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SEMI G54-93 © SEMI 1993 1 SEMI G54-93 SPECIFICA TION FOR DIMENSIONS AND TOLERA NCES USED TO MANUFACTURE MO LDED PLA STI C PACKAGES 1 Preface This docum ent is a guideline f o r ordering t he tooli n g required to m a nuf…

SEMI G53-92 © SEMI 1992 4

9.1.2 Material Hardness — Hardness shall be

evaluated per ASTM E 384 or E 10 to limits agreed

upon between user and supplier.

9.1.3 Functional Testing

9.1.3.1 Functional testing may be performed at the

option of the user or supplier. Test to be agreed upon

between user and supplier.

9.1.3.2 Hermeticity parts should be evaluated per

MIL-STD 883, Method 1014.

9.1.4 Marking — Marking permanency shall be

evaluated per MIL-STD 883, Method 2015.

9.1.5 Corrosion Resistance — Corrosion resistance

shall be evaluated per MIL-STD 883, Method 1009

(Salt Atmosphere).

10 Certification

Upon request of the user in the purchase order, a

supplier’s certification that the product was

manufactured and tested in accordance with this

specification, together with a report of the test results,

shall be furnished at the time of shipment. Certification

to user specification may also be required. This

certification does not remove the supplier’s

responsibility for discrepant product subsequently

found by the user.

11 Packaging and Package M arking

11.1 Packaging — The shipping containers and

materials shall be suitably selected to provide the

components with protection from normal transportation

damage risks which include crushing, abrasion,

spillage, and exposure to moisture and other corrosive

gasses. The inner packing materials must be clean room

compatible as defined by user.

11.2 Package Marking

11.2.1 Internal Packages — Each internal package

shall be marked as follows:

User’s Part Number

User’s Order Number

Drawing Number (user’s and supplier’s, if appropriate)

Plating Lot Number

Manufacturing Lot Number

Quantity Date of Manufacture

External Marking — The external packing list shall

include the following details:

User’s Part Number

User’s Order Number

Quantity Shipping Date

Any specific instructions for receiving personnel

Figure 1

NOTICE: These standards do not purport to address

safety issues, if any, associated with their use. It is the

responsibility of the user of these standards to establish

appropriate safety and health practices and determine

the applicability of regulatory limitations prior to use.

SEMI makes no warranties or representations as to the

suitability of the standards set forth herein for any

particular application. The determination of the

suitability of the standard is solely the responsibility of

the user. Users are cautioned to refer to manufacturer’s

instructions, product labels, product data sheets, and

other relevant literature respecting any materials

mentioned herein. These standards are subject to

change without notice.

The user’s attention is called to the possibility that

compliance with this standard may require use of

copyrighted material or of an invention covered by

patent rights. By publication of this standard, SEMI

takes no position respecting the validity of any patent

rights or copyrights asserted in connection with any

item mentioned in this standard. Users of this standard

are expressly advised that determination of any such

patent rights or copyrights, and the risk of infringement

of such rights, are entirely their own responsibility.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o

the contents in whole or in part is forbidden without express written

consent of SEMI.

SEMI G54-93 © SEMI 19931

SEMI G54-93

SPECIFICATION FOR DIMENSIONS AND TOLERANCES USED TO

MANUFACTURE MOLDED PLASTIC PACKAGES

1 Preface

This document is a guideline for ordering the tooling

required to manufacture plastic semiconductor

packages. These packages include the following

JEDEC registered outlines:

Plastic Dual-in-Line Packages (PDIP)

Plastic Leaded Chip Carrier (PLCC)

Plastic Quad Flat Packages (PQFP)

Small Outline I.C. Packages (SOIC — Gull Wing

and “J” lead)

Plastic TAB Quad Packages (PTAB)

NOTE 1: Package outlines registered with other organizations

such as EIAJ and non-registered outlines may use the criteria

in this document by choosing the outline which most closely

resembles the particular package.

Packaging engineers, mold manufactures, and end-of-

line tool makers may use this document to define the

limits of tooling tolerances.

2 Applicable Documents

2.1 Order of Precedence — To avoid conflicts, the

order of precedence when ordering tooling shall be as

follows:

Purchase Order

Referenced Documents

This Specification

2.2 Reference Documents

2.2.1 SEMI Specifications

SEMI G48 — Specification, Measurement Method for

Molded Plastic Package Tooling

2.2.2 JEDEC Specifications

Pub. No. 95 — Registered and Standards Outline for

Semiconductor Devices

2.3 Related Documents for Information

2.3.1 Military Specifications

MIL-STD-100 — Engineering Drawing Practice

2.3.2 ANSI Specifications

1 JEDEC, 2001 Eye Street N.W., Washington, D.C. 20006

2 Military Standards, Naval Publications and Form Center, 5801

Tabor Avenue, Philadelphia, PA 19120

Y14.5 — Dimensioning and Tolerancing

3 Selected Definitions

3.1 Cavity — the plastic body formed by either the top

or bottom mold cavities.

