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SEMI F5-1101 © SEMI 1990 , 2001 2 4 Referenced Stand ards 4.1 SEMI Standards SEMI S2 — Enviro nmental, Health, and Sa fety Guide line for Se mico nduc tor Manufa ctur ing E quip ment SEMI S5 — Safety Guideline f or Flo w…

SEMI F5-1101 © SEMI 1990, 20011

SEMI F5-1101

GUIDE FOR GASEOUS EFFLUENT HANDLING

This guide was technically approved by the Global Environmental Health & Safety Committee and is the

direct responsibility of the North American Environmental Health & Safety Committee. Current edition

approved by the North American Regional Standards Committee on August 27, 2001. Initially available at

www.semi.org September 2001; to be published November 2001. Originally published in 1990.

NOTICE: This document, as balloted, is intended to

replace SEMI F5-90 in its entirety.

NOTICE: Paragraphs entitled “NOTE” are not an

official part of this guide and are not intended to modify

or supersede the official guide. These have been

supplied by the Task Force to enhance usage of the

guide.

1 Purpose

1.1 The purpose of this guide is to provide the

semiconductor industry with the general knowledge and

background information for understanding the

principles of exhaust systems.

1.2 It includes suggestions for layout and selection as

well as application of appropriate methods and

equipment for abating emissions.

1.3 This guide is intended for use in abatement

selection for both gaseous and particulate contaminant

materials potentially emitted from semiconductor

manufacturing facilities.

2 Scope

2.1 Applicability — This guide presents a review and

evaluation of available information including:

• Chemical and physical properties of chemical

compounds and elements, that are, or may be,

released from semiconductor manufacturing

operations,

• Some current industry practices for separating

exhaust systems for different groups of materials,

• Potential methods for abating emissions of gaseous

and particulate contaminants exhausted from

semiconductor manufacturing operations at “End-

of-Pipe”,

• Potential methods for abating emissions of gaseous

and particulate contaminants exhausted from

semiconductor manufacturing processes at “Point-

of-Use” and reasons why they should be used for

some processes,

• Standard industry methods of recovery,

replacement, and “usage reduction” for minimizing

release of materials.

2.2 Contents — This document contains the following

sections:

1. Purpose

2. Scope

3. Limitations

4. Referenced Standards

5. Terminology

6. Philosophy

7. Classification of Emissions

8. End-of-Pipe Abatement Technologies

9. Point-of-Use (POU) Abatement Technologies

10. Provisions for Emergency Release

11. Summary Table

12. Alternative Approaches

13. Related Documents

Appendix 1 — End-of-Pipe Abatement Design

Appendix 2 — POU Abatement Technology Types

2.3 This guide does not purport to address all of the

safety issues associated with its use. It is the

responsibility of the users of this guide to establish

appropriate safety and health practices and determine

the applicability of regulatory limitations prior to use.

3 Limitations

3.1 This guide makes only a few recommendations

regarding the fire protection aspects of exhaust systems.

Additional

recommendations on the risk assessment of

systems, compatibility of materials, and the potential

need for use of non-combustible materials or the fitting

of fire detectors, sprinklers etc., are within the scope of

other documents.

3.2 Methods for treating solid or liquid waste (created

by emission abatement processes) and methods for

recovery of gases are not discussed in this document.

SEMI F5-1101 © SEMI 1990, 2001 2

4 Referenced Standards

4.1 SEMI Standards

SEMI S2 — Environmental, Health, and Safety

Guideline for Semiconductor Manufacturing Equipment

SEMI S5 — Safety Guideline for Flow Limiting

Devices

SEMI S8 — Safety Guidelines for Ergonomics

Engineering of Semiconductor Manufacturing

Equipment

4.2 Code of Federal Regulations — United States

Environmental Protection Agency

40 CFR Part 63 (Clean Air Act 112 (b)(1))

4.3 Uniform Codes

Uniform Fire Code — Article 80 — Hazardous

Material

NOTE 1: Unless otherwise indicated, all documents cited

shall be the latest published versions.

5 Terminology

5.1 Abbreviations and Acronyms

5.1.1 CVD — Chemical Vapor Deposition

5.1.2 EPI — epitaxial deposition

5.1.3 HAP — Hazardous Air Pollutants [as defined by

40 CFR Part 63 (Clean Air Act 112 (b)(1))

5.1.4 PFC — perfluorocompounds

5.1.5 POU — Point of use

5.1.6 VOC — Volatile Organic Compounds

5.2 Definitions

5.2.1 classification of emissions — understanding the

composition of process exhausts.

5.2.2 efficiency — the ratio (or fraction or proportion)

of removed chemical species to its input amount

5.2.3 End-of-Pipe Abatement — abatement

technologies that can be fitted at the discharge point of

the exhaust system.

5.2.4 flow capacity — the maximum flow any specific

equipment can handle.

5.2.5 occupational exposure limits (OELs) — for the

purpose of this document, OELs are generally

established on the basis of an eight-hour workday.

1 United States Government Code of Federal Regulations, free from

the web site at http://www.epa.gov

2 International Conference of Building Officials (ICBO), 5360

Workman Mill Road, Whittier, CA 90601-2298

Various terms are used to refer to OELs, such as

permissible exposure levels, Threshold Limit Values®,

maximum acceptable concentrations, maximum

exposure limits, and occupational exposure standards.

However, the criteria used in determining OELs can

differ among the various countries that have established

values. Refer to the national bodies responsible for the

establishment of OELs. (Threshold Limit Value is a

registered trademark of the American Conference of

Governmental Industrial Hygienists.)

