semi合集-English.pdf - 第1567页
SEMI E36.1-0704 © SEMI 2004 4 5.6.2.5 Equipment — Supplier -defined ide ntifier for a specific ty pe of semiconductor m anufacturing equi pment. 5.7 Element Name — Recipe 5.7.1 Element Description — T h e Recipe elem en …
SEMI E36.1-0704 © SEMI 2004 3
5.5.1 Element Description — The Manual element is used to define the documents in a document manual set. The
content of the Manual element is not interpreted.
5.5.2 Metadata — In addition to the metadata available from the E36Item tag, the Manual element supports the
following additional metadata, all in the e36base namespace:
5.5.2.1 ManualType
5.5.2.1.1 OperationsManual — Manual type typically used by equipment operators at customer sites to perform the
tasks for which the equipment was designed.
5.5.2.1.2 InstallationManual — Manual type typically used by supplier and customer engineers to install the
equipment at the customer site.
5.5.2.1.3 MaintenanceManual — Manual type typically used by trained maintenance technicians at customer sites
to perform repair and upkeep of equipment.
5.5.2.1.4 MaintenanceSchedule — Manual type typically used by site coordinators and customer facility managers
to schedule and document normal preventive maintenance.
5.5.2.1.5 PartsList — Manual type typically used by on-site field service engineers and customers to identify parts
to order and to maintain a sufficient stocking level to ensure prompt delivery of parts.
5.5.2.1.6 TroubleshootingManual — Manual type typically used by equipment operators and qualified maintenance
technicians to identify and correct equipment problems.
5.5.2.1.7 ReleaseNotes — Manual type typically used by operators, technicians and system administrators to
identify changes in software configuration.
5.5.2.1.8 TrainingManual — Manual type typically used by supplier training personnel and customers to train
operators and maintenance technicians.
5.6 Element Name — Configuration
5.6.1 Element Description — The Configuration element is used to describe a unique piece of semiconductor
manufacturing equipment. The content of the Configuration element is not interpreted.
5.6.2 Metadata — In addition to the metadata available from the E36Item tag, the Configuration element supports
the following additional metadata, all in the e36base namespace:
5.6.2.1 WaferSize — Specific to the wafer size for the specific semiconductor manufacturing equipment set; may be
200mm, 300mm, or “Other”. (mandatory)
5.6.2.2 Mainframe — Designation of mainframe type for the specific semiconductor manufacturing equipment set.
5.6.2.3 TechnologyArea — The area in which the semiconductor manufacturing equipment set is located in the
semiconductor manufacturing process.
5.6.2.3.1 Lithography
5.6.2.3.2 Etch
5.6.2.3.3 Planarization
5.6.2.3.4 Diffusion
5.6.2.3.5 Thin Film
5.6.2.3.6 Implant
5.6.2.3.7 Analytical
5.6.2.3.8 Sort
5.6.2.3.9 Assembly/Test
5.6.2.4 Process — Free text field allowable for process type used in the specific semiconductor manufacturing
equipment.
SEMI E36.1-0704 © SEMI 2004 4
5.6.2.5 Equipment — Supplier-defined identifier for a specific type of semiconductor manufacturing equipment.
5.7 Element Name — Recipe
5.7.1 Element Description — The Recipe element defines a semiconductor manufacturing equipment recipe or set
of instructions pertaining to the process, test or qualification on the specified semiconductor manufacturing
equipment. The content of the Recipe element is not interpreted.
5.7.2 Metadata — In addition to the metadata available from the E36Item tag, the Recipe element supports the
following additional metadata, all in the e36base namespace:
5.7.2.1 RecipeType
5.7.2.1.1 Process — Use this value if the recipe is for the processing of wafers on the specific semiconductor
manufacturing equipment.
5.7.2.1.2 Test — Use this value if the recipe is for testing to validate an adjustment or functional operation of a
component or semiconductor manufacturing equipment.
5.7.2.1.3 Qualification — Use this value if the recipe is for the qualification of equipment parameters within the
specified range limits on the specified semiconductor manufacturing equipment.
5.8 Element Name — Procedure
5.8.1 Element Description — The Procedure element describes a sequence of equipment related operations,
typically performed by operations or service personnel. The content of a Procedure element is interpreted as
information describing the sequence of operations or instructions represented by the procedure.
5.8.2 Metadata — In addition to the metadata available from the E36Item tag, the Procedure element supports the
following additional metadata, all in the e36base namespace:
5.8.2.1 ProcedureType
5.8.2.1.1 Maintenance — To include procedures but not limited to calibrations, qualifications, retrofits, cleaning,
repair, preventive, corrective, diagnostic, troubleshooting, and software around semiconductor manufacturing
equipment.