3.2 Gate Feature — plastic protrusions or intrusions

which result from normal molding and degating

operations.

3.3 Lead Bend Angle — the angle to which the leads

are bent in reference to a plane normal to the X-Y plane

of the package. After a suitable radius has been formed

at the shoulder, there must be no compound angle

formation to achieve the lead spread requirements. Lead

Bend Angle may just be a reference if Lead Spread is

specified (see Figures 1A, B, C).

3.4 Lead Coplanarity — the vertical position of a lead

foot with respect to a reference plane created by the

three leads with feet most extended from the bottom

surface of the package body. The term “foot” applies to

both PLCC foot radii and PQFP feet (see Figure 2).

3.5 Lead Shoulder (Dambar Area) Protrusions or

Intrusions — a protrusion (tab) on the shoulder or lead,

or intrusion cut into the shoulder or lead as a result of

dambar trimming (see Figures 3 and 4).

3.6 Lead Sweep — lead movement measured with

respect to a datum, perpendicular to the top or bottom

surface of the package and which passes through the

midpoint of the lead, when viewed from the sides of the

package (see Figure 4).

3.7 Mismatch — misalignment between the top and

bottom cavities. The measurement of mismatch is stated

as the difference between the center lines of the top and

bottom cavities (see Figure 5). All statements regarding

mismatch of cavities are applicable to both the X and Y

axis. All measurements are made prior to lead trim and

form.

3.8 Offset — the difference in the bottom cavity

position from a leadframe datum when compared to

design (see Figure 6). This measurement ignores

leadframe tolerances. All statements regarding offset

are applicable to both the X and Y axis. All

measurements are made prior to lead trim and form.

3 American National Standards Institute, 1430 Broadway, New York,

NY 10018

SEMI G54-93 © SEMI 1993 2

3.9 Overlap — the difference in length or width

between the top and bottom cavities. Overlap may be a

feature designed into the mold to avoid mismatch (see

Figure 5). All statements regarding overlap of cavities

are applicable to both the X and Y axis. All

measurements are made prior to lead trim and form.

3.10 Package Warpage — loss of planarity of a

molded surface excluding protrusions and intrusions

(see Figure 7). Each package type has a maximum

allowable warpage and a warp factor is used to

determine the maximum warpage for a particular

package dimension. The Warp Factor (WF) is defined

as follows:

WF =

Total Warp in inches (mm

)

×1000

Package dimension in inches (mm)

Package warpage is usually caused by incorrect

package design and/or poor molding conditions.

3.11 Parting Line Protrusions, or Intrusions — plastic

excesses (flash) or losses (chips or voids) at the parting

line after normal processing to mold, deflash, trim, and

singulate the packages.

3.12

Surface Protrusions or Intrusions — plastic

excesses (bumps or blisters) or recesses (pits or voids)

on any surface of the package.

4 Ordering Information

Purchase orders for molded plastic tooling furnished to

this document, shall include the following items:

4.1 A package tooling outline drawing showing all the

required dimensions listed in Section 5. The molded

surface finish(es) and the lead finish shall be specified.

4.2

The plastic compound to be used shall be

specified. If the compound is proprietary, then the

molding and molded characteristics shall be supplied.

4.3 The leadframe drawing detailing the material, all

dimensions, and, if applicable, lead finish pre-plate

specifications.

4.4

The type and part number of the molding and trim,

form, singulate press to be used.

4.5 Singulation or off-load requirements.

4.6 Expectations of Tooling Performance — Tooling

performance is not limited to the items listed in Section

5 and 6. Any other customer requirements, such as the

limits on wire sweep, resin bleed or internal voiding,

shall also be included with the purchase order.

4.7

Reference to this specification.

4.8 Vendor certification requirements.

5 Dimensions

5.1 All package dimensions should be specified in

detail.

5.2 Ejector pin mark location from the package

centerline. This should include ejector pin sizes, depths,

and draft angles.

5.3

Pin 1 ID shape and location from the package

center with respect to the lead frame Pin 1 location.

5.4

All critical radii (unspecified radii, often shown

sharp on the drawing, may have the maximum radius

shown in the table of Section 6).

5.5

Plastic stand-off shape and locations from the

package center.

5.6

Lead spread (the distance between the outer edge

of opposing leads).

5.7 Shoulder bend location and lead bend angle

(optional).

5.8

Foot angle radius (maximum a nd minimum).

5.9 Foot length.

5.10 Lead length.

5.11 Shoulder width (maximum width should include

protrusion).

6 Dimensional Tolerance Li mits

These criteria, where applicable, apply only to opaque,

plastic molded semiconductor packages. If an item is

not mentioned in the following table, then the

tolerances on the dimensions of that item follow the

general tolerance limits stated on the drawing.

Dimensions are in inches (millimeters) except as noted.

Dimensions are to be verified per SEMI G48.