semi合集-English.pdf - 第6122页

SEMI G26-90 © SEMI 198 3, 1996 2 5 Dimension s and Perm issi b l e Var iations The lid dimensions shall confor m as specified in Figure 3 and Table 1. Figure 3 Dimensions Table 1 Lid Dimen sions for 0.050" Pad Cente…

SEMI G26-90 © SEMI 1983, 19961

SEMI G26-90

SPECIFICATION FOR HERMETIC SLAM CHIP CARRIER LIDS

1 Preface

This specification covers the ceramic piece part

commonly referred to as a lid, used in the construction

of a hermetic SLAM package with a .050" pad

centerline. The SLAM package is covered separately in

the SEMI G5 Specification for Ceramic Chip Carriers.

2 Applicable Documents

MIL-STD-883

— Test Methods and Procedures for

Microelectronics

MIL-M-38510 — General Specification for

Microcircuits

MIL-I-23011 — Iron Nickel Alloys for Sealing to Glass

and Ceramic

3 Selected Definitions

burr — A fragment of excess material or foreign

particle adhering to the surface.

chip — Region of ceramic missing from the surface or

edge of a package which does not go completely

through the package. Chip size is given by its length,

width and depth from a projection of the design plan-

form (see Figure 1).

Figure 1

Chip Illustration

crack — A cleavage or fracture that extends to the

surface of a package. It may or may not pass through

the entire thickness of the package.

1 Military Standards, Naval Publications and Form Center, 5801

Tabor Ave., Philadelphia, PA 19120

fin — A fine, feathery-edged projection on the edge or

corner of the ceramic.

glass flow — Heated just sufficiently to remove all

screen mesh marks visible at 10× magnification.

overhang — Horizontal extension of glass from the

ceramic.

projection — Raised portion of the surface indigenous

with the parent material.

pullback — Defines a dimension covering the linear

distance between the edge of the ceramic and the first

measurable glass interface excluding any glass spatter

(see Figure 2).

rundown — Vertical extension of glass from the

ceramic (see Figure 2).

Figure 2

Glass Misalignment

seal area — A dimensional outline area designated for

sealing the lid and package together.

terminal — Case outline at point of entry or exit of an

electrical contact.

void —An absence of glass from a designated glassed

area on the ceramic surface.

4 Ordering Information

Purchase orders for SLAM lids furnished to this

specification shall include the following items:

1. Drawing number and revision level

2. Type and color of ceramic

3. Type and thickness of sealing material

4. Length, width, thickness and sealing area

5. Certification

6. Method of test and measurements (see Section 9)

7. Lot acceptance procedures (see Section 8)

8. Packaging and marking (see Section 10)

SEMI G26-90 © SEMI 1983, 1996 2

5 Dimensions and Permissi ble Variations

The lid dimensions shall conform as specified in Figure

3 and Table 1.

Figure 3

Dimensions

Table 1 Lid Dimensions for 0.050" Pad Centerline

Terminals

Chip Carrier

Base

Thickness

(Reference) DIM A DIM B DIM T DIM W

S/R,

WIDTH

20 0.020 0.310 0.230 0.060 0.020 0.040

28 0.025 0.410 0.330 0.060 0.025 0.040

44 0.040 0.500 0.420 0.065 0.025 0.040

68 0.040 0.700 0.560 0.065 0.022 0.070

6 Materials

6.1 Ceramic

6.1.1 Alumina content 90% minimum or Beryllia

content 94% minimum.

6.1.2 Dark or white.

6.2 Sealing Material — As specified in the ordering

information.

7 Defect Limits

7.1 Ceramic

7.1.1 Cracks — Cracks are not allowed.

7.1.2 Chips

7.1.2.1 Corner — 0.762 mm × 0.762 mm × 0.762 mm

(0.030" × 0.030" × 0.030").

7.1.2.2 Edge — 0.762 mm × 0.762 mm × 0.762 mm

(0.030" × 0.030" × 0.030").

7.1.2.3 Chips cannot reduce the seal path by more than

0.381 mm (0.015") or 10%, whichever is smaller.

7.1.3 Burrs, Projections, and Fins — Lids — 0.127

mm (0.005") maximum.

7.1.4 Camber — 0.004 inch/inch. For sizes below one

inch the maximum camber shall be 0.076 mm (0.003").

7.2 Glass

7.2.1 Chips or Voids — There shall be no chips or

voids after glass flow test.

7.2.2 Glass Misalignment — (As received.)

7.2.2.1 External Overhang — 0.254 mm (0.010")

maximum.

7.2.2.2 External Rundown — 30% of ceramic

thickness maximum at maximum material condition.

7.2.2.3 Glass Pullback — 0.254 mm (0.010")

maximum.

7.2.2.4 Regardless of maximum allowable criteria

stated above, the seal area must not be reduced by

greater than 20% of the nominal design width.

7.2.3 Glass thickness shall be measured in four

locations. Measurement shall be made on glass and

base total thickness. Base reference thickness shall be

measured on the same part by removal of a portion of

the glass.

7.2.4 Glass splatter in all areas may not exceed 0.052

mm (0.002") in height, 0.127 mm (0.005") in diameter,

with a maximum of three per 0.1" square area on the

cavity surface.

8 Sampling

Sampling will be determined between supplier and

purchaser.

9 Test Methods

9.1 Sequence of Events and Functional Testing —

During functional testing, the sequence of testing shall

be:

1. Seal

2. Vapor Content

3. Environmental Testing

4. Fine Leak

5. Gross Leak

6. Torque Test

9.2 Hermetic and Environmental Testing

9.2.1 The hermetic integrity of the package must be

maintained after all environmental testing. Hermetic

checks shall comply with MIL-STD-883, Method 1014,

Test Conditions A

, or B and C.

9.2.2 Environmental testing shall include: Temp

Cycle, MIL-STD-883, Method 1010, Condition C.

10 Packaging and Marking

10.1 Packaging — Containers selected shall be strong

enough and suitably designed to provide maximum

protection against crushing, spillage and other forms of

damage to the container or its contents. Containers shall

afford protection of the contents to contamination from

exposure to excessive moisture or oxidation by gases.

Packaging materials shall be so selected to prevent any

contamination of the ceramic component parts with

paper fibers or organic particles.

10.2 Marking — The outer containers shall be clearly

marked to identify the user stock number, user purchase

order number, drawing number, quantity, vendor lot

number, and solder glass type.

NOTICE: These standards do not purport to address

safety issues, if any, associated with their use. It is the

responsibility of the user of these standards to establish

appropriate safety and health practices and determine

the applicability of regulatory limitations prior to use.

SEMI makes no warranties or representations as to the

suitability of the standards set forth herein for any

particular application. The determination of the

suitability of the standard is solely the responsibility of

the user. Users are cautioned to refer to manufacturer’s

instructions, product labels, product data sheets, and

other relevant literature respecting any materials

mentioned herein. These standards are subject to

change without notice.

The user’s attention is called to the possibility that

compliance with this standard may require use of

copyrighted material or of an invention covered by

patent rights. By publication of this standard, SEMI

takes no position respecting the validity of any patent

rights or copyrights asserted in connection with any

item mentioned in this standard. Users of this standard

are expressly advised that determination of any such

patent rights or copyrights, and the risk of infringement

of such rights, are entirely their own responsibility.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o

the contents in whole or in part is forbidden without express written

consent of SEMI.