5.8.2.1.2 Installation — To include procedures but not limited to, setup, startup, and install around semiconductor
manufacturing equipment.
5.8.2.1.3 Operation — To include procedures around the operation of semiconductor manufacturing equipment.
5.8.2.1.4 ToolRemoval — To include procedures but not limited to, shipping, decontamination, and de-install
around semiconductor manufacturing equipment.
5.8.2.1.5 Safety — To include procedures concerning safety during the handling, assembly, installation, use, and
removal of semiconductor manufacturing equipment.
5.8.2.1.6 Usage — To include procedures of usage of a non-technical nature.
5.8.2.2 ScheduleType — For periodic procedures, describes the frequency pattern exhibited by the procedure. On
specific semiconductor manufacturing equipment, one of:
5.8.2.2.1 Wafer Based.
5.8.2.2.2 CalendarTimeBased.
5.8.2.2.3 ProcessTimeBased.
5.8.2.3 ScheduleUnits — For periodic procedures, describes the nominal frequency for performing the procedure.
5.8.2.3.1 When scheduleType is Wafer Based, this is the number of wafers.
5.8.2.3.2 When scheduleType is CalendarTimeBased, this is the number of elapsed days.
5.8.2.3.3 When scheduleType is ProcessTimeBased, this is the number of elapsed process hours based on the
specific semiconductor manufacturing equipment.
SEMI E36.1-0704 © SEMI 2004 5
5.9 Element Name — Component
5.9.1 Element Description — The Component element represents a physical or logical part of semiconductor
manufacturing equipment. The content of a Component element is not interpreted.
5.9.2 Metadata — In addition to the metadata available from the E36Item tag, the Component element supports the
following additional metadata, all in the e36base namespace:
5.9.2.1 SupplierPartNumber — Contains a supplier-defined part number for an identified system or component on
specific semiconductor manufacturing equipment.
5.9.2.2 OEMPartNumber — Original Equipment Manufacturer Part number system or component on a
semiconductor manufacturing equipment set.
5.9.2.3 PartName — Contains the Supplier designated part name for a system or component on specific
semiconductor manufacturing equipment set.
5.9.2.4 OEMName — Original Equipment Manufacturer Company Name for an identified system or component on
a specific semiconductor manufacturing equipment set.
5.10 Element Name — Narrative
5.10.1 Element Description — The Narrative element represents arbitrary content related to the specific
semiconductor manufacturing equipment. The content of a Narrative element is interpreted as text and graphics.
5.10.2 Metadata — None.
5.11 Element Name — ErrorCode
5.11.1 Element Description — The ErrorCode element represents an equipment-generated error code on a specific
equipment set. The content of an ErrorCode is interpreted as text describing the error code. This text should be
applicable to the context of the end-user.
5.11.2 Metadata — In addition to the metadata available from the E36Item tag, the ErrorCode element supports the
following additional metadata, all in the e36base namespace:
5.11.2.1 ErrorNumber — An alphanumeric string defined by the supplier to identify the error on a specific
semiconductor manufacturing equipment set.
5.12 Element Name — Media
5.12.1 Element Description — The Media element represents a generic linked media resource. The content of a
Media element is not interpreted.
5.12.2 Metadata — In addition to the metadata available from the E36Item tag, the Media element supports the
following additional metadata, all in the e36base namespace:
5.12.2.1 MediaURL — A well-formed URL describing the location of the file containing the media element data.
5.12.2.2 Caption — A short description of the information contained in the media element, suitable for presentation
to the end user.
5.12.2.3 MediaCategory — Captures the basic purpose of the media element.
5.12.2.3.1 ElectricalSchematic — A schematic diagram representing electrical application, theory, and/or process
for the specified semiconductor manufacturing equipment.
5.12.2.3.2 MechanicalDrawing — A drawing or diagram showing the mechanical structure of a part, number of
associated parts, assembly of parts and/or associated parts for the specified semiconductor manufacturing equipment
or represent of this equipment in part or in its entirety.
5.12.2.3.3 PlumbingSchematic — A schematic diagram representing Gas/Pneumatic/Vacuum/Hydraulic
application, theory, and/or process for the specified semiconductor manufacturing equipment.
5.12.2.3.4 FacilityLayout — A diagram noting specific installation requirements (space, electrical, plumbing,
environmental) for the specified semiconductor manufacturing equipment.