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SEMI G75.11-06 98 © SEMI 1998 1 SEMI G75.11-0698 TEST METHOD FOR MEA S UREMENT OF THE DIELECTRIC CONSTANT AND DISSIP A TI ON FACTOR OF THE LEADFRA M E TAPE 1 Purpose 1.1 C apacitance is mea sured f or ta p e specimens an…

SEMI G75.10-0698 © SEMI 1998 2

Figure 2B

Surface Resistivity Electrode Connection

6.3 Apply the specified voltage for one (1) minute and

then read the resistance on the galvanometer.

6.4 Repeat the measurements for all the specimens.

6.5 Measure the thickness of the specimens using the

micrometer.

6.6 Calculations

6.6.1 Volume resistivity should be calculated from the

following equation:

where :

volume resistivity

Ω

effective diameter (41

42)/2 cm

measured resistance cross tape

thickness

Ω

v/t

tape thickness cm

inside diameter of the guard

electrode cm

outside diameter of the main

electrode cm

6.6.2 Surface resistivity should be determined from

the following equation:

(

)

−

)

where :

surface resistivity

Ω

inside diameter of the guard

electrode cm

outside diameter of the main

electrode cm

measured resistance along the

adhesive surface side of tape

thickness

Ω

7 Related Documents

7.1 ASTM Specification

ASTM D 257 — Standard Test Methods for D-C

Resistance or Conductance of Insulating Materials

7.2 JIS Specification

JIS K 6911 — Testing Methods for Thermosetting of

Plastics

NOTICE: These standards do not purport to address

safety issues, if any, associated with their use. It is the

responsibility of the user of these standards to establish

appropriate safety and health practices and determine

the applicability of regulatory limitations prior to use.

SEMI makes no warranties or representations as to the

suitability of the standards set forth herein for any

particular application. The determination of the

suitability of the standard is solely the responsibility of

the user. Users are cautioned to refer to manufacturer’s

instructions, product labels, product data sheets, and

other relevant literature respecting any materials

mentioned herein. These standards are subject to

change without notice.

The user’s attention is called to the possibility that

compliance with this standard may require use of

copyrighted material or of an invention covered by

patent rights. By publication of this standard, SEMI

takes no position respecting the validity of any patent

rights or copyrights asserted in connection with any

item mentioned in this standard. Users of this standard

are expressly advised that determination of any such

patent rights or copyrights, and the risk of infringement

of such rights, are entirely their own responsibility.

1 American Society of Testing and Materials, 100 Barr Harbor Drive,

West Conshohoken, PA 19428-2959 (all cited standards may be

found in Volume 10.05 of the Annual Book of ASTM Standards)

2 Japanese Standards Association, 1-24, Akasaka 4 Chome, Minato-

ku, Tokyo, Japan

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o

the contents in whole or in part is forbidden without express written

consent of SEMI.

SEMI G75.11-0698 © SEMI 19981

SEMI G75.11-0698

TEST METHOD FOR MEASUREMENT OF THE DIELECTRIC

CONSTANT AND DISSIPATION FACTOR OF THE LEADFRAME TAPE

1 Purpose

1.1 Capacitance is measured for tape specimens and

air with similar electrode setups. Dielectric constant and

dissipation factor of the tapes are calculated from the

results.

2 Referenced Documents

NOTE: As listed or revised, all documents cited shall be the

latest publications of adopted standards.

2.1 JIS Specification

JIS K 6911 — Testing Methods for Thermosetting

Plastics

3 Equipment

3.1 Measurement Circuit — See JIS K 6911 5.14.2 (1)

(b)-(d) and Figure 1.

Figure 1

Mutual Inductance Bridge Method

Following is the Mutual Inductance Bridge Method

(Transformer Bridge Method):

m, d:

Galvanometer

Power source

Shielded transformer

Variable condenser

Constant conductance

Variable resistance

Capacitance of sample

3.2 Electrostatically and electromagnetically shielded

box

3.3 Micrometer with an accuracy of 0.001 mm

1 Japanese Standards Association, 1-24, Akasaka 4 Chome, Minato-

ku, Tokyo, Japan

3.4 Humidity-controlled storage box

4 Sampling

4.1 The sampling is one sample per one lot. The

vendor must report the definition of lot if the customer

requires it.

5 Preparation of Specimens

5.1 The specimen shall be punched out from tape, the

diameter of which must be no less than that of the

opposite electrode.

5.2 Place the specimens in the constant humidity

cabinet at 23 ± 2°C and 50 ± 5% RH for 90 ± 2 hours.

This may also be done after the electrodes are formed.

6 Procedure

6.1 Measure the thickness of specimen with the

micrometer. Attach the electrodes to the specimen.

Electrodes are formed by conductive epoxy printing or

aluminum evaporation shown in Figures 2 and 3.

NOTE 1: The electrodes shall be formed on both sides of

tape.

NOTE 2: Suggested dimensions for the electrodes are shown

in Table 1 (d

– d

). They should be at least 10 times the tape

thickness.

Table 1 Suggested Dimension of Electrodes

Suggested Dimension (for Tape Thickness

of 0.063–0.077 mm)

Value

18 mm

20 mm

30 mm

6.2 Connect the specimen in the position of C

shown in Figure 1, and balance the bridge by adjusting

the measuring condenser C

and conductance shifter. In

this state, measure the C

value, the conductance value

between “m” and “d”, resistance between “I” and “m”,

and “r” and “m” of the conductance shifter in Figure 1.

Figure 2

Electrodes Formed on the Leadframe Tape

Figure 3

Electrode Connection