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SEMI G9-89 © SEMI 1 980, 199 6 3 6.4 Lead and Di e Attach Pad Pl an a r ity 6.4.1 L ead Planarity — (See SEMI G 1 0 , Section 8) 6.4.1.1 A llo wable tolerance is given b y t he follo wing: Strip Wi dth Material G age, 0.…
SEMI G9-89 © SEMI 1980, 1996 2
(insert on received)
Figure 5
Stamped Leadframe Terminology
lead twist — Angular rotation on bonding fingers (see
Figure 4).
pits — Shallow surface depressions or craters in the
leadframe material.
slug marks — Random dents in the leadframe caused
by foreign material in the stamping die.
stamped leadframe terminology — See Figure 5.
Z plane — Lead and pad planarity require a reference in
the Z dimensions. The recommendation for the
reference plane, hereafter called the “Z” plane, is the
average of the two dambars when measured at their
geometric center. This reference method is incorporated
into SEMI G10.
4 Ordering Information
Purchase orders for leadframes for plastic molded dual-
in-line semiconductor packages furnished to this
specification shall include the following items:
1. Part Specification
2. Material
3. Number of Leads
4. Material Certification
5. Packaging and Marking (see Section 8)
5 Dimensions
See applicable part specification as referred to in
Ordering Information, Section 4.
6 Defect Limits and Parame ters(See SEMI G10
to Measure)
6.1 Bond Targets
6.1.1 Minimum area for bonding to allow placement
of true position target of diameter taken (See Table
below); 100% within the lead flat area and
recommended to be 0.025" (0.63 mm) length from the
tip, where plane geometry allows. (See SEMI G10,
Section 14.)
Design Lead
Width
Design Lead
Space
Minimum
Lead Space
Minimum True
Position Target
≥ 0.011 ≥ 0.011 0.006 0.007 Diameter
0.010 0.010 0.005 0.006 Diameter
NOTE: Tolerances for lead designs smaller than 0.010 should
be negotiated between vendor and user.
6.1.2 Minimum metal to metal clear ance to be as
follows:
Material gage 0.010" (0.25 mm) – 0.006" (0.15 mm)
Material gage 0.008" (0.20 mm) – 0.004" (0.10 mm)
(See SEMI G10, Section 14)
6.1.3 Depth of coining on stamped leadframes to be no
greater than 30% of material gage. (See SEMI G10,
Section 15.)
6.1.4 Lead twist is not to exceed 3° 30' (0.0006" per
0.010" (0.016 mm per 0.25 mm)). (see SEMI G10,
Section 3).
6.1.5 Lead tip will exhibit maximum 0.006" (0.15
mm) radius measured in the x-y plane at the lead flat
surface (see Figure 6).
Figure 6
Lead Flat Radius
6.2 Die Attach Pad Surface
6.2.1 Die attach pad x-y axis locatio n to be as follows:
rail-pad tie bar length 0.50" (12.5 mm) ± 0.002" (0.05 mm)
rail-pad tie bar length 0.50" (12.5 mm) ± 0.003" (0.08 mm)
from nominal drawing location. (See SEMI G10,
Section 14.)
6.2.2 Die attach pad tilt to be as foll ows:
depressed pad — maximum 0.002" (0.05 mm) per
0.100" (2.5 mm)
undepressed pad — maximum 0.001" (0.025 mm) per
0.100" (2.5 mm) (see SEMI G10, Section 5)
6.2.3 Die attach pad flatness to be within 0.0002"
(0.005 mm) T.I.R. per 0.100" (2.5 mm).
6.3 Die Attach Pad Downset
6.3.1 Die attach pad downset to be maximum ± 0.002"
(0.05 mm) of nominal specified downset (see SEMI
G10, Section 9).
SEMI G9-89 © SEMI 1980, 19963
6.4 Lead and Die Attach Pad Planarity
6.4.1 Lead Planarity — (See SEMI G10, Section 8)
6.4.1.1 Allowable tolerance is given b y the following:
Strip Width
Material Gage,
0.010" (0.25 mm)
Material Gage,
0.008" (0.20 mm)
less than 1.000"
(25.4 mm)
± 0.004"
(0.10 mm)
± 0.003"
(0.08 mm)
1.00" (25.4 mm) to
2.00" (50.8 mm)
± 0.005"
(0.13 mm)
± 0.004"
(0.10 mm)
greater than 2.00"
(50.8 mm)
± 0.010"
(0.25 mm)
± 0.008"
(0.20 mm)
(See SEMI G10, Section 8.)
