics and calculations for
measurement of equipment productivity.
2.2 In the context of this document, it is important to
note that “equipment productivity” is impacted greatly
by factors far beyond the equipment itself, including
operator, recipe, facilities, material availability,
scheduling requirements, etc.
2.3 Effective application of this specification requires
that equipment performance is tracked using the metrics
for Equipment Reliability, Availability, and
Maintainability (RAM) established in SEMI E10.
Additionally, the Automated Reliability, Availability,
and Maintainability Standard (ARAMS) SEMI E58 can
be used for equipment with ARAMS capability.
Productivity metrics for flexible-sequence cluster tools
require tracking of SEMI E10 equipment states and
recipes at the level of individual processing modules.
The Equipment Performance Tracking (EPT) Standard
SEMI E116 assists SEMI E79 by providing the status
of the major modules of the equipment allowing
performance metrics to be tracked at the module level.
SEMI E116 also assists SEMI E79 by providing task-
level detail of the equipment or module’s current
activity, allowing performance metrics to be tracked at
the task level. Productivity performance of a flexible-
sequence cluster tool is then calculated as the aggregate
productivity performance of its individual processing
modules.
2.4 This document is currently limited to measuring
equipment productivity using Overall Equipment
Efficiency (OEE) as the metric, and does not address
the impact of productivity changes on cost, cycle time,
or other measures. This document does not address any
RAM issues over and above those in SEMI E10.
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior
to use.
3 Referenced Standards
3.1 SEMI Standards
SEMI E10 — Specification for Definition and
Measurement of Equipment Reliability, Availability,
and Maintainability (RAM)
SEMI E38 — Cluster Tool Module Communications
(CTMC)
SEMI E58 — Automated Reliability, Availability, and
Maintainability Standard (ARAMS): Concepts,
Behavior, and Services
SEMI E116 — Provisional Specification for Equipment
Performance Tracking
NOTICE: Unless otherwise indicated, all documents
cited shall be the latest published versions.
4 Terminology
4.1 Terminology Applicable to Computation of the
OEE Metric
4.1.1 actual unit output (units) — the number of units
processed by the equipment during production time.
4.1.2 availability efficiency (time divided by time) —
the fraction of total time that the equipment is in a
condition to perform its intended function.
4.1.3 cluster tool — a manufacturing system made up
of integrated processing modules mechanically linked
together (the modules may or may not come from the
same supplier) (SEMI E10).
4.1.4 downtime (equipment downtime) (time) — the
time when the equipment is not in a condition, or is not
available, to perform its intended function. It does not
include any portion of non-scheduled time (SEMI E10).
4.1.5 effective unit output (units) — the number of
units processed by the equipment during production
time that were of acceptable quality, i.e., actual unit
output less equipment assignable rework and equipment
assignable scrap.