5.2.6 Point-of-Use Abatement — abatement

technologies that can be fitted at the point of discharge

of the gaseous emission from semiconductor process

equipment. These devices are also called exhaust

conditioners.

5.2.7 removal capacity — amount of a species which

can be removed.

5.2.8 usage reduction — reducing the total volume of

process chemicals requiring abatement.

6 Philosophy

6.1 Gaseous mixtures potentially emitted from

numerous processes could also produce hazards within

exhaust ducts.

6.2 With increasing legal requirements worldwide on

both worker safety and general environmental

protection, more effective exhaust management is

required.

6.3 This demands a detailed understanding of the

chemical and physical properties of the chemical

compounds being emitted from processes, and of the

conditions under which they are released.

6.4 Careful design of the abatement systems is required

to attain both high efficiency and maximum economy.

7 Classification of Emissions

7.1 The following fundamental points regarding

exhaust emissions should be considered:

• Exhaust contaminants might be solely the material

used in the process (e.g., isopropyl alcohol (IPA)

from a rinse chamber)

• In plasma and thermal chambers many reactions

occur, both those desired and others; therefore by-

products are also key components of exhaust

emissions.

• In theory, most possible combinations of the

elements in the input gases may be found as

compounds in the exhaust. In practice, the main

components will be the unused process gas (the

percentage consumed in the process varies, and

SEMI F5-1101 © SEMI 1990, 20013

may be as low as 10%). Additional by-products

will have different and sometimes more hazardous

properties.

7.2 Considerable research has been conducted into

various hazardous by-products of processes, from

explosive solids to organochlorine compounds with

mutagenic properties. (See Sections 13.1 through

13.3.)

7.3 In considering selection of exhaust systems and

abatement technology, it is essential to review all the

materials likely to be present in the exhaust.

7.4 Contributions from the materials on the wafer must

also be considered, as they often cause blocked

exhausts (e.g., aluminum etches produce aluminum

chloride (a by-product of removal of aluminum from

the wafer with chlorinated gases)).

7.5 Processes that produce specific hazardous by-

products should be evaluated for appropriate point-of-

use abatement technology before discharge to an

exhaust system.

7.6 Gaseous and particulate contaminants emitted from

semiconductor manufacturing can be divided

conveniently into nine major groups, each of which

might justify its own exhaust system.

7.6.1 Group-1 Acid — Easily hydrolyzable acids, (e.g.,

hydrogen chloride hydrolyzes into hydrochloric acid.)

7.6.2 Group-2 Acid aerosols (“difficult–to-scrub”) —

This group includes acids that generate aerosols and

that are not easily removed by simple water scrubbers

(e.g., aqua regia, sulfuric and nitric).

NOTE 2: High concentrations of easily soluble acids will also

fall into the “difficult-to-scrub” category.

7.6.3 Group-3 Ammonia — Exhaust streams

containing ammonia

7.6.4 Group-4 Volatile Organic Compounds (VOCs)

— Exhausts containing volatile organic compound

vapors or flammable gas discharge requiring

destruction.

7.6.5 Group-5 Pyrophoric — Exhausts containing

pyrophoric gases.

7.6.6 Group-6 Emergency Release Discharges —

Enclosures are provided with additional exhausts to

contain sudden unanticipated releases of gas from

cylinders, etc.

7.6.7 Group-7 Special/Direct — Additional exhausts

used to keep specific gases separate for recovery

purposes (e.g., hydrogen (H

) reclamation from EPI or

PFC reclamation from CVD tools, Oxides of Nitrogen

(NO

)).

7.6.8 Group-8 General Exhaust Systems without End-

of-Pipe Treatment — Exhaust of heat or post-treatment

exhaust from POU abatement systems.

7.6.9 Group-9 Highly Toxic Gas Exhaust — Highly

toxic gases especially those with poor warning

properties (e.g., arsine, phosphine, diborane, germane).

The end user has a primary responsibility to prevent

discharge of these gases above a regulated level (e.g.,

usually one-half (1/2) of Immediately Dangerous to

Life and Health (IDLH) levels).

NOTE 3: Facility exhaust systems may be called by a number

of different names such as: Acid, Corrosive, Ammonia,

Scrubbed, VOC, Solvent, Incinerated, Highly Toxic, Toxic,

Dedicated, Special, PFC, General, Heat, Treated, or others.

The actual facility exhaust system name, and what groups are

routed to each system, will vary by factory and by country.

7.7 The groups listed in Section 7.6 are not a definitive

division, but represent a summation of common

industry practice for separation. The division is based

on three basic principles:

• avoiding mixing of incompatible gases in the

exhaust,

• potential need for different end-of-pipe abatement

technologies, and,

• keeping materials separate for recovery.

7.8 The number of separate exhaust systems used is

entirely a decision for each facility, based on the

following:

• processes and chemicals used,

• the number of each type of process,

• whether recovery of gases is required,

• whether point-of-use (POU) abatement is installed,

and

• compatibility of emissions with each other or the

effluent handling system.

7.9 In theory, if POU abatement systems are fitted to

all sources of gaseous effluent all exhaust could then be

combined into a single exhaust system.

7.9.1 In practice most facilities operate a compromise

between the two extremes with two to four separate

exhaust systems and point-of-use abatement systems

fitted only to certain sources. The decision (as to which

combination to use) will often be based on economic

and space constraints.

7.9.2 Safety and environmental factors listed below,

should always be considered first when determining

specific gaseous sources that require POU abatement

systems.