semi合集-English.pdf - 第5785页
SEMI P23-0200 © SEMI 1993 , 2000 8 S u b C e ll De f e c t Po s i t i o n y1 x5 x4 x3 x2 x1 y3 y4 y2 50 u m 50 u m 25 0 u m 25 0 u m y5 Figure 3 Cell
SEMI P23-0200 © SEMI 1993, 20007
Cel l
QPONMLKJIHGFEDCBA
Defect T ype
01
02
03
04
05
06
07
08
09
10
11
12
13
14
15
16
17
18
19
20
Defect Number
0.75
0.70
0.65
0.60
0.55
0.50
0.45
0.40
0.30
0.35
0.20
0.25
0.15
0.10
0.05
0.80
0.90
1.00
0.85
0.95
Defect Design Size (um)
250 um
4,250 um (Wiring)
250 um
5,000 um
3,500 um (Contact Hole)
Figure 2
Chip
Wiring Chip; A to Q (#340 cell)
Contact Hole Chip; A to N (#280 cell)
SEMI P23-0200 © SEMI 1993, 2000 8
Sub Cell
Defect Position
y1
x5x4x3x2x1
y3
y4
y2
50 u m
50 u m
250 um
250 um
y5
Figure 3
Cell
SEMI P23-0200 © SEMI 1993, 20009
y1
x5x4x3x2x1
y3
y4
y2
50 um
50 um
250 um
250 um
y5
Figure 4
Cell
Wiring Standard Pattern