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SEMI E25-92 © SEMI 1992, 2004 2 4.3 Outboar d Plane — The outboard surface shoul d be limited to non-rigid lines. To minimize potential mechanical damage, chemical utilities sh ould not enter through the lower half of th…

SEMI E25-92 © SEMI 1992, 2004 1

SEMI E25-92 (Withdrawn 1104)

CLUSTER TOOL MODULE INTERFACE: MODULE ACCESS

GUIDELINE

This guideline was technically approved by the Global Physical Interfaces & Carriers Committee and is the

direct responsibility of the North American Physical Interfaces & Carriers Committee. Current edition

reapproved by the North American Regional Standards Committee on August 16, 2004. Initially available at

www.semi.org September 2004; to be published November 2004. Originally published in 1992; last

published June 1999.

Minor editorial changes were made to this document to conform to editorial guidelines.

NOTICE: This document was balloted and approved

for withdrawal in 2004.

1 Introduction

1.1 Scope — This guideline specifies an envelope

within which a cluster tool module is situated. Entry

and exit locations through the envelope and connection

locations to the module for utilities and facility services

are recommended.

1.2 Purpose — The purpose of the cluster tool module

access guideline is to provide assistance in the place-

ment of utilities and facility services to cluster tool

modules in order to improve access for maintenance

and service and to simplify cluster tool installation.

1.3 Impact — This guideline recommends that equip-

ment designs limit the placement of utility lines and

facility services to specific portions of the module

envelope.

1.4 Exceptions — Local safety regulations must always

take precedence over this guideline. Local conditions

may justify exceptions to this guideline.

NOTICE: This standard does not purport to address

safety issues, if any, associated with its use. It is the

responsibility of the user of this standard to establish

appropriate safety and health practices and determine

the applicability of regulatory or other limitations prior

to use.

2 Referenced Documents

2.1 SEMI Documents

SEMI E20 — Cluster Tool Module Interface: Electrical

Power and Emergency Off Standard

SEMI E21 — Cluster Tool Module Interface:

Mechanical Interface and Wafer Transport Standard

SEMI E24 — Cluster Tool Module Interface: Isolation

Valve Interlocks Standard

SEMI S2 — Safety Guidelines for Semiconductor

Manufacturing Equipment

NOTICE: Unless otherwise indicated, all documents

cited shall be the latest published versions.

3 Module Envelope

3.1 For the purpose of this guideline, the module enve-

lope is taken to be a set of six surfaces that completely

encloses a module. Individual module envelopes may

contact but not penetrate adjacent module envelopes.

The six surfaces are the inboard and outboard planes,

the two sides, the bottom and the top.

3.2 The inboard plane is the interface plane between a

transport module and any other module as defined in

SEMI E21; thus, a transport module possesses multiple

inboard planes. The outboard surface is parallel to the

interface plane and normally coincides with that part of

the module which is farthest from the interface plane.

Each side of the module envelope consists of several

vertical planes. The bottom surface generally coincides

with the floor, and the top is a horizontal plane that con-

tains the highest point of the module.

3.3 In the sections that follow, the distinction between

the physical module and the space reserved for the

module within the envelope must be kept in mind. Sec-

tion 4 refers to where utility lines penetrate the enve-

lope, and Section 5 refers to constraints on where these

lines connect to the physical module.

4 Allocation of Module Envelope Surfaces

4.1 The allocation of surfaces is subject to the need for

access to the interface plane, module movement, main-

tenance access space, and protection of module compo-

nents (particularly electrical components) from liquid

leaks.

4.2 Inboard Plane — To allow access to the isolation

valve(s), no utilities or facility services should be rout-

ed through the inboard surface close to the valve

boundary. ( See SEMI E21) The inboard surface is pre-

ferred for intra-tool communications, EMO (see SEMI

E20) and the interlock interface between the transport

module and the attached modules. (See SEMI E24.)

SEMI E25-92 © SEMI 1992, 2004 2

4.3 Outboard Plane — The outboard surface should be

limited to non-rigid lines. To minimize potential

mechanical damage, chemical utilities should not enter

through the lower half of this surface.

4.4 Sides — In order to facilitate maintenance access,

utilities and facility services should not penetrate the

module envelope sides.

4.5 Top Surface — The top surface is preferred for

power, exhaust, process gases and make-up air.

Communications and electronic control harnesses could

also enter through this surface.

4.6 Bottom Surface — The bottom surface is preferred

for vacuum lines and all liquid supplies, returns and

drains. The location of all lines should not restrict the

removal of the module.

5 Module Considerations

5.1 The locations of utility and facility lines and

connections to the module, which is located within the

module envelope, are given below.

5.2 Exhaust, Vacuum and Make-up Air — The size of

piping for exhaust, vacuum and make-up air suggests

that the module sides are undesirable locations for

connections.

5.3 Maintenance Access — Utility and facility lines

and connections to the module sides should not com-

promise maintenance access to the module. Connect-

ions should be located above or below areas requiring

periodic maintenance access.

5.4 Liquids — Liquid supply connections to the

module sides should be as low as practical.

5.5 Electrical Components — Electrical components

that need to be accessible for maintenance while

energized should not be located at the sides of the

module. (See SEMI S2.)

5.6 Remote Equipment — For ease of maintenance

access, some pieces of equipment (for example, coolant

chiller and RF power supplies) may be located outside

the module envelope. In such cases, the lines and

connections between the remote equipment and the

module should follow this guideline.

6 Examples

6.1 The relationship between the location of specific

utility and facility lines entering the module envelope

and their subsequent routing and connection to the

module within the module envelope is illustrated by the

following examples.

6.2 Liquid Connections — Two suggested methods of

providing liquid connections are shown in Figures 1

and 2. The liquid lines enter through the bottom of the

module envelope (see Section 4.5) then connect to

either the side of the module or the bottom of the

module (see Section 5.3).

6.3 Gas Connections — Two suggested methods of

providing gas connections are shown in Figure 2. The

gas lines pass through the top of the module envelope

(see Section 4.4), and then connect to the module either

at the top or at the side.

6.4 Exhaust and/or Make-Up Air — Two suggested

methods of providing exhaust and/or make-up air

connections are shown in Figure 2. The exhaust line

passes through the top of the module envelope (see

Section 4.4) and then connects to the module at or near

the top. Exhaust and make-up air connections are

flanged in Figure 2.

Figure 1

Figure 2

7 Related Documents

7.1 SEMI Documents

SEMI E6 — SEMI Facilities Interface Specifications

Guideline and Format