6.4.2 Die attach pad planarity (see SEMI G10, Section
11).
6.4.2.1 Allowable pad planarity tolerance, downset
pad condition is given by the following:
Strip Width Tolerance
Less than 0.75" (18.75 mm) ± 0.002" (0.05 mm)
0.75" (18.75 mm ) to 1.00" (25.4 mm) +0.003" (0.08 mm)
to
–0.005" (0.13 mm)
Greater than 1.00" (25.4 mm) +0.006" (0.15 mm)
to
–0.003" (0.08 mm)
(See SEMI G10, Section 11.)
6.4.2.2 Allowable pad planarity tolera nce,
undepressed pad condition will not be specified in this
document and is subject to vendor/customer
negotiation.
6.5 Material Tolerance
6.5.1 Material dimensional tolerance s are to be given
by SEMI G4.
6.6 Coil Set
6.6.1 Coil set shall not exceed 0.020" over nominal
length of the cut strip (see SEMI G10, Section 10).
6.7 Crossbow
6.7.1 Crossbow shall not exceed 0.5% of nominal strip
width (see SEMI G10, Section 7).
6.8 Camber
6.8.1 Camber shall not exceed 0.002" (0.05 mm) over
gage length of 6.00" (150 mm) (see SEMI G10, Section
6).
6.9 Strip Pitch
6.9.1 Strip pitch tolerance shall be ± 0.002" (0.05 mm)
over the maximum measurable progression within the
nominal strip length (see SEMI G10, Section 4).
6.10 Burrs
6.10.1 Burrs shall be firmly attached and able to
withstand a probe force of 10 grams. Vertical burrs
inside the dambar shall not exceed 0.001" (0.025 mm).
Vertical burrs outside the dambar and horizontal burrs
in any location shall not exceed 0.002" (0.051 mm) (see
SEMI G10, Section 12).
6.11 Pits (Indentations)
6.11.1 Within function area and on external leads,
there shall be no measurable slug marks. Pits shall not
exceed 0.0003" (0.008 mm) in depth and 0.0005"
(0.013 mm) in largest surface dimension in these areas
(see SEMI G10, Section 13).
APPLICATION NOTE: There is a question regarding the
ability of material suppliers to meet this specification.
Revision of this specification is under review.
6.11.2 In other areas, pits and imperfections shall not
affect leadframe strength regardless of size and shall
not exceed 0.002" (0.051 mm) in depth and 0.005"
(0.127 mm) in largest surface dimensions (see SEMI
G10, Section 13).
6.12 Plating
6.12.1 All plating related characteristics shall be
specified by SEMI G21.
6.13 Strip Length and Cutoff — (See SEMI G10,
Section 14.)
6.13.1 Strip cutoff location shall be ± 0.003" (0.08
mm) of specified nominal location.
6.13.2 Overall strip length shall be ± 0.003" (0.08
mm) of specified nominal length.
6.14 Lead Fatigue — Number of cycles to be
determined between customer and supplier. (See SEMI
G10, Section 16.)
7 Sampling
Sampling will be determined between supplier and
purchaser.
8 Packaging and Marking
8.1 Packaging — Leadframes mus t be packaged in
containers designed and constructed to prevent damage
and/or contamination. Specific protection must be
provided against foreseeable mechanical and
environmental hazards.
SEMI G9-89 © SEMI 1980, 1996 4
8.2 Marking — The outer containers shall be clearly
marked identifying the user stock number, user
purchase order number, drawing number, and vendor
lot numbers within the carton.
NOTICE: These standards do not purport to address
safety issues, if any, associated with their use. It is the
responsibility of the user of these standards to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
SEMI makes no warranties or representations as to the
suitability of the standards set forth herein for any
particular application. The determination of the
suitability of the standard is solely the responsibility of
the user. Users are cautioned to refer to manufacturer’s
instructions, product labels, product data sheets, and
other relevant literature respecting any materials
mentioned herein. These standards are subject to
change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
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the contents in whole or in part is forbidden without express written
consent of SEMI.